公开(公告)号：US20080213605A1

公开(公告)日：2008-09-04

申请号：US11999665

申请日：2007-12-06

申请人： Gary C. Briney ,  Brian C. Auman ,  Christopher J. Milasincic

发明人： Gary C. Briney ,  Brian C. Auman ,  Christopher J. Milasincic

IPC分类号： B32B27/20

CPC分类号： B32B27/34 ,  B32B27/20 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0269 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The invention is directed to substrates for electronic circuitry. The substrates of the invention have a first polyimide layer having a functional filler and a second polyimide layer having a functional filler. The first layer is non-identical to the second layer, and a surface of the first layer is in contact with and is directly bonded to a surface of the second layer. Filler from each layer extends into the interface between the two layers, and a plurality of covalent bonds are present between the first and second functional layers that chemically bond the two layers together to provide a reliable, predictable multifunctional substrate for electronic circuitry with improved performance relative to polyimide layers bonded together by an adhesive.

公开(公告)号：US20080182115A1

公开(公告)日：2008-07-31

申请号：US11999664

申请日：2007-12-06

申请人： Gary C. Briney ,  Brian C. Auman ,  Christopher J. Milasincic

发明人： Gary C. Briney ,  Brian C. Auman ,  Christopher J. Milasincic

IPC分类号： B32B27/06

CPC分类号： B32B27/34 ,  B32B27/20 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0269 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The invention is directed to substrates for electronic circuitry. The substrates of the invention have a first polyimide layer having a functional filler and a second polyimide layer having a functional filler. The first layer is non-identical to the second layer, and a surface of the first layer is in contact with and is directly bonded to a surface of the second layer. Filler from each layer extends into the interface between the two layers, and a plurality of covalent bonds are present between the first and second functional layers that chemically bond the two layers together to provide a reliable, predictable multifunctional substrate for electronic circuitry with improved performance relative to polyimide layers bonded together by an adhesive.

摘要翻译： 本发明涉及电子电路用基板。 本发明的基板具有具有功能填料的第一聚酰亚胺层和具有功能性填料的第二聚酰亚胺层。 第一层与第二层不同，第一层的表面与第二层的表面接触并直接结合到第二层的表面。 来自每层的填料延伸到两层之间的界面中，并且多个共价键存在于第一和第二功能层之间，以将两层化学结合在一起，为电子电路提供可靠且可预测的多功能基板，具有改进的性能相对 通过粘合剂粘合在一起的聚酰亚胺层。

公开(公告)号：US09050784B2

公开(公告)日：2015-06-09

申请号：US13315324

申请日：2011-12-09

申请人： Brian C. Auman ,  Carl Robert Haeger

发明人： Brian C. Auman ,  Carl Robert Haeger

IPC分类号： H01L31/048 ,  B32B27/34 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  H01L31/049

CPC分类号： B32B27/34 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/304 ,  B32B2457/12 ,  H01L31/049 ,  Y02E10/50 ,  Y10T428/251 ,  Y10T428/256 ,  Y10T428/259 ,  Y10T428/269

摘要： A back-sheet for a photovoltaic module is provided comprising a fire resistant polymeric film and a second polymeric film adhered to the fire resistant polymeric film. The fire resistant polymeric film comprises a polymer that does not melt at temperatures below 275° C. and an inorganic particulate filler selected from inorganic metal oxides and inorganic metal nitrides, and combinations thereof. The fire resistant polymeric film contains from 40 to 75 weight percent inorganic particulate filler based on the total weight of the film, and the fire resistant polymeric film has an average thickness of at least 85 microns. A photovoltaic module comprising such a back-sheet is also provided.

摘要翻译： 提供了一种用于光伏模块的背板，其包括耐火聚合物膜和粘附到耐火聚合物膜上的第二聚合物膜。 耐火聚合物膜包括在低于275℃的温度下不熔化的聚合物和选自无机金属氧化物和无机金属氮化物的无机颗粒填料及其组合。 耐火聚合物膜基于膜的总重量含有40至75重量％的无机颗粒填料，耐火聚合物膜的平均厚度至少为85微米。 还提供了包括这种背板的光伏模块。

公开(公告)号：US20120312366A1

公开(公告)日：2012-12-13

申请号：US13315326

申请日：2011-12-09

申请人： Adam Ben Starry ,  Brian C. Auman ,  Carl Robert Haeger ,  Roger Curtis Wicks

