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1.发明授权Conductor interconnect with dendrites through film and method for producing same 失效导体通过薄膜与树突互连，以及用于制造它的方法公开(公告)号：US06256874B1
公开(公告)日：2001-07-10
申请号：US09315305
申请日：1999-05-20
IPC分类号： H05K336
CPC分类号： H05K3/325 , H05K3/4614 , H05K2201/0373 , H05K2201/09536 , H05K2201/10666 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165 , Y10T29/49194
摘要： A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.”
摘要翻译： 提供了一种用于连接电子电路封装中的两个导电层的方法，包括以下步骤：在第一导电层的选定区域上形成枝晶，在第二导电层的选定区域上形成枝晶，在第一导电层上施加环氧粘合剂材料 并且将第二导电层压缩附接到第一导电层，使得第一导电层上的枝晶与第二导电层上的枝晶接触。 还要求保护的是包括用于根据本发明制造的电互连的树突的电子电路封装。 本发明的替代实施例利用具有树突的中间表面金属代替“通孔”。
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公开(公告)号：US06739046B1
公开(公告)日：2004-05-25
申请号：US09576641
申请日：2000-05-22
IPC分类号： H05K302
CPC分类号： H01L24/81 , H01L21/4853 , H01L21/563 , H01L23/49811 , H01L2224/13144 , H01L2224/16225 , H01L2224/73203 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/351 , H05K3/325 , H05K2201/10734 , H05K2201/10977 , H05K2203/0307 , H05K2203/0723 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , H01L2924/00
摘要： A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a dielectric insulation material over the first conductive surface such that the dendrites are exposed through the insulation material to leave a substantially planar surface of exposed dendrites, and placing a second conductive surface on top of the exposed dendrites. The second conductive surface may be a surface metal, a chip bump array, or a ball grid array. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection and planarization manufactured in accordance with the present invention.
摘要翻译： 提供了一种用于连接电子电路封装中的两个导电表面的方法，包括以下步骤：在第一导电表面的选定区域上形成枝晶，在第一导电表面上施加介电绝缘材料，使得枝晶通过绝缘材料暴露于 留下暴露的树突的基本上平坦的表面，并将第二导电表面放置在暴露的树突上。 第二导电表面可以是表面金属，芯片凸块阵列或球栅阵列。 还要求保护的是包含用于根据本发明制造的电互连和平坦化的树突的电子电路封装。
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公开(公告)号：US06300575B1
公开(公告)日：2001-10-09
申请号：US08918084
申请日：1997-08-25
IPC分类号： H05K114
CPC分类号： H05K3/325 , H05K3/4614 , H05K2201/0373 , H05K2201/09536 , H05K2201/10666 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165 , Y10T29/49194
摘要： A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.”
摘要翻译： 提供了一种用于连接电子电路封装中的两个导电层的方法，包括以下步骤：在第一导电层的选定区域上形成枝晶，在第二导电层的选定区域上形成枝晶，在第一导电层上施加环氧粘合剂材料 并且将第二导电层压缩附接到第一导电层，使得第一导电层上的枝晶与第二导电层上的枝晶接触。 还要求保护的是包括用于根据本发明制造的电互连的树突的电子电路封装。 本发明的替代实施例利用具有树突的中间表面金属代替“通孔”。
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公开(公告)号：US06427323B2
公开(公告)日：2002-08-06
申请号：US09859690
申请日：2001-05-17
IPC分类号： H05K336
CPC分类号： H05K3/325 , H05K3/4614 , H05K2201/0373 , H05K2201/09536 , H05K2201/10666 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165 , Y10T29/49194
摘要： A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.”
摘要翻译： 提供了一种用于连接电子电路封装中的两个导电层的方法，包括以下步骤：在第一导电层的选定区域上形成枝晶，在第二导电层的选定区域上形成枝晶，在第一导电层上施加环氧粘合剂材料 并且将第二导电层压缩附接到第一导电层，使得第一导电层上的枝晶与第二导电层上的枝晶接触。 还要求保护的是包括用于根据本发明制造的电互连的树突的电子电路封装。 本发明的替代实施例利用具有树突的中间表面金属代替“通孔”。
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公开(公告)号：US5977642A
公开(公告)日：1999-11-02
申请号：US918085
申请日：1997-08-25
IPC分类号： H01L21/48 , H01L21/56 , H01L21/60 , H01L23/498 , H05K3/32 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , H01L21/4853 , H01L21/563 , H01L23/49811 , H05K3/325 , H01L2224/13144 , H01L2224/16225 , H01L2224/73203 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/351 , H05K2201/10734 , H05K2201/10977 , H05K2203/0307 , H05K2203/0723 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a dielectric insulation material over the first conductive surface such that the dendrites are exposed through the insulation material to leave a substantially planar surface of exposed dendrites, and placing a second conductive surface on top of the exposed dendrites. The second conductive surface may be a surface metal, a chip bump array, or a ball grid array. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection and planarization manufactured in accordance with the present invention.
