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62 条记录 (耗时 0.031 秒)

    Detector error suppression circuit and method
    2.
    发明授权
    Detector error suppression circuit and method 有权
    检测器误差抑制电路及方法

    公开(公告)号：US06546518B1

    公开(公告)日：2003-04-08

    申请号：US09549458

    申请日：2000-04-14

    申请人： Michael Leung ,  Leo Fu

    发明人： Michael Leung ,  Leo Fu

    IPC分类号： G11B2018

    CPC分类号： G11B20/10064 ,  G11B20/10009 ,  G11B20/10074 ,  G11B20/1833

    摘要： Device and method of EEPR4 post processing in an EPR4 detection system to remove single bit errors by applying 1+D to the samples and comparing this to (1−D)(1+D)3 to the detected EPR4 bits.

    摘要翻译： 在EPR4检测系统中进行EEPR4后处理的装置和方法，通过对样本应用1 + D并将其与（1-D）（1 + D）3进行比较，以检测EPR4位来消除单位错误。

    Parity insertion with precoder feedback in a PRML read channel
    3.
    发明授权
    Parity insertion with precoder feedback in a PRML read channel 有权
    在PRML读通道中具有预编码器反馈的奇偶校验插入

    公开(公告)号：US06243847B1

    公开(公告)日：2001-06-05

    申请号：US09215982

    申请日：1998-12-18

    申请人： Brett McClellan ,  Michael Leung ,  Leo Fu ,  Taehyun Jeon

    发明人： Brett McClellan ,  Michael Leung ,  Leo Fu ,  Taehyun Jeon

    IPC分类号： G06F1110

    CPC分类号： H03M13/098 ,  G11B5/012 ,  G11B20/10009 ,  G11B20/10055 ,  G11B20/1833

    摘要： A circuit for inserting a parity signal into a data stream, including a precoder circuit to precode the data stream to be written on a medium by generating a precoded data stream; a parity circuit to generate a parity signal based on said data stream at a predetermined time; and an insertion circuit to insert said parity signal into said precoded data stream.

    摘要翻译： 一种用于将奇偶校验信号插入到数据流中的电路，包括预编码器电路，用于通过产生预编码的数据流对要写入介质的数据流进行预编码; 奇偶校验电路，用于在预定时间基于所述数据流生成奇偶校验信号; 以及将所述奇偶校验信号插入所述预编码数据流的插入电路。

    Parity insertion with precoder feedback in a read channel
    4.
    发明授权
    Parity insertion with precoder feedback in a read channel 有权
    读通道中带有预编码器反馈的奇偶校验插入

    公开(公告)号：US06282690B1

    公开(公告)日：2001-08-28

    申请号：US09231480

    申请日：1999-01-14

    申请人： Brett McClellan ,  Michael Leung ,  Leo Fu ,  Taehyun Jeon

    发明人： Brett McClellan ,  Michael Leung ,  Leo Fu ,  Taehyun Jeon

    IPC分类号： G06F1100

    CPC分类号： H03M13/098

    摘要： A circuit for inserting a parity signal into a data stream, including a precoder circuit to precode the data stream to be written on a medium by generating a precoded data stream; a parity circuit to generate a parity signal based on said data stream at a predetermined time; and an insertion circuit to insert said parity signal into said precoded data stream.

    摘要翻译： 一种用于将奇偶校验信号插入到数据流中的电路，包括预编码器电路，用于通过产生预编码的数据流对要写入介质的数据流进行预编码; 奇偶校验电路，用于在预定时间基于所述数据流生成奇偶校验信号; 以及将所述奇偶校验信号插入所述预编码数据流的插入电路。

    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING AN OPTICALLY TRANSMISSIVE ELEMENT AND METHODS FOR PACKAGING THE SAME
    5.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING AN OPTICALLY TRANSMISSIVE ELEMENT AND METHODS FOR PACKAGING THE SAME 审中-公开
    包含光传输元件的半导体发光器件及其封装方法

    公开(公告)号：US20120037931A1

    公开(公告)日：2012-02-16

    申请号：US13272731

    申请日：2011-10-13

    申请人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

    发明人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

    IPC分类号： H01L33/08 ,  H01L33/60 ,  H01L33/50

    CPC分类号： H01L33/507 ,  H01L33/52 ,  H01L33/58 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

    摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.

