METHOD AND APPARATUS FOR FORMING COATING LAYER WITH NANO MULTI-LAYER
    3.
    发明申请
    METHOD AND APPARATUS FOR FORMING COATING LAYER WITH NANO MULTI-LAYER 审中-公开
    用纳米多层形成涂层的方法和装置

    公开(公告)号:US20170009331A1

    公开(公告)日:2017-01-12

    申请号:US15174230

    申请日:2016-06-06

    摘要: Disclosed is a method and apparatus for forming a coating layer using a physical vapor deposition apparatus equipped with a sputtering apparatus and an arc ion plating apparatus, comprising: a first coating step of forming a Mo coating layer on a base material using a the sputtering apparatus and a Mo target and Ar gas; a nitrating step of forming a nitride film forming condition using an arc ion plating apparatus and Ar gas and N2 gas; a second coating step of forming a nano composite coating layer of Cr—Mo—N using the Mo target and Ar gas of the sputtering apparatus and the Ar gas, N2 gas and a Cr source of the arc ion plating apparatus at the same time; and a multi-coating step of forming a multi-layer having alternating Cr—Mo—N nano composite coating layers and Mo coating layers by revolving the base material around a central pivot.

    摘要翻译: 公开了一种使用具有溅射装置和电弧离子镀装置的物理气相沉积装置形成涂层的方法和装置,包括:第一涂覆步骤,使用溅射装置在基材上形成Mo涂层 和Mo靶和Ar气; 使用电弧离子镀装置和Ar气体和N 2气体形成氮化物成膜条件的硝化步骤; 使用溅射装置的Mo靶和Ar气体以及电弧离子电镀装置的Ar气体,N 2气体和Cr源同时形成Cr-Mo-N的纳米复合涂层的第二涂覆步骤; 以及通过使基材围绕中心枢轴旋转而形成具有交替的Cr-Mo-N纳米复合涂层和Mo涂层的多层的多涂层步骤。

    SOLID STATE ELECTROLYTE AND BARRIER ON LITHIUM METAL AND ITS METHODS
    7.
    发明申请
    SOLID STATE ELECTROLYTE AND BARRIER ON LITHIUM METAL AND ITS METHODS 审中-公开
    固体电解质和阻燃剂在锂金属及其方法上的应用

    公开(公告)号:US20150079481A1

    公开(公告)日:2015-03-19

    申请号:US14146446

    申请日:2014-01-02

    IPC分类号: C23C14/34 H01M6/40

    摘要: A method of fabricating an electrochemical device comprising a lithium metal electrode, may comprise: providing a substrate with a lithium metal electrode on the surface thereof; depositing a first layer of dielectric material on the lithium metal electrode, the depositing the first layer being sputtering Li3PO4 in an argon ambient; after the depositing the first layer, inducing and maintaining a nitrogen plasma over the first layer of dielectric material to provide ion bombardment of the first layer for incorporation of nitrogen therein; and after the depositing, the inducing and the maintaining, depositing a second layer of dielectric material on the ion bombarded first layer of dielectric material, the depositing the second layer being sputtering Li3PO4 in a nitrogen-containing ambient. Electrochemical devices may comprise a barrier layer between the lithium metal electrode and the LiPON electrolyte. Tools configured for fabricating the electrochemical devices comprising lithium metal electrodes are also described.

    摘要翻译: 制造包含锂金属电极的电化学装置的方法可以包括:在其表面上提供具有锂金属电极的基板; 在锂金属电极上沉积第一层电介质材料,沉积第一层是在氩气环境中溅射Li 3 PO 4; 在沉积第一层之后,在第一层电介质材料上诱导和维持氮等离子体以提供用于在其中引入氮的第一层的离子轰击; 并且在沉积之后,引入和维持沉积第二层电介质材料在离子轰击的第一介电材料层上,沉积第二层是在含氮环境中溅射Li 3 PO 4。 电化学装置可以包括在锂金属电极和LiPON电解质之间的阻挡层。 还描述了构造用于制造包括锂金属电极的电化学装置的工具。

    Pinhole-Free Dielectric Thin Film Fabrication
    8.
    发明申请
    Pinhole-Free Dielectric Thin Film Fabrication 有权
    无针孔介电薄膜制造

    公开(公告)号:US20120318664A1

    公开(公告)日:2012-12-20

    申请号:US13523790

    申请日:2012-06-14

    IPC分类号: C23C14/34

    摘要: A method of depositing a dielectric thin film may include: depositing a thin layer of dielectric; stopping deposition of the dielectric layer, and modifying the gas in the chamber if desired; inducing and maintaining a plasma in the vicinity of the substrate to provide ion bombardment of the deposited layer of dielectric; and repeating the depositing, stopping and inducing and maintaining steps until a desired thickness of dielectric is deposited. A variation on this method may include, in place of the repeating step: depositing a thick layer of lower quality dielectric; depositing a thin layer of high quality dielectric; stopping deposition of the dielectric layer, and modifying the gas in the chamber if desired; and inducing and maintaining a plasma in the vicinity of the substrate to provide ion bombardment of the deposited layer of dielectric. The thick layer of dielectric may be deposited more rapidly than the thin layers.

    摘要翻译: 沉积电介质薄膜的方法可以包括:沉积介电薄层; 阻止介电层的沉积,如果需要则改变腔中的气体; 在衬底附近诱导和维持等离子体,以提供沉积的电介质层的离子轰击; 并重复沉积,停止和引导和维持步骤,直到沉积所需的电介质厚度。 该方法的变型可以包括:代替重复步骤:沉积较厚质量的电介质层; 沉积一层高质量的电介质; 阻止介电层的沉积,如果需要则改变腔中的气体; 以及在衬底附近诱导和维持等离子体,以提供沉积的电介质层的离子轰击。 电介质的厚层可以比薄层更快地沉积。