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1.发明授权公开(公告)号：US07545329B2
公开(公告)日：2009-06-09
申请号：US11524599
申请日：2006-09-21
IPC分类号： H01Q1/38
CPC分类号： H01Q9/26 , H01L2223/6677 , H01L2224/04042 , H01L2224/16225 , H01L2224/48227 , H01L2224/73207 , H01L2924/3011 , H01L2924/00
摘要： Printed antenna devices are provided, which can operate at RF and microwave frequencies, for example, while simultaneously providing antenna performance characteristics such as high gain/directivity/radiation efficiency, high bandwidth, hemispherical radiation patterns, impedance, etc., that render the antennas suitable for voice communication, data communication or radar applications, for example. Further, apparatus are provided for integrally packaging such printed antenna devices with IC (integrated circuit) chips (e.g., transceiver) to construct IC packages for, e.g., wireless communications applications.
摘要翻译： 提供了可以在RF和微波频率下操作的打印天线装置，例如同时提供天线性能特征，例如高增益/方向性/辐射效率，高带宽，半球形辐射图，阻抗等，使天线 适用于语音通信，数据通信或雷达应用。 此外，提供了用于将这种印刷天线装置与IC（集成电路）芯片（例如收发器）整体封装以构建用于例如无线通信应用的IC封装的装置。
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2.发明申请公开(公告)号：US20080272977A1
公开(公告)日：2008-11-06
申请号：US12176975
申请日：2008-07-21
CPC分类号： H01Q9/0407 , H01L23/66 , H01L24/73 , H01L2223/6677 , H01L2224/48091 , H01L2224/73207 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H01Q1/38 , H01Q1/48 , H01Q9/28 , H01Q9/40 , H01Q23/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00014 , H01L2924/00
摘要： Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
摘要翻译： 提供天线，其使用一个或多个导电通路短截线作为形成在基板中的辐射元件构造。 天线可以与IC芯片（例如，IC收发器，接收器，发射器等）整体封装，以构建集成的无线或RF（射频）通信系统。
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3.发明授权公开(公告)号：US07119745B2
公开(公告)日：2006-10-10
申请号：US10881104
申请日：2004-06-30
IPC分类号： H01Q1/38
CPC分类号： H01Q9/26 , H01L2223/6677 , H01L2224/04042 , H01L2224/16225 , H01L2224/48227 , H01L2224/73207 , H01L2924/3011 , H01L2924/00
摘要： Printed antenna devices are provided, which can operate at RF and microwave frequencies, for example, while simultaneously providing antenna performance characteristics such as high gain/directivity/radiation efficiency, high bandwidth, hemispherical radiation patterns, impedance, etc., that render the antennas suitable for voice communication, data communication or radar applications, for example. Further, apparatus are provided for integrally packaging such printed antenna devices with IC (integrated circuit) chips (e.g., transceiver) to construct IC packages for, e.g., wireless communications applications.
摘要翻译： 提供了可以在RF和微波频率下操作的打印天线装置，例如同时提供天线性能特征，例如高增益/方向性/辐射效率，高带宽，半球形辐射图，阻抗等，使天线 适用于语音通信，数据通信或雷达应用。 此外，提供了用于将这种印刷天线装置与IC（集成电路）芯片（例如收发器）整体封装以构建用于例如无线通信应用的IC封装的装置。
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4.发明授权Apparatus and methods for constructing antennas using wire bonds as radiating elements 有权使用引线键作为辐射元件构造天线的装置和方法公开(公告)号：US07295161B2
公开(公告)日：2007-11-13
申请号：US10912959
申请日：2004-08-06
IPC分类号： H01Q1/38
CPC分类号： H01Q23/00 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/80 , H01L2223/6677 , H01L2224/0603 , H01L2224/0612 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/49 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/10329 , H01L2924/14 , H01L2924/20751 , H01L2924/20752 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01Q1/2283 , H01Q1/38 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
摘要翻译： 提供天线，其使用一根或多根线作为连接到基板或芯片的辐射元件构造，其中引线接合方法可用于连接并形成线的环形轮廓。 天线可以与IC芯片（例如，IC收发器，接收器，发射器等）整体封装，以构建集成的无线或RF（射频）通信系统。
