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公开(公告)号：US20210251059A1
公开(公告)日：2021-08-12
申请号：US17228013
申请日：2021-04-12
Applicant: Bridgelux, Inc.
Inventor： Brian Cumpston , Shiva Rai , Linden Willis-Kilgroe , Sudeep Reddy Dodda
Abstract: A lighting module may receive control signal having a first control scheme, the lighting module including a driver including at least one channel; and a control module; where the control module translates the received first control scheme into a predetermined second control scheme, when the first control scheme is different from the predetermined second control scheme; wherein the control module generates an identity voltage correlated with the received first control scheme; wherein the control module outputs to the driver a driver control signal including the predetermined second control scheme, and the identity voltage; and wherein the driver generates a driver output based on the identity voltage and the driver control signal.
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公开(公告)号：US10559731B1
公开(公告)日：2020-02-11
申请号：US15062001
申请日：2016-03-04
Applicant: BRIDGELUX, INC.
Inventor： Phil Elizondo , Joseph Leigh , Brian Cumpston
IPC: H01L33/60
Abstract: Aspects include features for improving the reliability of a reflective base structure for light emitting diodes (LED) chip-on-board (COB) array products. The reflective base structure reduces reflective material of a reflective layer (e.g., silver) from migrating into adjacent layers. In one configuration used to reduce the migration of reflective material, a reflective base for a light-emitting diode (LED) may comprise a substrate, a reflective layer, and a diffusion barrier layer between the substrate and the reflective layer. In another configuration used to reduce the migration of reflective material, a reflective base for an LED comprising: a substrate, a reflective layer; and a planarizing layer between the substrate and the reflective layer, a thickness of the planarizing layer between the substrate and the reflective layer being less than 70 nm.
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公开(公告)号：US11564294B2
公开(公告)日：2023-01-24
申请号：US17670766
申请日：2022-02-14
Applicant: Bridgelux, Inc.
Inventor： Brian Cumpston , Shiva Rai , Linden Willis-Kilgroe , Sudeep Reddy Dodda
Abstract: A method of controlling an LED system with a control signal having a first control scheme may include providing a lighting module including a control module, an LED driver connected to the control module, and at least one LED connected to the LED driver; receiving, at the control module, the control signal having a first control scheme; comparing the first control scheme to a predetermined second control scheme; when the comparing determines that the first control scheme is the same as the predetermined second control scheme, transmitting to the LED driver a driver control signal including the predetermined second control scheme; and when the comparing determines that the first control scheme is different from the predetermined second control scheme, translating, with the control module, the first control scheme into the predetermined second control scheme and then transmitting to the LED driver a driver control signal including the predetermined second control scheme.
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公开(公告)号：US20220167475A1
公开(公告)日：2022-05-26
申请号：US17670766
申请日：2022-02-14
Applicant: Bridgelux, Inc.
Inventor： Brian Cumpston , Shiva Rai , Linden Willis-Kilgroe , Sudeep Reddy Dodda
Abstract: A method of controlling an LED system with a control signal having a first control scheme may include providing a lighting module including a control module, an LED driver connected to the control module, and at least one LED connected to the LED driver; receiving, at the control module, the control signal having a first control scheme; comparing the first control scheme to a predetermined second control scheme; when the comparing determines that the first control scheme is the same as the predetermined second control scheme, transmitting to the LED driver a driver control signal including the predetermined second control scheme; and when the comparing determines that the first control scheme is different from the predetermined second control scheme, translating, with the control module, the first control scheme into the predetermined second control scheme and then transmitting to the LED driver a driver control signal including the predetermined second control scheme.
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Patent Agency Ranking
公开(公告)号：US11265984B2
公开(公告)日：2022-03-01
申请号：US17228013
申请日：2021-04-12
Applicant: Bridgelux, Inc.
Inventor： Brian Cumpston , Shiva Rai , Linden Willis-Kilgroe , Sudeep Reddy Dodda
Abstract: A lighting module may receive control signal having a first control scheme, the lighting module including a driver including at least one channel; and a control module; where the control module translates the received first control scheme into a predetermined second control scheme, when the first control scheme is different from the predetermined second control scheme; wherein the control module generates an identity voltage correlated with the received first control scheme; wherein the control module outputs to the driver a driver control signal including the predetermined second control scheme, and the identity voltage; and wherein the driver generates a driver output based on the identity voltage and the driver control signal.