    摘要翻译： 包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。 将空腔中的第一量的密封材料进行处理以形成具有形状的硬化的上表面。 在被处理的第一量的密封剂材料的上表面上设置发光转换元件。 发光转换元件包括波长转换材料，并且在腔的中间区域处的厚度大于靠近腔的侧壁的厚度。

    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING A LUMINESCENT CONVERSION ELEMENT AND METHODS FOR PACKAGING THE SAME
    6.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING A LUMINESCENT CONVERSION ELEMENT AND METHODS FOR PACKAGING THE SAME 有权
    包含发光变换元件的半导体发光器件及其封装方法

    公开(公告)号：US20090224277A1

    公开(公告)日：2009-09-10

    申请号：US12398626

    申请日：2009-03-05

    申请人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

    发明人： Michael Leung ,  Thomas G. Coleman ,  Maryanne Becerra

    IPC分类号： H01L33/00 ,  H01L21/66

    CPC分类号： H01L33/507 ,  H01L33/52 ,  H01L33/58 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

    摘要： Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.

    摘要翻译： 包装半导体发光器件的方法包括将第一量的密封剂材料分配到包括发光器件的空腔中。 空腔中的第一量的密封剂材料被处理以形成具有选定形状的硬化的上表面。 在被处理的第一量的密封剂材料的上表面上设置发光转换元件。 发光转换元件包括波长转换材料，并且在腔的中间区域处的厚度大于靠近腔的侧壁的厚度。

    Methods for packaging of a semiconductor light emitting device
    7.
    发明授权
    Methods for packaging of a semiconductor light emitting device 有权
    包装半导体发光器件的方法

    公开(公告)号：US07326583B2

    公开(公告)日：2008-02-05

    申请号：US11044779

    申请日：2005-01-27

    申请人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    发明人： Peter Andrews ,  Thomas G. Coleman ,  James Ibbetson ,  Michael Leung ,  Gerald H. Negley ,  Eric Tarsa

    IPC分类号： H01L21/00

    CPC分类号： H01L33/58 ,  H01L33/52

    摘要： Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.

    摘要翻译： 将半导体发光器件封装在具有位于其下侧和上侧壁之间的护城河的反射器中的方法，所述上壁和下侧壁限定反射腔，包括将密封剂材料分配到包括其中的发光器件的反射腔中以覆盖 并且在反射腔中形成密封材料的凸弯月面，其从护城河的边缘延伸而不接触反射器的上侧壁。 反射腔中的密封材料固化。 还提供了用于其的封装的半导体发光器件和反射器。

    Uniform emission LED package
    9.
    发明申请
    Uniform emission LED package 有权
    均匀排放LED封装

    公开(公告)号：US20070228387A1

    公开(公告)日：2007-10-04

    申请号：US11398214

    申请日：2006-04-04

    申请人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    发明人： Gerald Negley ,  Michael Leung ,  Maryanne Becerra ,  Eric Tarsa ,  Peter Andrews

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

    摘要： An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

    摘要翻译： 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。

    Power lamp package
    10.
    发明申请
    Power lamp package 有权
    电源灯包装

    公开(公告)号：US20060278882A1

    公开(公告)日：2006-12-14

    申请号：US11149998

    申请日：2005-06-10

    申请人： Michael Leung ,  James Ibbetson

    发明人： Michael Leung ,  James Ibbetson

    IPC分类号： H01L33/00

    CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Adhesive-free assembly of the substrate and reflector components of a semiconductor die package is achieved by injection molding the reflector onto a surface of the substrate or by molding the reflector separate from the substrate and securing it in place on the substrate through deformation of a portion of the reflector. The reflector may be made reflective either by molding the reflector using a light scattering material or through the addition of a reflective element, such as a piece of foil material that is secured to the reflector. A variety of interchangeable reflective elements having different surface shapes, and thus different light reflecting properties, may be made.

    摘要翻译： 半导体管芯封装的衬底和反射器部件的无粘合剂组装通过将反射器注射到衬底的表面上或通过将反射器与衬底分离成模并将其固定在衬底上的适当位置来实现， 的反射器。 反射器可以通过使用光散射材料模制反射器或通过添加反射元件（例如固定到反射器的箔片材料）来制成。 可以制造具有不同表面形状，因此具有不同光反射特性的各种可互换的反射元件。