公开(公告)号：US08540903B2

公开(公告)日：2013-09-24

申请号：US12744994

申请日：2008-11-21

申请人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

发明人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

IPC分类号： H01B1/02 ,  H01B1/22 ,  H01B1/12 ,  H05K3/20 ,  H05K3/30 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC分类号： H05K3/321 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49128 ,  Y10T29/4913

摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

摘要翻译： 公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部形成的导电路径中的空隙生长水平降低， 其含有减少量的粘度调节/触变性添加剂。 选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。

公开(公告)号：US20110095423A1

公开(公告)日：2011-04-28

申请号：US13000391

申请日：2009-10-27

申请人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

发明人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/49894 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105

摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.

摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块和第二电极之间的多个接合部件 第二电极，经由凸块将第一电极与第二电极电连接;以及多个加强树脂部件，分别位于接合部件周围，以至少覆盖接合部件和接合部件与凸块之间的接合区域。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。

公开(公告)号：US08664773B2

公开(公告)日：2014-03-04

申请号：US13477524

申请日：2012-05-22

申请人： Atsushi Yamaguchi ,  Hideyuki Tsujimura ,  Hiroe Kowada ,  Ryo Kuwabara ,  Naomichi Ohashi

发明人： Atsushi Yamaguchi ,  Hideyuki Tsujimura ,  Hiroe Kowada ,  Ryo Kuwabara ,  Naomichi Ohashi

IPC分类号： H01L21/58 ,  H01L21/60 ,  H01L23/488

CPC分类号： H01L23/315 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2224/16238 ,  H01L2224/29017 ,  H01L2224/29035 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2224/9221 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/0665

摘要： A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity η1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity η2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30≦η2≦η1≦300 (Pa·s) and 3≦T2≦T1≦7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1≦S2.

摘要翻译： 一种半导体封装件的安装结构的制造方法，包括：在安装的半导体封装部件的外侧的基板上的位置处施加粘度eta1和触变指数T1的第一粘合剂; 在第一粘合剂上施加具有粘度eta2和触变指数T2的第二粘合剂，使得第二粘合剂与半导体封装部件的外周部分接触; 并且通过随后的回流工艺形成所述硬化的第一粘合剂的第一粘合部分和所述硬化的第二粘合剂的第二粘合部分，其中所述第一和第二粘合剂满足30（Pa·s）和3 @ T2 @ T1 @ 7，第一粘合部分的截面面积S1和第二粘合部分相对于垂直于基板的安装表面的方向的截面面积S2满足关系S1 @ S2。

公开(公告)号：US20100101845A1

公开(公告)日：2010-04-29

申请号：US12605750

申请日：2009-10-26

申请人： Arata Kishi ,  Naomichi Ohashi ,  Atsushi Yamaguchi ,  Seiji Tokii ,  Masato Udaka

发明人： Arata Kishi ,  Naomichi Ohashi ,  Atsushi Yamaguchi ,  Seiji Tokii ,  Masato Udaka

IPC分类号： H05K1/02 ,  B23K31/02

CPC分类号： H05K3/3489 ,  B23K1/0016 ,  B23K1/203 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73104 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, an electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, junction reliability can be improved.

摘要翻译： 一种电子器件制造方法，包括：在第一电路组件的电极上设置焊料; 在第二电路组件的一个表面上设置具有磁通作用的树脂，以便完全覆盖形成在第二电路组件的一个表面上的焊料凸块; 通过树脂将第二电路组件设置在第一电路组件上，使得设置在第一电路组件的电极上的焊料材料和第二电路组件的焊料凸块彼此接触; 并且将热能施加到焊料材料和焊料凸块之间的连接部分和树脂上。 通过进行这些处理，制造其中第一电路组件和第二电路组件接合在一起并且其接合部分被树脂密封的电子设备。 结果，在电子设备中，可以提高结点的可靠性。

公开(公告)号：US20090269598A1

公开(公告)日：2009-10-29

申请号：US12427275

申请日：2009-04-21

申请人： Naomichi OHASHI ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Arata KISHI ,  Takayuki HIGUCHI

发明人： Naomichi OHASHI ,  Hidenori MIYAKAWA ,  Atsushi YAMAGUCHI ,  Arata KISHI ,  Takayuki HIGUCHI

IPC分类号： H01B1/22 ,  B32B15/08

CPC分类号： H01B1/22 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/3484 ,  H05K2201/0272 ,  Y10T428/31681 ,  H01L2224/05599

摘要： A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.

