公开(公告)号：US06375008B2

公开(公告)日：2002-04-23

申请号：US09745805

申请日：2000-12-26

申请人： Bungo Shigeta ,  Hirofumi Abe ,  Yasuhiko Kitamura ,  Yoshio Hara ,  Masafumi Fukugawa ,  Akihisa Inoue ,  Norihiro Kadota ,  Koichi Nakatogawa

发明人： Bungo Shigeta ,  Hirofumi Abe ,  Yasuhiko Kitamura ,  Yoshio Hara ,  Masafumi Fukugawa ,  Akihisa Inoue ,  Norihiro Kadota ,  Koichi Nakatogawa

IPC分类号： B65D6516

CPC分类号： G03C3/00 ,  Y10T428/192 ,  Y10T428/197

摘要： A light-shielding packaging for a roll of continuous photosensitive web wound on a core having on its each end a light-shielding flange disc has at its leading end a heat-shrinkable light-shielding leader sheet having a thickness of 30 to 200 &mgr;m which shows a heat shrinkage ratio at 50° C. of lower than 1% both in the longitudinal and width directions and a heat shrinkage ratio at 100° C. in the range of 5% to 30% in the longitudinal direction and a heat shrinkage ratio at 100° C. of less than the heat shrinkage ratio in the longitudinal direction by 1% or more in the width direction. The leader sheet has a length larger than the length of the outermost convolution of the roll and a width larger than the distance between the outer face of one flange disc and the outer face of another flange disc, and each side portion of the leader sheet is light-tightly attached by heat shrinkage to the outer face of the flange disc at least at a portion adjacent to the periphery of the flange disc.

摘要翻译： 用于卷绕在芯上的连续感光卷卷的遮光包装，其每一端具有遮光法兰盘，其前端具有厚度为30至200μm的可热收缩的遮光前端片，其厚度为30至200μm， 在纵向和宽度方向上都显示在50℃下的热收缩率低于1％，在100℃下的热收缩率在纵向方向上为5％至30％，热收缩率 在100℃下的长度方向的热收缩率比宽度方向小1％以上。 前导片的长度大于卷的最外圈的长度，并且宽度大于一个法兰盘的外表面与另一法兰盘的外表面之间的距离，并且引导片的每个侧部分是 至少在与凸缘盘的周边相邻的部分处，通过热收缩轻轻地附着到凸缘盘的外表面。

公开(公告)号：US06179123B2

公开(公告)日：2001-01-30

申请号：US09466070

申请日：1999-12-17

申请人： Bungo Shigeta ,  Hirofumi Abe ,  Yasuhiko Kitamura ,  Yoshio Hara

发明人： Bungo Shigeta ,  Hirofumi Abe ,  Yasuhiko Kitamura ,  Yoshio Hara

IPC分类号： B65D6516

CPC分类号： G03C3/00 ,  Y10T428/24612

摘要： A light-shielding packaging for a roll of continuous photosensitive web wound on a core having on its both ends a light-shielding flange disc has at its leading end a heat-shrinkable light-shielding leader sheet having a thickness of 30 to 200 &mgr;m which shows a heat shrinkage ratio of 5 to 30% in the longitudinal direction of the web at a temperature in the range of 60 to 140° C. and a heat shrinkage ratio of less than 5% in its width direction at the same temperature. The leader sheet has a length larger than the length of the outermost convolution of the roll and a width larger than the distance between the outer face of one flange disc and the outer face of another flange disc, and each side portion of the leader sheet is light-tightly attached by heat shrinkage to the outer face of the flange disc at least at a portion adjacent to the periphery of the flange disc.

摘要翻译： 用于卷绕在芯上的连续感光卷卷的遮光包装在其两端具有遮光凸缘盘的前端具有厚度为30至200μm的可热收缩的遮光前端片，其中， 在60〜140℃的温度范围内的幅材的纵向的热收缩率为5〜30％，在相同温度下的宽度方向的热收缩率为5％以下。 前导片的长度大于卷的最外圈的长度，并且宽度大于一个法兰盘的外表面与另一法兰盘的外表面之间的距离，并且引导片的每个侧部分是 至少在与凸缘盘的周边相邻的部分处，通过热收缩轻轻地附着到凸缘盘的外表面。