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公开(公告)号：US20200288546A1
公开(公告)日：2020-09-10
申请号：US16292607
申请日：2019-03-05
Applicant: Bridgelux Inc.
Inventor： Brian Cumpston , Shiva Rai , Linden Willis-Kilgroe , Sudeep Reddy Dodda
Abstract: There is provided a system comprising a driver and a control module, the control module capable of translating a received control signal having a first control scheme into a driver control signal having a predetermined second control scheme; and wherein the driver is configured for generating a driver output based on the identity of the first control scheme and the driver control signal. A driver, control module, and a method of controlling an LED system are also provided.
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公开(公告)号：US20160181480A1
公开(公告)日：2016-06-23
申请号：US14988537
申请日：2016-01-05
Applicant: Bridgelux, Inc.
Inventor： Brian Cumpston
CPC classification number: H01L33/486 , H01L25/0753 , H01L25/165 , H01L25/167 , H01L33/20 , H01L33/507 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/644 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2224/49109 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H05K1/0274 , H05K1/184 , H05K2201/10106 , H05K2201/10643 , H05K2203/049 , H01L2924/00012 , H01L2924/00014
Abstract: A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.
Abstract translation: 用于封装LED裸片的低成本设备提供了优异的反射率和导热性，而不用昂贵的反射铝基板覆盖LED照明器的整个表面。 LED封装装置包括设置在印刷电路板的孔中的高反射性基板。 基板的反射率大于97％，并且包括设置在较厚铝层上方的绝缘层和反射层。 LED芯片设置在基板的顶表面上。 PCB具有树脂中的玻璃纤维层和金属层。 PCB的下表面和衬底的底表面基本上共面。 PCB的金属层仅通过接合线电耦合到LED管芯。 电子电路设置在PCB的上表面上，用于控制从LED管芯发出的光。
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公开(公告)号：US09252337B1
公开(公告)日：2016-02-02
申请号：US14579937
申请日：2014-12-22
Applicant: Bridgelux, Inc.
Inventor： Brian Cumpston
IPC: H01L27/15 , H01L29/88 , H01L33/48 , H01L33/50 , H01L33/64 , H01L33/56 , H01L33/62 , H01L33/60 , H01L25/16 , H05K1/18 , H05K1/02 , H01L33/58 , H01L33/20
CPC classification number: H01L33/486 , H01L25/0753 , H01L25/165 , H01L25/167 , H01L33/20 , H01L33/507 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/644 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2224/49109 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H05K1/0274 , H05K1/184 , H05K2201/10106 , H05K2201/10643 , H05K2203/049 , H01L2924/00012 , H01L2924/00014
Abstract: A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.
Abstract translation: 用于封装LED裸片的低成本设备提供了优异的反射率和导热性，而不用昂贵的反射铝基板覆盖LED照明器的整个表面。 LED封装装置包括设置在印刷电路板的孔中的高反射性基板。 基板的反射率大于97％，并且包括设置在较厚铝层上方的绝缘层和反射层。 LED芯片设置在基板的顶表面上。 PCB具有树脂中的玻璃纤维层和金属层。 PCB的下表面和衬底的底表面基本上共面。 PCB的金属层仅通过接合线电耦合到LED管芯。 电子电路设置在PCB的上表面上，用于控制从LED管芯发出的光。
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公开(公告)号：US11006492B2
公开(公告)日：2021-05-11
申请号：US16292607
申请日：2019-03-05
Applicant: Bridgelux Inc.
Inventor： Brian Cumpston , Shiva Rai , Linden Willis-Kilgroe , Sudeep Reddy Dodda
Abstract: There is provided a system comprising a driver and a control module, the control module capable of translating a received control signal having a first control scheme into a driver control signal having a predetermined second control scheme; and wherein the driver is configured for generating a driver output based on the identity of the first control scheme and the driver control signal. A driver, control module, and a method of controlling an LED system are also provided.
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