公开(公告)号：US07149072B2

公开(公告)日：2006-12-12

申请号：US11264486

申请日：2005-11-01

申请人： Byoung Hwa Lee ,  Hiroki Sato ,  Chang Hoon Shim ,  Sang Soo Park ,  Hae Suk Chung ,  Dong Seok Park ,  Min Cheol Park ,  Hyun Ju Yi ,  Min Kyoung Kwon ,  Seung Heon Han

发明人： Byoung Hwa Lee ,  Hiroki Sato ,  Chang Hoon Shim ,  Sang Soo Park ,  Hae Suk Chung ,  Dong Seok Park ,  Min Cheol Park ,  Hyun Ju Yi ,  Min Kyoung Kwon ,  Seung Heon Han

IPC分类号： H01G4/236 ,  H01G4/20

CPC分类号： H05K1/0231 ,  H01G2/065 ,  H01G4/228 ,  H01G4/30 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed herein is a multilayered chip capacitor array, including a capacitor body having a plurality of dielectric layers, a plurality of pairs of first and second inner electrodes which are formed on the plurality of dielectric layers such that one electrode of one pair of inner electrodes faces the other electrode of the one pair of inner electrodes with one of the plurality of dielectric layers interposed therebetween, at least one first outer terminal and a plurality of second outer terminals formed on at least one surface of a top surface and a bottom surface of the capacitor body, and at least one first conductive via and a plurality of second conductive vias formed in a stacking direction of the capacitor body and connected to the first outer terminal and the second outer terminal, respectively.

摘要翻译： 这里公开了一种多层片状电容器阵列，其包括具有多个电介质层的电容器主体，多对第一和第二内部电极，形成在多个电介质层上，使得一对内部电极的一个电极面 一对内电极的另一个电极与介于其间的多个电介质层中的一个介于其间，至少一个第一外端子和多个第二外端子形成在第一外端子的顶表面和底表面的至少一个表面上 电容器本体，以及至少一个第一导电通孔和多个第二导电通孔，其形成在电容器主体的堆叠方向上，分别连接到第一外部端子和第二外部端子。

公开(公告)号：US07035079B1

公开(公告)日：2006-04-25

申请号：US11247404

申请日：2005-10-11

申请人： Sang Soo Park ,  Dong Seok Park ,  Byoung Hwa Lee ,  Min Cheol Park ,  Hyun Ju Yi ,  Min Kyoung Kwon ,  Hae Suk Chung ,  Chang Hoon Shim ,  Seung Heon Han

发明人： Sang Soo Park ,  Dong Seok Park ,  Byoung Hwa Lee ,  Min Cheol Park ,  Hyun Ju Yi ,  Min Kyoung Kwon ,  Hae Suk Chung ,  Chang Hoon Shim ,  Seung Heon Han

IPC分类号： H01G4/005 ,  H01G4/236 ,  H01G4/20

CPC分类号： H01G4/232 ,  H01G4/012

摘要： The present invention provides an MLCC and an MLCC array. The MLCC has desirably low ESL properties by forming the first and second internal electrodes to be spaced apart from each other on the same dielectric layer while overlapping with other first and second internal electrodes on the neighboring dielectric layers, and connecting the first and second internal electrodes to the external terminals provided on the top surface or the bottom surface of the capacitor body through conductive via holes formed in the capacitor body in a stacking direction of the capacitor body.

摘要翻译： 本发明提供了MLCC和MLCC阵列。 通过在相同的电介质层上形成第一和第二内部电极彼此间隔开，同时与相邻电介质层上的其它第一和第二内部电极重叠，并且连接第一和第二内部电极 通过形成在电容器主体中的电容器本体的堆叠方向上的导电通孔，连接到设置在电容器主体的顶表面或底表面上的外部端子。

公开(公告)号：US07446922B2

公开(公告)日：2008-11-04

申请号：US11244605

申请日：2005-10-06

申请人： Seung Do An ,  Yoon Shik Hong ,  Seung Heon Han ,  Hyun Ju Yi

发明人： Seung Do An ,  Yoon Shik Hong ,  Seung Heon Han ,  Hyun Ju Yi

IPC分类号： G02B26/00

CPC分类号： G02B26/0808

摘要： Disclosed herein is an interdigitation-type diffractive light modulator. In the interdigitation-type diffractive light modulator of the present invention, each of a pair of ribbons has a plurality of diffractive branches which are arranged in a comb shape, and the diffractive branches of the ribbons interdigitate with each other. Furthermore, the respective ribbons moves upwards and downwards or, alternatively, one ribbon moves upwards and downwards, so that the diffractive branches of the ribbons which interdigitate with each other form a stepped structure, thus diffracting incident light.

