Sandwich photoresist structure in photolithographic process
    1.
    发明授权
    Sandwich photoresist structure in photolithographic process 有权
    光刻工艺中的三明治光刻胶结构

    公开(公告)号:US06844143B2

    公开(公告)日:2005-01-18

    申请号:US10064649

    申请日:2002-08-02

    摘要: A photolithographic process that involves building a sandwich photoresist structure. A first photoresist layer is formed over a substrate. An anti-reflection layer is formed over the first photoresist layer. A second photoresist layer is formed over the anti-reflection layer. A first photo-exposure is conducted and the exposed second photoresist layer is developed to pattern the second photoresist layer and the anti-reflection layer. Using the second photoresist layer and the anti-reflection layer as a mask, a second photo-exposure and a second photoresist development are conducted to pattern the first photoresist layer.

    摘要翻译: 涉及建立夹心光刻胶结构的光刻工艺。 在衬底上形成第一光致抗蚀剂层。 在第一光致抗蚀剂层上形成防反射层。 在防反射层上形成第二光致抗蚀剂层。 进行第一次曝光并且曝光的第二光致抗蚀剂层被显影以对第二光致抗蚀剂层和抗反射层进行图案化。 使用第二光致抗蚀剂层和抗反射层作为掩模,进行第二光曝光和第二光致抗蚀剂显影以对第一光致抗蚀剂层进行图案化。

    Immersion lithography process and mask layer structure applied in the same
    2.
    发明申请
    Immersion lithography process and mask layer structure applied in the same 失效
    浸渍光刻工艺和掩模层结构应用于同一种

    公开(公告)号:US20050123863A1

    公开(公告)日:2005-06-09

    申请号:US10728135

    申请日:2003-12-03

    摘要: An immersion lithography process is described as follows. A photoresist layer and a protective layer are sequentially formed on a material layer, and then an immersion exposure step is performed to define an exposed portion and an unexposed portion in the photoresist layer. A solubilization step is conducted to solubilize the protective layer on the exposed portion of the photoresist layer, and then a development step is conducted to remove the exposed portion of the photoresist layer and the protective layer thereon. Since the photoresist layer is covered with the protective layer, the chemicals in the photoresist layer do not diffuse into the immersion liquid to cause contamination. The protective layer can be patterned simultaneously in the development step, and no extra step is required to remove the protective layer. Therefore, the whole lithography process is not complicated.

    摘要翻译: 浸没式光刻工艺描述如下。 光致抗蚀剂层和保护层依次形成在材料层上,然后进行浸没曝光步骤以限定光刻胶层中的曝光部分和未曝光部分。 进行溶解步骤以将保护层溶解在光致抗蚀剂层的暴露部分上,然后进行显影步骤以除去其上的光致抗蚀剂层和保护层的暴露部分。 由于光致抗蚀剂层被保护层覆盖,所以光致抗蚀剂层中的化学物质不会扩散到浸没液中以引起污染。 在显影步骤中可以同时形成保护层,并且不需要额外的步骤来除去保护层。 因此,整个光刻过程并不复杂。

    Methodology for implementing enhanced optical lithography for hole patterning in semiconductor fabrication
    3.
    发明授权
    Methodology for implementing enhanced optical lithography for hole patterning in semiconductor fabrication 有权
    实现半导体制造中孔图案化的增强型光刻技术的方法

    公开(公告)号:US08472005B2

    公开(公告)日:2013-06-25

    申请号:US11677693

    申请日:2007-02-22

    IPC分类号: G03B27/54

    CPC分类号: G03F7/70425 G03F7/701

    摘要: System and method for enhancing optical lithography methodology for hole patterning in semiconductor fabrication are described. In one embodiment, a photolithography system comprises an illumination system for conditioning light from a light source, the illumination system producing a three-pore illumination pattern; a reticle comprising at least a portion of a pattern to be imaged onto a substrate, wherein the three-pore illumination pattern produced by the illumination system is projected through the reticle; and a projection lens disposed between the reticle and the substrate.

    摘要翻译: 描述了用于增强半导体制造中的孔图案化的光学光刻方法的系统和方法。 在一个实施例中,光刻系统包括用于调节来自光源的光的照明系统,所述照明系统产生三孔照明图案; 包括至少一部分要成像到基底上的图案的掩模版,其中由照明系统产生的三孔照明图案通过掩模版投射; 以及设置在掩模版和基板之间的投影透镜。

    PATTERN FORMATION IN SEMICONDUCTOR FABRICATION
    4.
    发明申请
    PATTERN FORMATION IN SEMICONDUCTOR FABRICATION 有权
    半导体制造中的图案形成

    公开(公告)号:US20100109054A1

    公开(公告)日:2010-05-06

    申请号:US12650719

    申请日:2009-12-31

    摘要: Provided is a semiconductor device. The device includes a substrate having a photo acid generator (PAG) layer on the substrate. The PAG layer is exposed to radiation. A photoresist layer is formed on the exposed PAG layer. The exposed PAG layer generates an acid. The acid decomposes a portion of the formed photoresist layer. In one embodiment, the PAG layer includes organic BARC. The decomposed portion of the photoresist layer may be used as a masking element.