公开(公告)号：US5855334A

公开(公告)日：1999-01-05

申请号：US874340

申请日：1997-06-13

申请人： Hirofumi Abe ,  Akihisa Inoue ,  Shinichi Takahashi

发明人： Hirofumi Abe ,  Akihisa Inoue ,  Shinichi Takahashi

IPC分类号： G03B27/58 ,  B65D85/671

CPC分类号： G03B27/588 ,  B65D2301/20 ,  Y10S229/93

摘要： A rectangular parallelepipedic case includes four or more walls formed by bending a single plate. To produce the case, a double plate is used. The double plate is formed from plastic by extrusion, and first and second plate elements confronted with each other. Partition portions interconnect the first and second plate elements, and extend in the direction of the extrusion, to define plural hollow chambers between the first and second plate elements. The double plate is bent along bend lines substantially at a right angle. At least one of the bend lines is at least partially curved.

摘要翻译： 长方体壳包括通过弯曲单个板形成的四个或更多个壁。 为了生产这种情况，使用双层板。 双板由塑料通过挤出形成，第一和第二板元件相互面对。 分隔部分将第一和第二板状元件相互连接，并在挤出方向上延伸，以在第一和第二板状元件之间限定多个中空室。 双板基本上以直角弯曲弯曲。 至少一条弯曲线至少部分弯曲。

公开(公告)号：US06789675B2

公开(公告)日：2004-09-14

申请号：US10212053

申请日：2002-08-06

申请人： Hirofumi Abe ,  Yoshio Hara ,  Reiko Furuya

发明人： Hirofumi Abe ,  Yoshio Hara ,  Reiko Furuya

IPC分类号： B65D8548

CPC分类号： B65D77/26 ,  B65D77/02 ,  G03C3/00

摘要： A light-sensitive material package includes a light-shielding envelope containing a stack of sheet-form light-sensitive material, the light-shielding envelope having heat-seal parts on four edges. The light-sensitive material package further includes a cushioning member, which holds down all or a part of the heat-seal parts. The light-sensitive material package further includes a fitting-type box for storing the envelope, the fitting-type box being formed from an inner box and a lid. The stiffness of the heat-seal parts is at least 0.05 N·cm.

摘要翻译： 感光材料包装包括一个包含片状感光材料的叠层的遮光罩，该遮光罩在四个边缘上具有热封部分。 感光材料包装还包括缓冲部件，其缓冲全部或一部分热封部件。 感光材料包装件还包括一个用于储存信封的装配型盒子，该装配型盒子由一个内箱和一个盖子形成。 热封部件的刚度至少为0.05N·cm。

公开(公告)号：US07268596B2

公开(公告)日：2007-09-11

申请号：US11220529

申请日：2005-09-08

申请人： Kingo Ota ,  Shoichi Okuda ,  Hirofumi Abe

发明人： Kingo Ota ,  Shoichi Okuda ,  Hirofumi Abe

IPC分类号： H03B1/00

CPC分类号： H03K17/04206 ,  H03K17/0822

摘要： A semiconductor device for driving a load includes a first semiconductor switching element interposed between a power supply terminal and a load, a second semiconductor switching element interposed between the load and a ground terminal, a high-side driver, a low-side driver, and a voltage regulator. The voltage regulator reduces a voltage applied to a control terminal of the second switching element, when a voltage of a load terminal of the second switching element is lower than a predetermined voltage. Then, a voltage applied between the load terminal and the ground terminal of the second switching element increases, and accordingly a voltage applied between the power supply terminal and the load terminal of the first switching element decreases.

摘要翻译： 用于驱动负载的半导体装置包括插入在电源端子和负载之间的第一半导体开关元件，插入在负载和接地端子之间的第二半导体开关元件，高侧驱动器，低侧驱动器和 电压调节器。 当第二开关元件的负载端子的电压低于预定电压时，电压调节器减小施加到第二开关元件的控制端子的电压。 然后，施加在第二开关元件的负载端子和接地端子之间的电压增加，因此施加在第一开关元件的电源端子和负载端子之间的电压降低。

公开(公告)号：US20060087348A1

公开(公告)日：2006-04-27

申请号：US11220529

申请日：2005-09-08

申请人： Kingo Ota ,  Shoichi Okuda ,  Hirofumi Abe

发明人： Kingo Ota ,  Shoichi Okuda ,  Hirofumi Abe

IPC分类号： H03B1/00

CPC分类号： H03K17/04206 ,  H03K17/0822

摘要： A semiconductor device for driving a load includes a first semiconductor switching element interposed between a power supply terminal and a load, a second semiconductor switching element interposed between the load and a ground terminal, a high-side driver, a low-side driver, and a voltage regulator. The voltage regulator reduces a voltage applied to a control terminal of the second switching element, when a voltage of a load terminal of the second switching element is lower than a predetermined voltage. Then, a voltage applied between the load terminal and the ground terminal of the second switching element increases, and accordingly a voltage applied between the power supply terminal and the load terminal of the first switching element decreases.

