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    Template for room temperature, low pressure micro-and nano-imprint lithography
    2.
    发明授权
    Template for room temperature, low pressure micro-and nano-imprint lithography 有权
    模板用于室温，低压微型和纳米压印光刻

    公开(公告)号：US06696220B2

    公开(公告)日：2004-02-24

    申请号：US09976681

    申请日：2001-10-12

    申请人： Todd Bailey ,  Byung J. Choi ,  Matthew Colburn ,  S. V. Sreenivasan ,  C. Grant Willson ,  John Ekerdt

    发明人： Todd Bailey ,  Byung J. Choi ,  Matthew Colburn ,  S. V. Sreenivasan ,  C. Grant Willson ,  John Ekerdt

    IPC分类号： G03C176

    CPC分类号： G11B5/855 ,  B29C35/0888 ,  B29C37/0053 ,  B29C43/003 ,  B29C2035/0827 ,  B29C2043/025 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00 ,  Y10S977/887

    摘要： Described are imprint lithography templates, methods of forming and using the templates, and a template holder device. An imprint lithography template may include a body with a plurality of recesses on a surface of the body. The body may be of a material that is substantially transparent to activating light. At least a portion of the plurality of recesses may define features having a feature size less than about 250 nm. A template may be formed by obtaining a material that is substantially transparent to activating light and forming a plurality or recesses on a surface of the template. In some embodiments, a template may further include at least one alignment mark. In some embodiments, a template may further include a gap sensing area. An imprint lithography template may be used to form an imprinted layer in a light curable liquid disposed on a substrate. During use, the template may be disposed within a template holder. The template holder may include a body with an opening configured to receive the template, a support plate, and at least one piezo actuator coupled to the body. The piezo actuator may be configured to alter a physical dimension of the template during use.

    摘要翻译： 描述了压印光刻模板，形成和使用模板的方法以及模板保持装置。 压印光刻模板可以包括在主体的表面上具有多个凹部的主体。 身体可以是对于激活光是基本上透明的材料。 多个凹部的至少一部分可以限定具有小于约250nm的特征尺寸的特征。 可以通过获得对于激活光而基本上透明并在模板的表面上形成多个或多个凹陷的材料来形成模板。 在一些实施例中，模板还可以包括至少一个对准标记。 在一些实施例中，模板还可以包括间隙感测区域。 可以使用压印光刻模板来在设置在基板上的可光固化液体中形成印刷层。 在使用期间，模板可以设置在模板保持器内。 模板保持器可以包括具有构造成接收模板的开口的主体，支撑板和耦合到主体的至少一个压电致动器。 压电致动器可以被配置为在使用期间改变模板的物理尺寸。

    Use of step and flash imprint lithography for direct imprinting of dielectric materials for dual damascene processing
    8.
    发明授权
    Use of step and flash imprint lithography for direct imprinting of dielectric materials for dual damascene processing 失效
    使用步进和闪光压印光刻技术直接刻印用于双镶嵌加工的介质材料

    公开(公告)号：US07691275B2

    公开(公告)日：2010-04-06

    申请号：US11363071

    申请日：2006-02-27

    申请人： C. Grant Willson ,  Frank Palmieri ,  Yukio Nishimura ,  Stephen C. Johnson ,  Michael D. Stewart

    发明人： C. Grant Willson ,  Frank Palmieri ,  Yukio Nishimura ,  Stephen C. Johnson ,  Michael D. Stewart

    IPC分类号： H01L21/302

    CPC分类号： H01L21/76817 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/76807 ,  H01L21/76828

    摘要： In some embodiments, the present invention is directed to methods that involve the combination of step-and-flash imprint lithography (SFIL) with a multi-tier template to simultaneously pattern multiple levels of, for example, an integrated circuit device. In such embodiments, the imprinted material generally does not serve or act as a simple etch mask or photoresist, but rather serves as the insulation between levels and lines, i.e., as a functional dielectric material. After imprinting and a multiple step curing process, the imprinted pattern is filled with metal, as in dual damascene processing. Typically, the two printed levels will comprise a “via level,” which is used to make electrical contact with the previously patterned under-level, and a “wiring level.” The present invention provides for the direct patterning of functional materials, which represents a significant departure from the traditional approach to microelectronics manufacturing.

    摘要翻译： 在一些实施例中，本发明涉及涉及步进和快速压印光刻（SFIL）与多层模板的组合以同时对例如集成电路器件的多个级别进行图案化的方法。 在这样的实施例中，压印材料通常不起到或用作简单的蚀刻掩模或光致抗蚀剂的作用，而是用作层和线之间的绝缘，即功能介电材料。 在印迹和多步固化过程之后，印刷图案充满金属，如在双镶嵌加工中。 通常，两个印刷层将包括用于与先前图案化的底层电接触的“通孔层”和“布线层”。本发明提供了功能材料的直接图案化，其代表 显着地偏离了传统的微电子制造方法。