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公开(公告)号：US10913202B2
公开(公告)日：2021-02-09
申请号：US15559423
申请日：2016-03-14
Inventor： David Espalin , Eric MacDonald , Ryan B. Wicker
IPC: B29C64/118 , B33Y10/00 , B29C70/70 , B29C64/209 , B29C64/336 , B29C64/165 , B33Y30/00
Abstract: Methods, systems, and devices for the manufacture of 3D printed components with structurally integrated metal objects using an additive manufacturing system enhanced with a range of possible secondary embedding processes. One or more layers of a three-dimensional substrate can be created by depositing a substrate, and then one or more 3D printed components can be configured on the substrate with one or more metal objects using additive manufacturing enhanced by one or more secondary embedding processes.
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公开(公告)号：US10691095B2
公开(公告)日：2020-06-23
申请号：US15497278
申请日：2017-04-26
Inventor： Chi Yen Kim , David Espalin , Eric MacDonald , Ryan Wicker
IPC: G05B19/048 , B33Y50/02 , B29C64/386 , B29C64/118 , B29C64/209 , B29C64/321 , G05B19/042
Abstract: Methods and systems for diagnosing and controlling material deposition during a material extrusion 3D printing process. A current sensor can measure a current signal consumed by a material feed motor. The current signal can be analyzed in the time domain and frequency domain to detect material deposition characteristics and prescribe process parameter changes.
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公开(公告)号：US09908037B2
公开(公告)日：2018-03-06
申请号：US14327663
申请日：2014-07-10
Inventor： Danny W. Muse , Ryan Wicker , Eric MacDonald , Rodolfo Salas , Francisco Medina
CPC classification number: A63F9/0415 , A63F9/0468 , A63F2009/0497 , A63F2009/2447 , A63F2009/2454 , Y10T29/49146
Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.
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公开(公告)号：US20170315526A1
公开(公告)日：2017-11-02
申请号：US15497278
申请日：2017-04-26
Inventor： Chi Yen Kim , David Espalin , Eric MacDonald , Ryan Wicker
IPC: G05B19/048 , B33Y50/02 , B29K105/00
CPC classification number: G05B19/048 , B29C64/118 , B29C64/209 , B29C64/321 , B29C64/386 , B33Y50/02 , G05B19/0428 , G05B2219/49023
Abstract: Methods and systems for diagnosing and controlling material deposition during a material extrusion 3D printing process. A current sensor can measure a current signal consumed by a material feed motor. The current signal can be analyzed in the time domain and frequency domain to detect material deposition characteristics and prescribe process parameter changes.
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公开(公告)号：US20150014923A1
公开(公告)日：2015-01-15
申请号：US14327663
申请日：2014-07-10
Inventor： Danny W. Muse , Ryan Wicker , Eric MacDonald , Rodolfo Salas , Francisco Medina
IPC: A63F9/04
CPC classification number: A63F9/0415 , A63F9/0468 , A63F2009/0497 , A63F2009/2447 , A63F2009/2454 , Y10T29/49146
Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.
Abstract translation: 电子游戏模具包括外壳，柔性基板，多个发光二极管，传感器，处理器和电池。 外壳具有N侧，其中N等于或大于4.柔性基板折叠成N侧并且配合到外壳的内部，其中每侧具有内表面和外表面，并且被分配为从1到 发光二极管设置在柔性基板的每一侧的外表面上，其中发光二极管的数量等于分配给柔性基板一侧的整数。 传感器，处理器和电池设置在柔性基板的一个内表面上。
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Patent Agency Ranking
6.发明授权公开(公告)号：US10974499B2
公开(公告)日：2021-04-13
申请号：US16595144
申请日：2019-10-07
Inventor： Eric MacDonald , Ryan Wicker , David Espalin
IPC: B29C41/20 , B29C41/22 , B29C70/68 , B29C70/88 , B33Y80/00 , B33Y10/00 , B29C64/106 , B29C70/70 , B29C64/118 , B29C64/112 , B29K105/20 , B29K705/00 , B29L9/00 , B29L31/34
Abstract: A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.
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公开(公告)号：US10582619B2
公开(公告)日：2020-03-03
申请号：US15244061
申请日：2016-08-23
Inventor： David Espalin , Daniel Marquez , Alfonso Fernandez , Chiyen Kim , Eric MacDonald , Ryan Wicker
Abstract: An apparatus, system, and method for automatically dispensing and embedding components into three-dimensional parts. In an example embodiment, a direct wire embedding head can be fixed on an automation motion system. The direct wire embedding head begins and terminates an embedded wire pattern on a layer or on a surface of a three-dimensional part in order to automatically create the embedded wire pattern. A sensor is located on an embedding surface wherein the embedded wire pattern is embedded. The sensor can measure the distance between the direct wire embedding head and the embedding surface. A predefined distance can be maintained to ensure successful embedding results for the embedded wire pattern by automatically adjusting a position of the direct wire embedding head in response to feedback from the sensor.
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公开(公告)号：US20180140941A1
公开(公告)日：2018-05-24
申请号：US15876084
申请日：2018-01-19
Inventor： Danny W. Muse , Ryan Wicker , Eric MacDonald , Rodolfo Salas , Francisco Medina
CPC classification number: A63F9/0415 , A63F9/0468 , A63F2009/0497 , A63F2009/2447 , A63F2009/2454 , Y10T29/49146
Abstract: An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.
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公开(公告)号：US20180043618A1
公开(公告)日：2018-02-15
申请号：US15555468
申请日：2016-02-29
Inventor： Corey Shemelya , David Espalin , Eric MacDonald , Ryan Wicker
IPC: B29C64/314 , B33Y70/00 , B33Y30/00 , B29C64/112 , B33Y10/00
CPC classification number: B29C64/314 , B29C64/00 , B29C64/112 , B29C70/82 , B29C70/88 , B29C70/885 , B29K2069/00 , B29K2705/10 , B33Y10/00 , B33Y30/00 , B33Y70/00 , B33Y80/00 , H05K3/4664
Abstract: An embedded material and an embedding apparatus and method. A compatible solute can be dissolved in a solvent. The object to be embedded can be coated with the solvent/plastic solution using, for example, addition and/or condensation polymerization. The solvent can be removed. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the aid of ultrasonic embedding, thermal energy, joule heating, and/or the use of adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the addition of ultrasonic embedding, thermal energy, joule heating, and/or adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate.
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10.发明申请公开(公告)号：US20170225273A1
公开(公告)日：2017-08-10
申请号：US15426379
申请日：2017-02-07
Inventor： Eric MacDonald , David Espalin , Ryan Wicker
IPC: B23K31/02 , B23K20/10 , B33Y10/00 , B33Y40/00 , H05K3/34 , B33Y70/00 , B29C70/78 , B29C70/88 , H05K1/02 , H05K3/46 , B23K20/00 , B33Y80/00
CPC classification number: H05K3/34 , B23K2101/36 , B29C39/10 , B29C64/106 , B29C70/885 , B29K2705/00 , B33Y10/00 , B33Y40/00 , B33Y70/00 , B33Y80/00 , H01L2224/48091 , H05K1/0284 , H05K3/4046 , H05K3/4644 , H05K3/4664 , H05K3/4697 , H05K2201/09036 , H05K2201/10287 , H05K2203/0285 , H05K2203/049 , H01L2924/00014
Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.
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