摘要翻译： 提供了一种用于连接电子电路封装中的两个导电表面的方法，包括以下步骤：在第一导电表面的选定区域上形成枝晶，在第一导电表面上施加介电绝缘材料，使得枝晶通过绝缘材料暴露于 留下暴露的树突的基本上平坦的表面，并将第二导电表面放置在暴露的树突上。 第二导电表面可以是表面金属，芯片凸块阵列或球栅阵列。 还要求保护的是包含用于根据本发明制造的电互连和平坦化的树突的电子电路封装。
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公开(公告)号：US10144204B2
公开(公告)日：2018-12-04
申请号：US11650919
申请日：2007-01-08
摘要： Substrate comprising a discrete first layer comprising a first surface, an opposing second surface and a polymeric first material, wherein the first layer has a thickness of from about 1 micron to about 1000 microns and a hardness of from about 10 to about 80 on the Shore A scale; a discrete second layer comprising a first surface, an opposing second surface, and a second material, wherein the second layer has a hardness of from about 1 to about 70 on the Shore OOO scale and a thickness of from about 0.001 cm to about 2.0 cm; a discrete third layer comprising a first surface and a third material, wherein the third layer has a hardness of from about 0 to about 90 on the Shore D scale; and wherein the second surface of the first layer is in substantially fixed and continuous contact with the first surface of the second layer; the second surface of the second layer is in substantially fixed and continuous contact with the first surface of the third layer; and wherein the ratio of the average thickness of the second layer to the average thickness of the third layer is from about 4:96 to about 25:75.
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公开(公告)号：US20070128255A1
公开(公告)日：2007-06-07
申请号：US11502858
申请日：2006-08-11
申请人： William Belcher , Mannie Clapp , Saswati Datta , Magda El-Nokaly , Sandra Murawski , Steven Page , Sohini Paldey , Ronald Warner , Raphael Warren
发明人： William Belcher , Mannie Clapp , Saswati Datta , Magda El-Nokaly , Sandra Murawski , Steven Page , Sohini Paldey , Ronald Warner , Raphael Warren
CPC分类号： C08J7/065 , A61L27/28 , A61L27/50 , A61L2400/18 , B82Y30/00 , C08J2375/04 , Y10T428/24479 , Y10T428/24802 , Y10T428/26 , Y10T428/31551 , Y10T442/2525
摘要： Article of manufacture comprising a substrate and a coating layer. The coating layer comprises at least one coating material, and is stably affixed to said substrate to form a stable, coated surface. The coated surface has a texture that mimics the topography of mammalian keratinous tissue and demonstrates at least one physical property representative of mammalian keratinous tissue, selected from the group consisting of a total surface energy of from about 15 mJ/m2 to about 50 mJ/m2, a dispersive component of the surface energy of from about 15 mJ/m2 to about 50 mJ/m2, a polar component of the total surface energy of from about 1 mJ/m2 to about 14 mJ/m2, a zeta-potential at a pH of about 5.0 of from about −40 mV to about 30 mV, and combinations thereof.
摘要翻译： 包括基材和涂层的制品。 涂层包含至少一种涂层材料，并且稳定地固定到所述基底上以形成稳定的涂覆表面。 涂覆的表面具有模仿哺乳动物角质组织的形貌的纹理，并且显示代表哺乳动物角质组织的至少一种物理性质，其选自总表面能为约15mJ / m 2 / 约50mJ / m 2的表面能的分散组分约为15mJ / m 2至约50mJ / m 2， / SUP>，总表面能的极性分量为约1mJ / m 2至约14mJ / m 2，ζ电位为pH为 约-40mV至约30mV的约5.0，及其组合。
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8.发明授权Detergent composition having a plasma-induced, water-soluble coating and process for making same 失效具有等离子体诱导的水溶性涂层的洗涤剂组合物及其制备方法公开(公告)号：US06716806B2
公开(公告)日：2004-04-06
申请号：US10223389
申请日：2002-08-19
IPC分类号： C11D316
CPC分类号： C11D11/007 , C11D17/0039 , C11D17/0082
摘要： A detergent composition having a plasma-induced, water-soluble coating for controlling solubility, chemical stability and physical properties is disclosed. A process for making such a detergent composition is also disclosed which involves subjecting a detergent material to a plasma glow zone in which an organic hydrophilic monomer is introduced such that it ultimately deposits on the detergent material to form a water-soluble coating. The detergent compositions are particulate or non-particulate and can be used for laundry, dishwashing or other similar application.