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5.发明授权Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate 有权使用通孔作为形成在基板中的辐射元件来构造天线的装置和方法公开(公告)号：US07999753B2
公开(公告)日：2011-08-16
申请号：US12176975
申请日：2008-07-21
CPC分类号： H01Q9/0407 , H01L23/66 , H01L24/73 , H01L2223/6677 , H01L2224/48091 , H01L2224/73207 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H01Q1/38 , H01Q1/48 , H01Q9/28 , H01Q9/40 , H01Q23/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00014 , H01L2924/00
摘要： Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
摘要翻译： 提供天线，其使用一个或多个导电通路短截线作为形成在基板中的辐射元件构造。 天线可以与IC芯片（例如，IC收发器，接收器，发射器等）整体封装，以构建集成的无线或RF（射频）通信系统。
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6.发明授权Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate 有权使用通孔作为形成在基板中的辐射元件来构造天线的装置和方法公开(公告)号：US07444734B2
公开(公告)日：2008-11-04
申请号：US10731520
申请日：2003-12-09
IPC分类号： H01P11/00
CPC分类号： H01Q9/0407 , H01L23/66 , H01L24/73 , H01L2223/6677 , H01L2224/48091 , H01L2224/73207 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H01Q1/38 , H01Q1/48 , H01Q9/28 , H01Q9/40 , H01Q23/00 , Y10T29/49016 , Y10T29/49018 , H01L2924/00014 , H01L2924/00
摘要： Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
摘要翻译： 提供天线，其使用一个或多个导电通路短截线作为形成在基板中的辐射元件构造。 天线可以与IC芯片（例如，IC收发器，接收器，发射器等）整体封装，以构建集成的无线或RF（射频）通信系统。
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7.发明授权Versatile Si-based packaging with integrated passive components for mmWave applications 有权多功能Si基封装，集成无源元件，适用于mmWave应用公开(公告)号：US07808798B2
公开(公告)日：2010-10-05
申请号：US12062665
申请日：2008-04-04
申请人： John Michael Cotte , Brian Paul Gaucher , Janusz Grzyb , Nils Deneke Hoivik , Christopher Vincent Jahnes , John Ulrich Knickerbocker , Duixian Liu , John Harold Magerlein , Chirag Suryakant Patel , Ullrich R. Pfeiffer , Cornelia Kang-I Tsang
发明人： John Michael Cotte , Brian Paul Gaucher , Janusz Grzyb , Nils Deneke Hoivik , Christopher Vincent Jahnes , John Ulrich Knickerbocker , Duixian Liu , John Harold Magerlein , Chirag Suryakant Patel , Ullrich R. Pfeiffer , Cornelia Kang-I Tsang
IPC分类号： H05K1/18
CPC分类号： H01L25/165 , H01L23/66 , H01L24/24 , H01L24/82 , H01L25/162 , H01L2223/6677 , H01L2224/16225 , H01L2224/24137 , H01L2224/24227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/2283 , H01L2924/00 , H01L2224/0401
摘要： An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.
摘要翻译： 描述了一种装置，其具有用于天线结构的一部分的空腔的插入件，具有导体穿过通孔，顶部Si部分具有互连布线并具有用于在其上电气安装集成电路芯片的焊盘，其中顶部Si部分与 内插器电气和机械。 插入器和顶部Si部分可以被缩放以提供功能单元的阵列。 本发明克服了将高效天线与Si封装中的集成电路芯片组合在一起的信号频率为1至100GHz的问题，以及屏蔽靠近天线的组件的问题，并减少了由于TCE失配引起的应变。
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公开(公告)号：US20090009399A1
公开(公告)日：2009-01-08
申请号：US11772464
申请日：2007-07-02
IPC分类号： H01Q9/04
CPC分类号： H01Q21/0075 , H01Q21/0006 , H01Q21/062 , H01Q21/065
摘要： Improved feed line networks for antenna arrays operating at millimeter wave frequencies are provided for constructing planar antenna arrays printed on the surface of a dielectric substrate. A planar antenna array includes an array of planar radiator elements interconnected through a feed line network of planar coplanar transmission lines that enable high-efficiency operation, at millimeter wave operating frequencies. For example, a feed network may be formed with a network of coplanar strip line transmission lines including one or more coplanar strip line (CPS) and one or more coplanar waveguide (CPW) transmission line, which are interconnected using balun structures, to enable high efficiency operation at millimeter wave frequencies.