摘要翻译： 导电浆料包括填料组分和助熔剂组分; 所述填充剂组分包括具有不同熔点的第一导电填料和第二导电填料，并且所述第一导电填料的熔点高于所述第二导电填料的熔点20℃或更高; 所述通量成分包括具有不同熔点的第一助熔剂和第二助熔剂，所述第一焊剂的熔点高于所述第二焊剂的熔点，所述第一焊剂的熔点高于所述熔点 第二导电填料15℃至45℃。 并且第二通量的熔点等于或小于第二导电填料的熔点。

公开(公告)号：US09331047B2

公开(公告)日：2016-05-03

申请号：US14092407

申请日：2013-11-27

申请人： Naomichi Ohashi ,  Atsushi Yamaguchi ,  Arata Kishi ,  Masato Udaka ,  Seiji Tokii

发明人： Naomichi Ohashi ,  Atsushi Yamaguchi ,  Arata Kishi ,  Masato Udaka ,  Seiji Tokii

IPC分类号： H01L21/00 ,  H01L23/00 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/305 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/0545 ,  H05K2203/1476 ,  Y02P70/613

摘要： A semiconductor package component (3) is mounted on a substrate (1) in such a manner that an electrode (2) of the substrate (1) and an electrode of the semiconductor package component (3) are brought into contact with each other through a joining material (4). A reinforcing adhesive (5c) is applied between the substrate (1) and the outer surface of the semiconductor package component (3). Then, reflow is performed to melt the joining metal (4) with the reinforcing adhesive (5c) uncured. After the reinforcing adhesive (5c) is cured, the joining metal (4) is solidified.

摘要翻译： 半导体封装部件（3）以这样的方式安装在基板（1）上，使得基板（1）的电极（2）和半导体封装部件（3）的电极彼此接触通过 接合材料（4）。 在基板（1）和半导体封装件（3）的外表面之间施加增强粘合剂（5c）。 然后，进行回流，使加固用粘合剂（5c）未熔融而熔融接合金属（4）。 在增强粘合剂（5c）固化之后，使接合金属（4）固化。

公开(公告)号：US08940198B2

公开(公告)日：2015-01-27

申请号：US13240043

申请日：2011-09-22

申请人： Arata Kishi ,  Naomichi Ohashi ,  Atsushi Yamaguchi

发明人： Arata Kishi ,  Naomichi Ohashi ,  Atsushi Yamaguchi

IPC分类号： H01B1/02 ,  C09J9/02 ,  C09J11/04 ,  H05K3/32 ,  H01L23/00 ,  C08K3/08 ,  H05K3/12 ,  H05K3/40 ,  H01L23/498 ,  H01L21/48 ,  C08K5/09

CPC分类号： C09J9/02 ,  C08K3/08 ,  C08K5/09 ,  C09J11/04 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/1329 ,  H01L2224/13313 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/8122 ,  H01L2224/81874 ,  H01L2924/00013 ,  H01L2924/15787 ,  H05K3/12 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0272 ,  H05K2203/0425 ,  H01L2924/0105 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00014 ,  H01L2924/00

摘要： A conductive adhesive includes 10 to 90 wt % of Sn—Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn—Bi system solder powder is composed of solder particles having a particle size L1 of 20 to 30 μm and solder particles having a particle size L2 of 8 to 12 μm, and a mixing ratio of the Sn—Bi system solder powder is such that the solder particles having a particle size of 20 to 30 μm occupy 40 to 90 wt % with respect to the whole solder powder, and the remainder is occupied by solder particles having a particle size of 8 to 12 μm.

