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    Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
    1.
    发明申请
    Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same 有权
    包括延伸在其中的导电引线的半导体发光器件安装基板及其封装方法

    公开(公告)号：US20060157726A1

    公开(公告)日：2006-07-20

    申请号：US11035716

    申请日：2005-01-14

    申请人： Ban Loh ,  Gerald Negley ,  Yankun Fu

    发明人： Ban Loh ,  Gerald Negley ,  Yankun Fu

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.

    摘要翻译： 用于半导体发光器件的安装衬底包括导热安装块。 安装块在其第一面中具有被构造成在其中安装半导体发光器件并且将由其中安装的半导体发光器件发射的光反射离开空腔的空腔。 插入安装块的导电引线延伸到空腔中。 导电引线与安装块电隔离，并且在空腔中具有暴露的接触部分。 导电引线可以是多个导电引线，每个导电引线在空腔中的不同位置具有暴露的接触部分。 也可以提供相关的包装方法。

    Solid colloidal dispersions for backlighting of liquid crystal displays
    2.
    发明申请
    Solid colloidal dispersions for backlighting of liquid crystal displays 有权
    用于液晶显示器背光的固体胶体分散体

    公开(公告)号：US20060152651A1

    公开(公告)日：2006-07-13

    申请号：US11034240

    申请日：2005-01-12

    申请人： Gerald Negley ,  Antony van de Ven ,  Ban Loh

    发明人： Gerald Negley ,  Antony van de Ven ,  Ban Loh

    IPC分类号： G02F1/1335

    CPC分类号： G02B5/0247 ,  G02F1/133606

    摘要： A display panel for a flat panel display includes an array of LCD devices and an array of LED devices that are configured to radiate light in a light path that impinges on the array of LCD devices, to provide backlighting on the array of LCD devices. A solid colloidal dispersion of particles of a first material having a first index of refraction dispersed in a second material having a second index of refraction, such as a solid foam structure, is provided in the light path to reduce spatial non-uniformity of the backlighting.

    摘要翻译： 用于平板显示器的显示面板包括一组LCD装置和一组LED装置，其被配置为在照射在LCD装置阵列上的光路中辐射光，以在LCD装置阵列上提供背光。 在光路中提供具有分散在具有第二折射率的第二材料（例如固体泡沫结构）中的具有第一折射率的第一材料的颗粒的固体胶体分散体，以减少背光的空间不均匀性 。

    Composite optical lens with an integrated reflector
    3.
    发明申请
    Composite optical lens with an integrated reflector 有权
    具有集成反射镜的复合光学透镜

    公开(公告)号：US20050270666A1

    公开(公告)日：2005-12-08

    申请号：US10861639

    申请日：2004-06-04

    申请人： Ban Loh ,  Gerald Negley

    发明人： Ban Loh ,  Gerald Negley

    IPC分类号： G02B3/00 ,  G02B17/00 ,  G02B17/08 ,  G02B27/14 ,  H01L33/58

    CPC分类号： G02B3/00 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A composite optical lens is disclosed. The composite optical lens includes a concave bottom surface adapted to receive light, reflective surface adapted to reflect the received light, and optical surface through which the reflected light leaves the optical lens. The concave bottom surface defines a concave cavity allowing placement of at least a portion of a light emitting device within the concave cavity. The concave bottom surface, the optical surface, or both may have predetermined optical finish to operate on the light such as diffusing or focusing the light. The reflective surface can be coated, designed, or both for total internal reflection effect.

    摘要翻译： 公开了一种复合光学透镜。 复合光学透镜包括适于接收光的凹底表面，适于反射接收的光的反射表面以及反射光通过该表面离开光学透镜的光学表面。 凹形底表面限定了凹腔，其允许在凹腔内放置发光器件的至少一部分。 凹底面，光学表面或两者可以具有预定的光学光洁度以在光上操作，例如漫射或聚焦光。 反射表面可以被涂覆，设计或两者用于全内反射效果。

    Power light emitting die package with reflecting lens and the method of making the same
    4.
    发明申请
    Power light emitting die package with reflecting lens and the method of making the same 有权
    具有反射镜的功率发光管芯封装及其制造方法

    公开(公告)号：US20050269587A1

    公开(公告)日：2005-12-08

    申请号：US10861929

    申请日：2004-06-04

    申请人： Ban Loh ,  Gerald Negley

    发明人： Ban Loh ,  Gerald Negley

    IPC分类号： H01C20060101 ,  H01L21/00 ,  H01L33/48 ,  H01L33/58 ,  H01L33/64 ,  H01L33/00

    CPC分类号： H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

    摘要翻译： 公开了一种发光管芯封装及其制造方法。 模具封装包括引线框架，至少一个发光器件（LED），成型体和透镜。 引线框架包括多个引线并且具有顶侧和底侧。 引线框架的一部分限定了安装垫。 LED装置安装在安装垫上。 成型体与引线框架的一部分一体化并且在引线框架的顶侧上限定开口，围绕安装垫的开口。 成型体还包括在引线框的底侧上的闩锁。 透镜与成型体相连。 复合透镜用作反射器和成像工具，用于收集和引导由LED发射的光以获得期望的光谱和发光性能。

    Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
    6.
    发明申请
    Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same 有权
    用于半导体发光器件的固体金属块安装基板及其制造方法

    公开(公告)号：US20050051789A1

    公开(公告)日：2005-03-10

    申请号：US10659108

    申请日：2003-09-09

    申请人： Gerald Negley ,  Ban Loh

    发明人： Gerald Negley ,  Ban Loh

    IPC分类号： H01L33/48 ,  H01L29/22

    CPC分类号： H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A mounting substrate for a semiconductor light emitting device includes a solid metal block having a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. An insulating coating is provided in the cavity, and first and second spaced apart conductive traces are provided on the insulating coating in the cavity that are configured for connection to a semiconductor light emitting device. The mounting substrate may be fabricated by providing a solid aluminum block including a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. The solid aluminum block is oxidized to form an aluminum oxide coating thereon. The first and second spaced apart electrical traces are fabricated on the aluminum oxide coating in the cavity.

    摘要翻译： 用于半导体发光器件的安装基板包括其表面上具有用于将半导体发光器件安装在其中的腔体的固体金属块。 绝缘涂层设置在空腔中，并且第一和第二间隔开的导电迹线设置在空腔中的被配置为连接到半导体发光器件的绝缘涂层上。 可以通过提供一种固体铝块来制造安装基板，该固体铝块包括其表面中的腔体，其被构造用于在其中安装半导体发光器件。 将固体铝块氧化，在其上形成氧化铝涂层。 第一和第二间隔开的电迹线在空腔中的氧化铝涂层上制造。