    摘要翻译: 提供一种半导体器件。 该器件包括在衬底上具有光酸产生器(PAG)层的衬底。 PAG层暴露于辐射。 在曝光的PAG层上形成光致抗蚀剂层。 暴露的PAG层产生酸。 酸分解形成的光致抗蚀剂层的一部分。 在一个实施例中,PAG层包括有机BARC。 光致抗蚀剂层的分解部分可以用作掩模元件。

    Methodology For Implementing Enhanced Optical Lithography For Hole Patterning In Semiconductor Fabrication
    5.
    发明申请
    Methodology For Implementing Enhanced Optical Lithography For Hole Patterning In Semiconductor Fabrication 有权
    在半导体制造中实现孔图案的增强光刻法的方法

    公开(公告)号:US20080204688A1

    公开(公告)日:2008-08-28

    申请号:US11677693

    申请日:2007-02-22

    IPC分类号: G03B27/54

    CPC分类号: G03F7/70425 G03F7/701

    摘要: System and method for enhancing optical lithography methodology for hole patterning in semiconductor fabrication are described. In one embodiment, a photolithography system comprises an illumination system for conditioning light from a light source, the illumination system producing a three-pore illumination pattern; a reticle comprising at least a portion of a pattern to be imaged onto a substrate, wherein the three-pore illumination pattern produced by the illumination system is projected through the reticle; and a projection lens disposed between the reticle and the substrate.

    摘要翻译: 描述了用于增强半导体制造中的孔图案化的光学光刻方法的系统和方法。 在一个实施例中,光刻系统包括用于调节来自光源的光的照明系统,所述照明系统产生三孔照明图案; 包括至少一部分要成像到基底上的图案的掩模版,其中由照明系统产生的三孔照明图案通过掩模版投射; 以及设置在掩模版和基板之间的投影透镜。

    METHOD FOR PATTERNING A PHOTOSENSITIVE LAYER
    6.
    发明申请
    METHOD FOR PATTERNING A PHOTOSENSITIVE LAYER 有权
    用于绘制感光层的方法

    公开(公告)号:US20120114872A1

    公开(公告)日:2012-05-10

    申请号:US13346917

    申请日:2012-01-10

    IPC分类号: B05D3/00 B05D5/00 B05D1/36

    CPC分类号: G03F7/405 G03F7/0035

    摘要: The method of patterning a photosensitive layer includes providing a substrate including a first layer formed thereon, treating the substrate including the first layer with cations, forming a first photosensitive layer over the first layer, patterning the first photosensitive layer to form a first pattern, treating the first pattern with cations, forming a second photosensitive layer over the treated first pattern, patterning the second photosensitive layer to form a second pattern, and processing the first layer using the first and second patterns as a mask.

    摘要翻译: 图案化感光层的方法包括提供包括其上形成的第一层的基板,用阳离子处理包括第一层的基板,在第一层上形成第一感光层,图案化第一感光层以形成第一图案,处理 具有阳离子的第一图案,在经处理的第一图案上形成第二感光层,图案化第二感光层以形成第二图案,并且使用第一图案和第二图案作为掩模来处理第一层。

    METHOD OF PATTERN FORMATION IN SEMICONDUCTOR FABRICATION
    8.
    发明申请
    METHOD OF PATTERN FORMATION IN SEMICONDUCTOR FABRICATION 有权
    半导体制造中图案形成的方法

    公开(公告)号:US20090053899A1

    公开(公告)日:2009-02-26

    申请号:US11841485

    申请日:2007-08-20

    IPC分类号: H01L21/311 G03C5/00

    摘要: Provided is a method of fabricating a semiconductor device. The method includes providing a substrate, forming a photo acid generator (PAG) layer on the substrate, exposing the PAG layer to radiation, and forming a photoresist layer on the exposed PAG layer. The exposed PAG layer generates an acid. The acid decomposes a portion of the formed photoresist layer. In one embodiment, the PAG layer includes organic BARC. The decomposed portion of the photoresist layer may be used as a masking element.

    摘要翻译: 提供一种制造半导体器件的方法。 该方法包括提供衬底,在衬底上形成光酸产生剂(PAG)层,将PAG层暴露于辐射,以及在曝光的PAG层上形成光致抗蚀剂层。 暴露的PAG层产生酸。 酸分解形成的光致抗蚀剂层的一部分。 在一个实施例中,PAG层包括有机BARC。 光致抗蚀剂层的分解部分可以用作掩模元件。