摘要翻译： 用于驱动负载的半导体装置包括插入在电源端子和负载之间的第一半导体开关元件，插入在负载和接地端子之间的第二半导体开关元件，高侧驱动器，低侧驱动器和 电压调节器。 当第二开关元件的负载端子的电压低于预定电压时，电压调节器减小施加到第二开关元件的控制端子的电压。 然后，施加在第二开关元件的负载端子和接地端子之间的电压增加，因此施加在第一开关元件的电源端子和负载端子之间的电压降低。

公开(公告)号：US06614282B2

公开(公告)日：2003-09-02

申请号：US10270808

申请日：2002-10-14

申请人： Hirofumi Abe ,  Hiroshi Fujii ,  Sinichi Noda ,  Hideaki Ishihara

发明人： Hirofumi Abe ,  Hiroshi Fujii ,  Sinichi Noda ,  Hideaki Ishihara

IPC分类号： H03K508

CPC分类号： H03M1/1295

摘要： A comparator, having an offset of 0.1V, compares a terminal voltage Vin1 with a clamp voltage VCL (5.1V). When an overvoltage input exceeding the VCL is entered to an input terminal, the comparator turns on a transistor Q11. The current flows across an externally provided resistor R11, the input terminal, and the transistor Q11, and flows into an output terminal of an operational amplifier. With a voltage drop at the resistor R11, the terminal voltage Vin1 starts decreasing toward an output voltage Vc of the operational amplifier.

摘要翻译： 具有0.1V偏移的比较器将终端电压Vin1与钳位电压VCL（5.1V）进行比较。 当超过VCL的过压输入被输入到输入端时，比较器接通晶体管Q11。 电流流过外部提供的电阻器R11，输入端子和晶体管Q11，并流入运算放大器的输出端。 在电阻器R11处具有电压降，端子电压Vin1开始朝向运算放大器的输出电压Vc降低。

公开(公告)号：US5625218A

公开(公告)日：1997-04-29

申请号：US491543

申请日：1995-06-16

申请人： Hideya Yamadera ,  Takeshi Ohwaki ,  Yasunori Taga ,  Makio Iida ,  Makoto Ohkawa ,  Hirofumi Abe ,  Yoshihiko Isobe

发明人： Hideya Yamadera ,  Takeshi Ohwaki ,  Yasunori Taga ,  Makio Iida ,  Makoto Ohkawa ,  Hirofumi Abe ,  Yoshihiko Isobe

IPC分类号： H01L23/525 ,  H01L27/10 ,  H01L29/00

CPC分类号： H01L23/5256 ,  H01L2924/0002

摘要： A fuse fusible type semiconductor device capable of reducing energy required for fusing and a production method of the semiconductor device. In a semiconductor device equipped with a heat-fusible thin film resistor, the thin film resistor formed on a substrate 1 through an insulating film 2 is made of chromium, silicon and tungsten, and films 7 and 8 of a insulator including silicon laminated on the upper surface of the fusing surface, aluminum films 5 are disposed on both sides of the fusing surface and a barrier film 4. This semiconductor device is produced by a lamination step of sequentially forming a first insulating film 2, a thin film resistor 3, a barrier film 4 and an aluminum film 5 on a substrate 1 for reducing drastically fusing energy, an etching step of removing the barrier film 4 and the aluminum film 5 from the fusing region 31 of the thin film resistor 3, and an oxide film formation step of depositing the insulator including silicon films 7 and 8.

摘要翻译： 一种能够降低熔融所需的能量的熔断器熔断型半导体器件和半导体器件的制造方法。 在配备有热熔薄膜电阻器的半导体装置中，通过绝缘膜2形成在基板1上的薄膜电阻由铬，硅和钨制成，并且包含硅的绝缘体的膜7和8层压在 定影表面的上表面，铝膜5设置在定影表面的两侧和阻挡膜4上。该半导体器件通过层叠步骤制造，顺序形成第一绝缘膜2，薄膜电阻3， 阻挡膜4和铝膜5，用于降低显着熔化能的蚀刻步骤，从薄膜电阻器3的熔融区域31去除阻挡膜4和铝膜5的蚀刻步骤以及氧化膜形成步骤 沉积包括硅膜7和8的绝缘体。