摘要翻译： 提供用于以毫米波频率工作的天线阵列的改进的馈线网络，用于构建印刷在电介质基片表面上的平面天线阵列。 平面天线阵列包括通过平面共面传输线的馈线网络互连的平面辐射器阵列阵列，其能够以毫米波工作频率进行高效率的操作。 例如，馈电网络可以形成有包括一个或多个共面带状线（CPS）和一个或多个共面波导（CPW）传输线的共面带状线传输线的网络，其使用平衡 - 不平衡转换器结构互连，以实现高 毫米波频率下的效率运行。
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9.发明申请Versatile Si-based packaging with integrated passive components for mmWave applications 有权多功能Si基封装，集成无源元件，适用于mmWave应用公开(公告)号：US20080029886A1
公开(公告)日：2008-02-07
申请号：US11498689
申请日：2006-08-03
申请人： John Michael Cotte , Brian Paul Gaucher , Janusz Grzyb , Nils Deneke Hoivik , Christopher Vincent Jahnes , John Ulrich Knickerbocker , Duixian Liu , John Harold Magerlein , Chirag Suryakant Patel , Ullrich R. Pfeiffer , Cornelia Kang-I Tsang
发明人： John Michael Cotte , Brian Paul Gaucher , Janusz Grzyb , Nils Deneke Hoivik , Christopher Vincent Jahnes , John Ulrich Knickerbocker , Duixian Liu , John Harold Magerlein , Chirag Suryakant Patel , Ullrich R. Pfeiffer , Cornelia Kang-I Tsang
IPC分类号： H01L23/34
CPC分类号： H01L25/165 , H01L23/66 , H01L24/24 , H01L24/82 , H01L25/162 , H01L2223/6677 , H01L2224/16225 , H01L2224/24137 , H01L2224/24227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/2283 , H01L2924/00 , H01L2224/0401
摘要： An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.
摘要翻译： 描述了一种装置，其具有用于天线结构的一部分的空腔的插入件，具有导体穿过通孔，顶部Si部分具有互连布线并具有用于在其上电气安装集成电路芯片的焊盘，其中顶部Si部分与 内插器电气和机械。 插入器和顶部Si部分可以被缩放以提供功能单元的阵列。 本发明克服了将高效天线与Si封装中的集成电路芯片组合在一起的信号频率为1至100GHz的问题，以及屏蔽靠近天线的组件的问题，并减少了由于TCE失配引起的应变。
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公开(公告)号：US06950069B2
公开(公告)日：2005-09-27
申请号：US10318816
申请日：2002-12-13
申请人： Brian Paul Gaucher , Duixian Liu
发明人： Brian Paul Gaucher , Duixian Liu
摘要： Integrated (embedded) tri-band antennas for use with portable devices such as laptop computers. In one aspect, an integrated tri-band antenna for a portable device comprises a first element having a resonant frequency in a first frequency band, a second element having a resonant frequency in a second frequency band, a third element having a resonant frequency in a third frequency band, and a ground element for grounding the first, second and third elements. The first, second and third elements and ground element may be metallic elements formed on a PCB (printed circuit board), wherein the first element is connected to a signal feed, and wherein the PCB is mounted to a metallic support frame of a display unit of the portable device.
摘要翻译： 集成（嵌入式）三频天线，用于便携式设备，如笔记本电脑。 一方面，一种用于便携式设备的集成三频天线包括具有第一频带中的谐振频率的第一元件，具有第二频带中的谐振频率的第二元件，具有第一频带中的谐振频率的第三元件 第三频带，以及用于使第一，第二和第三元件接地的接地元件。 第一，第二和第三元件和接地元件可以是形成在PCB（印刷电路板）上的金属元件，其中第一元件连接到信号馈送，并且其中PCB被安装到显示单元的金属支撑框架 的便携式设备。
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