摘要翻译： 公开了一种具有用于控制溶解度，化学稳定性和物理性质的等离子体诱导的水溶性涂层的洗涤剂组合物。 还公开了制备这种洗涤剂组合物的方法，其包括将洗涤剂材料经受等离子体辉光区域，其中引入有机亲水单体，使得其最终沉积在洗涤剂材料上以形成水溶性涂层。 洗涤剂组合物是颗粒状或非颗粒状的，可用于洗衣，餐具洗涤或其它类似应用。
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公开(公告)号：US6046429A
公开(公告)日：2000-04-04
申请号：US873682
申请日：1997-06-12
申请人： Saswati Datta
发明人： Saswati Datta
CPC分类号： H05K3/225 , B23K26/351 , H01L21/485 , H05K3/027
摘要： A method of repairing wiring shorts on a surface of an organic layer. The organic layer, which is preferably a SLC/ASM layer, may be a surface layer of a Printed Circuit (PC) board. The absorption spectrum of the organic layer is examined. Based on that absorption spectrum, a laser is selected with a wavelength such that the surface layer slightly absorbs, 1-10%, laser energy striking it. Thus, the laser removes metal on the surface, while slightly etching the surface layer and without effect on any metal buried in or beneath the surface layer. Preferably, the laser is an Nd:YAG laser having a wavelength in a range where the ASM layer absorption is between 2-5%, and the copper ablation rate is high.
摘要翻译： 修复有机层表面上的布线短路的方法。 优选为SLC / ASM层的有机层可以是印刷电路板（PC）的表面层。 检查有机层的吸收光谱。 基于该吸收光谱，选择具有使得表面层稍微吸收1-10％的激光能量的波长的激光。 因此，激光去除表面上的金属，同时轻微蚀刻表面层，而不影响埋在表面层或其下的任何金属。 优选地，激光器是具有波长在ASM层吸收在2-5％之间的波长并且铜烧蚀速率高的Nd：YAG激光器。
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公开(公告)号：US20080167398A1
公开(公告)日：2008-07-10
申请号：US11650919
申请日：2007-01-08
CPC分类号： B32B27/40 , B32B7/02 , B32B27/08 , Y10T428/24512 , Y10T436/10
摘要： Substrate comprising a discrete first layer comprising a first surface, an opposing second surface and a polymeric first material, wherein the first layer has a thickness of from about 1 micron to about 1000 microns and a hardness of from about 10 to about 80 on the Shore A scale; a discrete second layer comprising a first surface, an opposing second surface, and a second material, wherein the second layer has a hardness of from about 1 to about 70 on the Shore OOO scale and a thickness of from about 0.001 cm to about 2.0 cm; a discrete third layer comprising a first surface and a third material, wherein the third layer has a hardness of from about 0 to about 90 on the Shore D scale; and wherein the second surface of the first layer is in substantially fixed and continuous contact with the first surface of the second layer; the second surface of the second layer is in substantially fixed and continuous contact with the first surface of the third layer; and wherein the ratio of the average thickness of the second layer to the average thickness of the third layer is from about 4:96 to about 25:75.
摘要翻译： 基底，其包括离散的第一层，其包括第一表面，相对的第二表面和聚合物第一材料，其中第一层的厚度为约1微米至约1000微米，硬度为约10至约80， 规模; 离散的第二层，包括第一表面，相对的第二表面和第二材料，其中所述第二层在肖氏OOO刻度上具有约1至约70的硬度，并且厚度为约0.001cm至约2.0cm ; 离散的第三层，包括第一表面和第三材料，其中所述第三层在肖氏D刻度上具有约0至约90的硬度; 并且其中所述第一层的所述第二表面与所述第二层的所述第一表面基本上固定和连续地接触; 第二层的第二表面与第三层的第一表面基本固定和连续接触; 并且其中所述第二层的平均厚度与所述第三层的平均厚度之比为约4:96至约25:75。
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