公开(公告)号：US07157790B2

公开(公告)日：2007-01-02

申请号：US10209502

申请日：2002-07-31

申请人： Bruce Beauchamp ,  Andrew Tuthill ,  Joseph D. Fernandez ,  Anucha Phongsantichai

发明人： Bruce Beauchamp ,  Andrew Tuthill ,  Joseph D. Fernandez ,  Anucha Phongsantichai

IPC分类号： H01L31/00

CPC分类号： H01L24/49 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/85201 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least two bond pads are connected to a one of the plurality of inner leads and/or at least two inner leads are connected to one or more bond pads with a single bond wire. A single bond wire is connected to a first bond pad or inner lead and subsequently wedge or stitch bonded to a second bond pad or inner lead, then it is connected to a third bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and inner lead(s). The bond pad(s) of the die and inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

摘要翻译： 一种集成电路装置，包括安装在具有多个内引线的引线框上的集成电路管芯。 集成电路管芯具有电连接到引线框架的内部引线的多个接合焊盘，其中至少两个接合焊盘连接到多个内部引线中的一个和/或至少两个内部引线连接到 一个或多个具有单键线的接合焊盘。 单键线连接到第一接合焊盘或内引线，随后楔形或缝合接合到第二接合焊盘或内引线，然后连接到第三接合焊盘或内引线。 单键线在每个接合焊盘和内引线上仅需要一个连接区域。 因此，引线框架的管芯和内引线的接合焊盘由单键焊丝电连接在一起。

公开(公告)号：US07326594B2

公开(公告)日：2008-02-05

申请号：US11563803

申请日：2006-11-28

申请人： Bruce Beauchamp ,  Andrew Tuthill ,  Joseph D. Fernandez ,  Anucha Phongsantichai

发明人： Bruce Beauchamp ,  Andrew Tuthill ,  Joseph D. Fernandez ,  Anucha Phongsantichai

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/4952 ,  H01L23/5382 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/85201 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/45139 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least two inner leads are connected to at least one of bond pads with a single bond wire. A single bond wire is ball or wedge bonded to a first bond pad or inner lead and subsequently wedge bonded to one or more second bond pads or inner leads, then it is connected to a third or last bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and/or inner lead(s). The bond pad(s) of the die and/or inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

摘要翻译： 一种集成电路器件，包括具有多个接合焊盘的集成电路管芯，所述接合焊盘选择性地连接到引线框架的多个内引线。 至少两个接合焊盘连接到内部引线中的至少一个，和/或至少两个内部引线与具有单键焊丝的至少一个接合焊盘连接。 单键线是球形或楔形结合到第一接合焊盘或内部引线，并且随后楔形结合到一个或多个第二接合焊盘或内部引线上，然后连接到第三或最后的接合焊盘或内部引线。 单键线在每个接合焊盘和/或内引线仅需要一个连接区域。 因此，引线框的管芯和/或内部引线的接合焊盘由此通过单键焊丝电连接在一起。

公开(公告)号：US20080099893A1

公开(公告)日：2008-05-01

申请号：US11955856

申请日：2007-12-13

申请人： Bruce Beauchamp ,  Andrew Tuthill ,  Joseph Fernandez ,  Anucha Phongsantichai

发明人： Bruce Beauchamp ,  Andrew Tuthill ,  Joseph Fernandez ,  Anucha Phongsantichai

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/4952 ,  H01L23/5382 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/85201 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/45139 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least two inner leads are connected to at least one of bond pads with a single bond wire. A single bond wire is ball or wedge bonded to a first bond pad or inner lead and subsequently wedge bonded to one or more second bond pads or inner leads, then it is connected to a third or last bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and/or inner lead(s). The bond pad(s) of the die and/or inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

摘要翻译： 一种集成电路器件，包括具有多个接合焊盘的集成电路管芯，所述接合焊盘选择性地连接到引线框架的多个内引线。 至少两个接合焊盘连接到内部引线中的至少一个，和/或至少两个内部引线与具有单键焊丝的至少一个接合焊盘连接。 单键线是球形或楔形结合到第一接合焊盘或内部引线，并且随后楔形结合到一个或多个第二接合焊盘或内部引线上，然后连接到第三或最后的接合焊盘或内部引线。 单键线在每个接合焊盘和/或内引线仅需要一个连接区域。 因此，引线框的管芯和/或内部引线的接合焊盘由此通过单键焊丝电连接在一起。

公开(公告)号：US20070215994A1

公开(公告)日：2007-09-20

申请号：US11563803

申请日：2006-11-28

申请人： Bruce Beauchamp ,  Andrew Tuthill ,  Joseph Fernandez ,  Anucha Phongsantichai

发明人： Bruce Beauchamp ,  Andrew Tuthill ,  Joseph Fernandez ,  Anucha Phongsantichai

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/4952 ,  H01L23/5382 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/85201 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/45139 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least two inner leads are connected to at least one of bond pads with a single bond wire. A single bond wire is ball or wedge bonded to a first bond pad or inner lead and subsequently wedge bonded to one or more second bond pads or inner leads, then it is connected to a third or last bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and/or inner lead(s). The bond pad(s) of the die and/or inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

摘要翻译： 一种集成电路器件，包括具有多个接合焊盘的集成电路管芯，所述接合焊盘选择性地连接到引线框架的多个内引线。 至少两个接合焊盘连接到内部引线中的至少一个，和/或至少两个内部引线与具有单键焊丝的至少一个接合焊盘连接。 单键线是球形或楔形结合到第一接合焊盘或内部引线，并且随后楔形结合到一个或多个第二接合焊盘或内部引线上，然后连接到第三或最后的接合焊盘或内部引线。 单键线在每个接合焊盘和/或内引线仅需要一个连接区域。 因此，引线框的管芯和/或内部引线的接合焊盘由此通过单键焊丝电连接在一起。

公开(公告)号：US06459616B1

公开(公告)日：2002-10-01

申请号：US09799328

申请日：2001-03-05

申请人： Bruce Beauchamp ,  Tom Salt

发明人： Bruce Beauchamp ,  Tom Salt

IPC分类号： G11C1604

CPC分类号： G11C16/10 ,  G11C16/0433

摘要： An EEPROM having reduced circuit loading of a high voltage write pulse by dividing an array of bit cells into two or more switchable common source segments. Only common source segments containing the bit cells being written to are connected, the other common source segments remain unconnected and do not contribute substantially to loading of the write pulse. Having multiple switchable common segmentations reduces the amount of parasitic capacitance connected in the EEPROM array during a write operation, thus reducing loading on the write circuits. Also reducing the number of bit cells having the common source segments connected during a write operation reduces the amount of leakage current contribution which adversely affects the write operation.

摘要翻译： 通过将位单元阵列划分成两个或多个可切换的公共源段，EEPROM具有降低的高电压写入脉冲的电路负载。 只有包含要写入的位单元的公共源段被连接，其他公共源段保持未连接，并且对于写入脉冲的加载没有显着贡献。 具有多个可切换的公共分段在写入操作期间减少了在EEPROM阵列中连接的寄生电容的量，从而减少了写入电路的负载。 还减少了在写入操作期间连接的共同源极段的位单元的数量减少了对写入操作产生不利影响的漏电流贡献量。