公开(公告)号：US5623442A

公开(公告)日：1997-04-22

申请号：US379480

申请日：1995-01-31

申请人： Hiroshi Gotou ,  Mamoru Kondo ,  Hirofumi Abe

发明人： Hiroshi Gotou ,  Mamoru Kondo ,  Hirofumi Abe

IPC分类号： G11C11/00 ,  G11C11/404 ,  G11C14/00 ,  G11C16/04 ,  G11C16/10 ,  G11C17/00 ,  H01L21/30 ,  H01L21/8247 ,  H01L27/105 ,  H01L29/788 ,  H01L29/792 ,  G11C11/40

CPC分类号： G11C11/005 ,  G11C11/404 ,  G11C14/00 ,  G11C16/10

摘要： An object of the present invention is to provide a DRAM of a special form, a non-volatile memory cell incorporating the DRAM, and a semiconductor device which incorporates a DRAM structure and a non-volatile memory cell and where data can be written and erased with high accuracy. The semiconductor memory device has a sub bit line BLs1 to which the main bit line BL1 is connected via a selector transistor Tr1, and non-volatile memory cells M1-Nn, i.e., memory transistors whose drain electrodes are connected to the sub bit line Bls1. An a-c pulse generator applies an a-c voltage to the control gates of the non-volatile memory cells M1-Nn. The DRAM cell is formed of a capacitor element formed of parasitic capacitance of the sub bit line BLs1 and the drain electrodes of the non-volatile memory cells connected to the bit line BLs1. An arbitrary non-volatile memory cell Mk is connected with the memory node N of a DRAM cell, thereby implementing a non-volatile memory cell or non-volatile memory device having DRAM functions. The DRAM cells may operate independently of the non-volatile memory cells. Data is temporarily stored in the DRAM cell and is then transferred to the non-volatile memory cell Mk, thereby writing and erasing data with high accuracy at higher speeds, and allowing miniaturization of a memory device.

摘要翻译： PCT No.PCT / JP94 / 00928 Sec。 371日期1995年1月31日 102（e）日期1995年1月31日PCT Filed 1994年6月8日PCT公布。 公开号WO95 / 02884 日期1995年1月26日本发明的目的是提供一种特殊形式的DRAM，并入DRAM的非易失性存储单元，以及结合DRAM结构和非易失性存储单元的半导体器件，其中数据 可以高精度写入和擦除。 半导体存储器件具有通过选择晶体管Tr1与主位线BL1连接的子位线BLs1，以及非易失性存储单元M1-Nn，即其漏电极连接到子位线B1s1的存储晶体管 。 a-c脉冲发生器将a-c电压施加到非易失性存储单元M1-Nn的控制栅极。 DRAM单元由与子位线BLs1的寄生电容和连接到位线BLs1的非易失性存储单元的漏极形成的电容器元件形成。 任意的非易失性存储单元Mk与DRAM单元的存储器节点N连接，从而实现具有DRAM功能的非易失性存储单元或非易失性存储器件。 DRAM单元可以独立于非易失性存储单元操作。 数据被暂时存储在DRAM单元中，然后传送到非易失性存储单元Mk，从而以更高的速度以高精度写入和擦除数据，并允许存储器件的小型化。

公开(公告)号：US20050238351A1

公开(公告)日：2005-10-27

申请号：US11113099

申请日：2005-04-25

申请人： Hirofumi Abe

发明人： Hirofumi Abe

IPC分类号： G03C5/00 ,  G03C1/76 ,  G03D3/08 ,  G03F7/26

CPC分类号： G03D3/08

摘要： A photographic light-sensitive material having a support having a thickness of from 160 to 225 μm is processed with an automatic developing apparatus, in which at least one of rollers of a developing part, a fixing part and a rinsing rack part of the automatic developing apparatus has a surface mainly containing a nonpolar polymer substance and having a center line surface roughness (Ra) of 20 μm or less. By using the automatic developing apparatus, dusts generated in the apparatus can be easily removed with a cleaning film.

摘要翻译： 具有160-225μm厚度的支撑体的照相感光材料用自动显影装置加工，其中自动显影装置中的显影部分，固定部分和清洗架部分中的至少一个辊子 装置具有主要包含非极性聚合物物质并且中心线表面粗糙度（Ra）为20μm以下的表面。 通过使用自动显影装置，可以用清洁膜容易地除去装置中产生的灰尘。