发明人： Adam Ben Starry ,  Brian C. Auman ,  Carl Robert Haeger ,  Roger Curtis Wicks

IPC分类号： B32B19/04 ,  H01L31/0203

CPC分类号： B32B17/10788 ,  B32B17/10018 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/3065 ,  B32B2327/12 ,  H01L31/049 ,  Y02E10/50 ,  Y10T428/251 ,  Y10T428/259 ,  Y10T442/10

摘要： A back-sheet for a photovoltaic module comprises a fire resistant sheet adhered to a fluoropolymer film. The fire resistant sheet comprises 40 to 100 weight percent of crystallized mineral silicate platelets based on the weight of the fire resistant sheet, and the fire resistant sheet has an average thickness of at least 75 microns, and more preferably at least 100 microns. The crystallized mineral silicate platelets of the fire resistant sheet are selected from the group of mica, vermiculite, clay, talc, and combinations thereof. A photovoltaic module made with such a back-sheet is also disclosed.

摘要翻译： 用于光伏组件的背板包括粘附到含氟聚合物膜上的防火片。 基于耐火片的重量，防火片材包含40-100重量％的结晶矿物硅酸盐血小板，耐火片材具有至少75微米，更优选至少100微米的平均厚度。 耐火片的结晶矿物硅酸盐血小板选自云母，蛭石，粘土，滑石及其组合。 还公开了由这种背板制成的光伏组件。

公开(公告)号：US20110124806A1

公开(公告)日：2011-05-26

申请号：US12622977

申请日：2009-11-20

申请人： John W. Simmons ,  Brian C. Auman ,  Kostantinos Kourtakis ,  Salah Boussaad

发明人： John W. Simmons ,  Brian C. Auman ,  Kostantinos Kourtakis ,  Salah Boussaad

IPC分类号： C08L79/08 ,  C08G73/10

CPC分类号： C08G73/1067 ,  C08G73/1042 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08

摘要： A film is disclosed, containing 40-100 weight percent polyimide. The polyimide is derived from a dianhydride component and a diamine component. The dianhydride component is at least 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), and optionally is also pyromellitic dianhydride (PMDA) in a mole ratio of 50-100:50-0 (BPDA:PMDA). The diamine component comprises 1,5-naphthalenediamine (1,5-ND) and 1,4-diaminobenzene (PPD) and/or meta phenylene diamine (MPD) in a mole ratio of 15-95:85-5 (1,5-ND:PPD+MPD). The films have exceptional high temperature storage modulus (elastic modulus) and exceptionally low high temperature creep (eplast).

摘要翻译： 公开了一种含有40-100重量％聚酰亚胺的膜。 聚酰亚胺衍生自二酐组分和二胺组分。 二酐组分为至少3,3'，4,4'-联苯四羧酸二酐（BPDA），并且任选还含有摩尔比为50-100:50-0（BPDA：PMDA）的均苯四酸二酐（PMDA）。 二胺组分包含摩尔比为15-95:85-5（1,5）的1,5-萘二胺（1,5-ND）和1,4-二氨基苯（PPD）和/或间苯二胺（MPD） -ND：PPD + MPD）。 这些薄膜具有优异的高温储存模量（弹性模量）和特别低的高温蠕变（eplast）。

公开(公告)号：US07547849B2

公开(公告)日：2009-06-16

申请号：US11153206

申请日：2005-06-15

申请人： Yueh-Ling Lee ,  Meredith L. Dunbar ,  Harry Richard Zwicker ,  Carl B. Wang ,  Brian C. Auman ,  Shane Fang

发明人： Yueh-Ling Lee ,  Meredith L. Dunbar ,  Harry Richard Zwicker ,  Carl B. Wang ,  Brian C. Auman ,  Shane Fang

IPC分类号： H05K1/00 ,  B32B3/00

CPC分类号： H05K3/185 ,  C23C18/02 ,  C23C18/1216 ,  C23C18/1233 ,  C23C18/1295 ,  C23C18/204 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31725 ,  Y10T428/31786

摘要： A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.