摘要翻译： 导电性粘合剂包含10〜90重量％的Sn-Bi系焊料粉末和剩余的含有机酸的粘合剂，Sn-Bi系焊料粉末由粒径为20〜30μm的焊料粒子构成， 粒径为8〜12μm的焊料粒子和Sn-Bi系焊料粉末的混合比例使得粒径为20〜30μm的焊料粒子相对于粒子的粒径为40〜90重量％ 整个焊料粉末，其余部分被粒径为8至12μm的焊料颗粒所占据。

公开(公告)号：US20140049930A1

公开(公告)日：2014-02-20

申请号：US14007808

申请日：2012-04-02

申请人： Atsushi Yamaguchi ,  Hisahiko Yoshida ,  Arata Kishi ,  Naomichi Ohashi

发明人： Atsushi Yamaguchi ,  Hisahiko Yoshida ,  Arata Kishi ,  Naomichi Ohashi

IPC分类号： H05K13/04 ,  H05K1/18

CPC分类号： H05K13/0465 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13111 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/8149 ,  H01L2224/8159 ,  H01L2224/81613 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81885 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19105 ,  H01L2924/20106 ,  H01L2924/351 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10977 ,  H05K2203/047 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/0665

摘要： In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217° C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other.

摘要翻译： 在通过使用具有低熔点的焊料将第一安装基板接合到第二基板的情况下，在第二基板上安装半导体元件被焊料界定的第一安装基板的情况下，连接强度变低。 一种安装结构，其中通过使用熔点为217℃或更高的第一焊料将半导体元件接合在其上的第一安装基板安装在第二基板上，包括多个接合部分接合第一安装基板 到第二基板; 以及形成在所述接合部周围的加强部件。 每个接合部分包含熔点低于第一焊料的熔点的第二焊料，并且在彼此相邻的接合部分之间存在不存在增强部件的空间。

公开(公告)号：US20120299202A1

公开(公告)日：2012-11-29

申请号：US13477524

申请日：2012-05-22

申请人： Atsushi YAMAGUCHI ,  Hideyuki TSUJIMURA ,  Hiroe KOWADA ,  Ryo KUWABARA ,  Naomichi OHASHI

发明人： Atsushi YAMAGUCHI ,  Hideyuki TSUJIMURA ,  Hiroe KOWADA ,  Ryo KUWABARA ,  Naomichi OHASHI

IPC分类号： H01L21/58 ,  H01L21/60 ,  H01L23/488

CPC分类号： H01L23/315 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2224/16238 ,  H01L2224/29017 ,  H01L2224/29035 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2224/9221 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/0665

摘要： A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity η1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity η2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30≦η2≦η1≦300 (Pa·s) and 3≦T2≦T1≦7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1≦S2.

摘要翻译： 一种半导体封装件的安装结构的制造方法，包括：在安装的半导体封装部件的外侧的基板上的位置处施加粘度1和触变指数T1的第一粘合剂; 在第一粘合剂上施加粘度为2和触变指数T2的第二粘合剂，使得第二粘合剂与半导体封装部件的外周部分接触; 并且通过随后的回流工艺形成所述硬化的第一粘合剂的第一粘合剂部分和所述硬化的第二粘合剂的第二粘合剂部分，其中所述第一和第二粘合剂满足30＆lt; 1＆nlE; 2＆nlE; 1＆nlE; 300（Pa· s和3＆nlE; T2＆nlE; T1＆nlE; 7，第一粘合部分的截面面积S1和第二粘合部分的截面面积S2相对于与基板的安装表面垂直的方向满足关系S1＆lt; lE; S2。

公开(公告)号：US20110049439A1

公开(公告)日：2011-03-03

申请号：US12744994

申请日：2008-11-21

申请人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

发明人： Takayuki Higuchi ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Arata Kishi ,  Naomichi Ohashi

IPC分类号： H01B1/22 ,  H05K3/30

CPC分类号： H05K3/321 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49128 ,  Y10T29/4913

摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

摘要翻译： 公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部中形成的导电路径中的空隙生长水平降低， 其含有减少量的粘度调节/触变性添加剂。 选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。