公开(公告)号：US20120299202A1

公开(公告)日：2012-11-29

申请号：US13477524

申请日：2012-05-22

申请人： Atsushi YAMAGUCHI ,  Hideyuki TSUJIMURA ,  Hiroe KOWADA ,  Ryo KUWABARA ,  Naomichi OHASHI

发明人： Atsushi YAMAGUCHI ,  Hideyuki TSUJIMURA ,  Hiroe KOWADA ,  Ryo KUWABARA ,  Naomichi OHASHI

IPC分类号： H01L21/58 ,  H01L21/60 ,  H01L23/488

CPC分类号： H01L23/315 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2224/16238 ,  H01L2224/29017 ,  H01L2224/29035 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2224/9221 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/0665

摘要： A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity η1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity η2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30≦η2≦η1≦300 (Pa·s) and 3≦T2≦T1≦7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1≦S2.

摘要翻译： 一种半导体封装件的安装结构的制造方法，包括：在安装的半导体封装部件的外侧的基板上的位置处施加粘度1和触变指数T1的第一粘合剂; 在第一粘合剂上施加粘度为2和触变指数T2的第二粘合剂，使得第二粘合剂与半导体封装部件的外周部分接触; 并且通过随后的回流工艺形成所述硬化的第一粘合剂的第一粘合剂部分和所述硬化的第二粘合剂的第二粘合剂部分，其中所述第一和第二粘合剂满足30＆lt; 1＆nlE; 2＆nlE; 1＆nlE; 300（Pa· s和3＆nlE; T2＆nlE; T1＆nlE; 7，第一粘合部分的截面面积S1和第二粘合部分的截面面积S2相对于与基板的安装表面垂直的方向满足关系S1＆lt; lE; S2。

公开(公告)号：US20100032190A1

公开(公告)日：2010-02-11

申请号：US12535760

申请日：2009-08-05

申请人： Atsushi YAMAGUCHI ,  Koso MATSUNO ,  Ryo KUWABARA ,  Hiroe KOWADA ,  Kimiaki NAKAYA

发明人： Atsushi YAMAGUCHI ,  Koso MATSUNO ,  Ryo KUWABARA ,  Hiroe KOWADA ,  Kimiaki NAKAYA

IPC分类号： H05K7/20

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/75 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0203 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T428/24372 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A mounting structure formed by bonding the electrodes of a substantially planar electronic component to the electrodes provided on the mounting surface of a circuit board includes a sealing body 5 formed between one main surface of the electronic component and the circuit board and/or on the other main surface of the electronic component. The sealing body 5 is composed of a plurality of layers having different adhesive strengths and thermal conductivities, wherein a layer having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component and the circuit board, and a layer having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component and the circuit board.

摘要翻译： 通过将基本上平面的电子部件的电极接合到设置在电路基板的安装面上的电极而形成的安装结构包括形成在电子部件的一个主面和电路基板之间和/或另一个之间的密封体5 电子元件的主表面。 密封体5由具有不同粘合强度和导热性的多个层组成，其中具有相对较高粘合强度的层被布置在与电子部件和电路板中的任一个接触的区域中，并且 在与电子部件和电路基板没有接触的区域中布置具有较高热传导率的层。

公开(公告)号：US20100002401A1

公开(公告)日：2010-01-07

申请号：US12496017

申请日：2009-07-01

申请人： Hideyuki TSUJIMURA ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Hiroe KOWADA ,  Koso MATSUNO

发明人： Hideyuki TSUJIMURA ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Hiroe KOWADA ,  Koso MATSUNO

IPC分类号： H05K1/00 ,  H05K3/30

CPC分类号： H05K3/288 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0783 ,  H05K2203/1322 ,  Y10T29/49146 ,  H01L2224/0401

摘要： The electronic component packaging structure having, as the moisture-proof coating layer, a polymer material that has sufficient moisture-proof performance and can be relatively easily peeled off from a circuit board and/or electronic components when repairing can be provided.The electronic component packaging structure of the invention comprises a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or volubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.

摘要翻译： 作为防湿涂层的电子部件包装结构体可以提供具有充分的防潮性能并且在修理时可以相对容易地从电路板和/或电子部件剥离的聚合物材料。 本发明的电子部件封装结构包括电路板，安装在电路板上的电子部件和覆盖电子部件的防湿涂层。 防潮涂层由具有至少两层下层和上层的聚合物材料涂层构成，并且形成下层的聚合物材料对于所选择的修补溶剂具有较高的溶胀性和/或挥发性 与烃类溶剂相比，形成上层的聚合物材料。