摘要翻译： 可光活化的聚合物组合物和聚合物复合材料包括选自环氧树脂，二氧化硅填充的环氧树脂，双马来酰亚胺树脂，双马来酰亚胺三嗪，含氟聚合物，聚酯，聚苯醚/聚苯醚树脂，聚丁二烯/聚异戊二烯交联树脂（和共聚物），液体 结晶聚合物，聚酰胺，氰酸酯或其组合，聚合物粘合剂的存在量为40,45,50,55,60,65,70,75,80,85,90,95,96或97重量 - 聚合物组合物的总重量; 存在量为3,4,5,6,7,8,9,10,11,12,13,14,15,20,25,30,35,40,45,50,55的尖晶石晶体填料 和60重量％的聚合物组合物的总重量，以及制备其的方法。

公开(公告)号：US5177179A

公开(公告)日：1993-01-05

申请号：US680445

申请日：1991-04-04

申请人： Brian C. Auman ,  David P. Higley ,  Bruce B. Johnson

发明人： Brian C. Auman ,  David P. Higley ,  Bruce B. Johnson

IPC分类号： C07C211/52 ,  C07C211/56 ,  C08G73/10

CPC分类号： C08G73/1039 ,  C07C211/52 ,  C08G73/1067

摘要： Perfluoroalkylated diaminoesitylene and polymers, preferably polyimides, made therefrom. The necessarily obtainable meta-substitution position of the perfluoroalkyl group with respect to both amino-groups provides an improved diamine and compositions of matter resulting therefrom.

摘要翻译： 全氟烷基化二氨基甘氨酸和由其制备的聚合物，优选聚酰亚胺。 相对于两个氨基，全氟烷基的必需获得的间位取代位置提供改进的二胺及由其产生的物质的组成。

公开(公告)号：US08653512B2

公开(公告)日：2014-02-18

申请号：US13510628

申请日：2010-11-19

申请人： Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

发明人： Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

IPC分类号： H01L29/08

CPC分类号： H01L23/482 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/00 ,  C08K7/02 ,  C08K7/04 ,  C08K7/08 ,  C08K2201/016 ,  C08L79/08 ,  H01L23/293 ,  H01L23/295 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  H01L2924/00

摘要： The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

摘要翻译： 本公开涉及薄膜晶体管组合物。 薄膜晶体管组合物具有半导体材料和基板。 基板由聚酰亚胺和亚微米填料组成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种芳族二胺组分，其选自刚性链二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。

公开(公告)号：US20130244000A1

公开(公告)日：2013-09-19

申请号：US13602966

申请日：2012-09-04

申请人： Yu-Jean Chen ,  Brian C. Auman ,  Sheng-Yu Huang ,  Tsutomu Mutoh ,  Ming-Te We ,  Yu-Chih Yeh

发明人： Yu-Jean Chen ,  Brian C. Auman ,  Sheng-Yu Huang ,  Tsutomu Mutoh ,  Ming-Te We ,  Yu-Chih Yeh

IPC分类号： B32B3/30

CPC分类号： B32B3/30 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C09D179/08 ,  H05K1/0346 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0355 ,  Y10T428/24355 ,  C08K5/5455

摘要： The present invention is related to a chip on film package, comprising a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.

摘要翻译： 本发明涉及一种胶片封装，包括聚酰亚胺覆铜层压板及其制造方法。 层压体包括聚酰亚胺层和铜箔层，其中聚酰亚胺层由包含二胺单体，二酐单体，有机溶剂和具有一个或多个有机官能团的硅烷偶联剂的聚酰亚胺前体制成，以及 铜箔是光滑的铜箔。 本发明的聚酰亚胺层提供高透明度，良好的尺寸稳定性，良好的机械性能和对铜箔的良好粘合性。

公开(公告)号：US20120228616A1

公开(公告)日：2012-09-13

申请号：US13510628

申请日：2010-11-19

申请人： Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

发明人： Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

IPC分类号： H01L29/786

CPC分类号： H01L23/482 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/00 ,  C08K7/02 ,  C08K7/04 ,  C08K7/08 ,  C08K2201/016 ,  C08L79/08 ,  H01L23/293 ,  H01L23/295 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  H01L2924/00

摘要： The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

摘要翻译： 本公开涉及薄膜晶体管组合物。 薄膜晶体管组合物具有半导体材料和基板。 基板由聚酰亚胺和亚微米填料组成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种芳族二胺组分，其选自刚性链二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。