摘要翻译： 这里公开了一种交叉指型衍射光调制器。 在本发明的交叉指型衍射光调制器中，一对带具有多个衍生分支，其梳状布置，并且色带的衍射分支彼此相互指向。 此外，相应的带子向上和向下移动，或者替代地，一个带状物向上和向下移动，使得相互交错的条带的衍射分支形成阶梯状结构，从而衍射入射光。

公开(公告)号：US07209276B2

公开(公告)日：2007-04-24

申请号：US11244562

申请日：2005-10-06

申请人： Yoon Shik Hong ,  Seung Do An ,  Seung Heon Han ,  Hyun Ju Yi

发明人： Yoon Shik Hong ,  Seung Do An ,  Seung Heon Han ,  Hyun Ju Yi

IPC分类号： G02B26/00

CPC分类号： G02B26/0808

摘要： Disclosed is a fishbone diffraction-type light modulator. In the fishbone diffraction-type light modulator, a lower micromirror is provided on a silicone substrate, and an upper micromirror is spaced apart from the silicone substrate and has a plurality of openings through both sides thereof. The upper micromirror and the lower micromirror deposited on the silicone substrate form pixels.

摘要翻译： 披露的是鱼骨衍射型光调制器。 在鱼骨衍射型光调制器中，在硅树脂基底上设置下微反射镜，并且上微镜与硅树脂基底间隔开，并且在其两侧具有多个开口。 沉积在硅树脂衬底上的上微镜和下微镜形成像素。

公开(公告)号：US10090858B2

公开(公告)日：2018-10-02

申请号：US15379110

申请日：2016-12-14

申请人： Yongwon Cho ,  Hynsoo Bae ,  Hyotaek Leem ,  Dong-Ryoul Lee ,  Hyun Ju Yi ,  Taehack Lee

发明人： Yongwon Cho ,  Hynsoo Bae ,  Hyotaek Leem ,  Dong-Ryoul Lee ,  Hyun Ju Yi ,  Taehack Lee

IPC分类号： H03M13/00 ,  H03M13/09 ,  G06F11/10

摘要： A storage device includes a nonvolatile memory device and a controller configured to read data from the nonvolatile memory device, to divide the read data into a plurality of segments, and to sequentially perform error correction decoding with respect to the plurality of segments. When the error correction decoding of each segment is completed, the controller adds error correction parity to each of the decoded segments and sends the decoded segments with added error correction parity to an external host device. When error correction decoding of a second segment is not completed after a threshold time has elapsed after sending a first segment of which error correction decoding is completed, the controller adds an incorrect error correction parity to dummy data and sends the dummy data with the added incorrect error correction parity to the external host device.

公开(公告)号：US20100227423A1

公开(公告)日：2010-09-09

申请号：US12779695

申请日：2010-05-13

申请人： Gi Ho JEONG ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

发明人： Gi Ho JEONG ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

IPC分类号： H01L33/62 ,  H01L33/48

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H05K1/056 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/49158 ,  Y10T29/49172 ,  H01L2924/00014

摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

摘要翻译： 本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。 绝缘树脂层形成在底座上。 电路图案形成在绝缘树脂层上。 光源模块安装在绝缘树脂层上并电连接到电路图案。 绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。 此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

公开(公告)号：US08779561B2

公开(公告)日：2014-07-15

申请号：US12779695

申请日：2010-05-13

申请人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

发明人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

IPC分类号： H01L23/58

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H05K1/056 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/49158 ,  Y10T29/49172 ,  H01L2924/00014

摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

摘要翻译： 本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。 绝缘树脂层形成在底座上。 电路图案形成在绝缘树脂层上。 光源模块安装在绝缘树脂层上并电连接到电路图案。 绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。 此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。

公开(公告)号：US20070221942A1

公开(公告)日：2007-09-27

申请号：US11723235

申请日：2007-03-19

申请人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

发明人： Gi Ho Jeong ,  Si Young Yang ,  Jae Wook Kwon ,  Jeong Hoon Park ,  Hyun Ju Yi ,  Choon Keun Lee

IPC分类号： H01L33/00 ,  H01L29/22

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01019 ,  H05K1/056 ,  H05K3/045 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/0108 ,  H05K2203/025 ,  Y10T29/49158 ,  Y10T29/49172 ,  H01L2924/00014

摘要： Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

摘要翻译： 本文公开了一种没有印刷电路板（PCB）的发光二极管（LED）背光单元。 LED背光单元包括底盘，绝缘树脂层和一个或多个光源模块。 绝缘树脂层形成在底座上。 电路图案形成在绝缘树脂层上。 光源模块安装在绝缘树脂层上并电连接到电路图案。 绝缘树脂层的厚度为200μm以下，通过在底盘上层叠固体膜绝缘树脂或者通过使用旋转涂布或刮刀涂布的成型方法将液体绝缘树脂施加到底架而形成。 此外，通过用金属材料填充绝缘树脂层的雕刻电路图案来形成电路图案。