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1.发明授权Methods of using sonication to couple a heat sink to a heat-generating component 失效使用超声处理将散热器耦合到发热部件的方法公开(公告)号：US07169245B2
公开(公告)日：2007-01-30
申请号：US11010912
申请日：2004-12-13
IPC分类号： B32B37/00
CPC分类号： H01L21/4882 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/12041 , Y10T428/12569 , H01L2224/0401
摘要： Methods of using subsonic and/or sonic forces to couple a heat sink to a heat-generating component are described. Heat sinks coupled to heat-generating components via thermal interface materials are also described.
摘要翻译： 描述了使用亚音速和/或声压将散热器耦合到发热部件的方法。 还描述了通过热界面材料耦合到发热部件的散热器。
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公开(公告)号：US07806560B2
公开(公告)日：2010-10-05
申请号：US12499171
申请日：2009-07-08
申请人： John C. Schultz , Andrew J. Ouderkirk , Joel S. Peiffer , Nelson B. O'Bryan , John A. Wheatley , Cameron T. Murray
发明人： John C. Schultz , Andrew J. Ouderkirk , Joel S. Peiffer , Nelson B. O'Bryan , John A. Wheatley , Cameron T. Murray
IPC分类号： F21V33/00
CPC分类号： H05K1/0203 , F21K9/00 , H01L2224/48091 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/3011 , H05K1/0373 , H05K1/189 , H05K3/0061 , H05K3/386 , H05K2201/0209 , H05K2201/091 , H05K2201/09363 , H05K2201/10106 , Y10S362/80 , H01L2924/00 , H01L2224/4554
摘要： An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.
摘要翻译： 照明组件包括柔性衬底，其包括由电绝缘层分隔开的第一和第二导电箔。 绝缘层包括装载有增强绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。
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公开(公告)号：US07744991B2
公开(公告)日：2010-06-29
申请号：US10449679
申请日：2003-05-30
CPC分类号： B32B5/18 , B32B5/20 , B32B7/06 , B32B27/205 , B32B2037/1215 , B32B2038/0028 , B32B2307/3065 , B32B2310/08 , C09J5/08 , C09J7/10 , C09J7/22 , C09J7/38 , C09J11/04 , C09J2201/36 , C09J2201/602 , C09J2201/618 , C09J2421/00 , C09J2423/00 , C09J2433/00 , C09J2453/00 , F28F2013/006 , H01L2924/0002 , Y10T428/249983 , Y10T428/249986 , Y10T428/249987 , Y10T428/249991 , Y10T428/249992 , Y10T428/28 , Y10T428/2891 , H01L2924/00
摘要： In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film.
摘要翻译： 在一个方面，本发明提供一种泡沫热界面材料，其包括泡沫膜，所述膜包含数均分子量大于25,000和至少25重量％的导热填料的聚合物热熔压敏粘合剂的共混物 所述膜具有至少占所述泡沫膜体积的5％的空隙体积。
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公开(公告)号：US20090273925A1
公开(公告)日：2009-11-05
申请号：US12499171
申请日：2009-07-08
申请人： John C. Schultz , Andrew J. Ouderkirk , Joel S. Peiffer , Nelson B. O'Bryan , John A. Wheatley , Cameron T. Murray
发明人： John C. Schultz , Andrew J. Ouderkirk , Joel S. Peiffer , Nelson B. O'Bryan , John A. Wheatley , Cameron T. Murray
CPC分类号： H05K1/0203 , F21K9/00 , H01L2224/48091 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/3011 , H05K1/0373 , H05K1/189 , H05K3/0061 , H05K3/386 , H05K2201/0209 , H05K2201/091 , H05K2201/09363 , H05K2201/10106 , Y10S362/80 , H01L2924/00 , H01L2224/4554
摘要： An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.
摘要翻译： 照明组件包括柔性衬底，其包括由电绝缘层分隔开的第一和第二导电箔。 绝缘层包括装载有增强绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。
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5.发明授权公开(公告)号：US07229683B2
公开(公告)日：2007-06-12
申请号：US10449156
申请日：2003-05-30
CPC分类号： C09J11/04 , C09J7/10 , C09J7/35 , C09J9/00 , C09J2433/00 , H01L23/42 , Y10S428/903 , Y10T428/249924 , Y10T428/249929 , Y10T428/24994 , Y10T428/2817
摘要： In one aspect, the invention provides a method of making a thermal interface material comprising the steps of: (a) providing a polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000; (b) melt-blending the polymer with at least 25 weight percent of a thermally conductive filler to form a mixture; and (c) forming the mixture of hot melt pressure sensitive adhesive and thermally conductive filler as a film. In another aspect, the invention may further comprise the steps of: providing a fire retardant and/or microfiber forming material; and/or irradiating the film with gamma or electron beam (E-beam) radiation or a combination of both to form a thermal interface material.
摘要翻译： 一方面，本发明提供一种制备热界面材料的方法，包括以下步骤：（a）提供数均分子量大于25,000的聚合物热熔压敏粘合剂; （b）将聚合物与至少25重量％的导热填料熔融共混以形成混合物; 和（c）形成热熔压敏粘合剂和导热填料的混合物作为薄膜。 另一方面，本发明还可以包括以下步骤：提供阻燃和/或微纤维形成材料; 和/或用γ或电子束（E-beam）辐射或两者的组合照射该膜以形成热界面材料。
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公开(公告)号：US20100218932A1
公开(公告)日：2010-09-02
申请号：US12778510
申请日：2010-05-12
CPC分类号： B32B5/18 , B32B5/20 , B32B7/06 , B32B27/205 , B32B2037/1215 , B32B2038/0028 , B32B2307/3065 , B32B2310/08 , C09J5/08 , C09J7/10 , C09J7/22 , C09J7/38 , C09J11/04 , C09J2201/36 , C09J2201/602 , C09J2201/618 , C09J2421/00 , C09J2423/00 , C09J2433/00 , C09J2453/00 , F28F2013/006 , H01L2924/0002 , Y10T428/249983 , Y10T428/249986 , Y10T428/249987 , Y10T428/249991 , Y10T428/249992 , Y10T428/28 , Y10T428/2891 , H01L2924/00
摘要： In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film.
摘要翻译： 在一个方面，本发明提供一种泡沫热界面材料，其包括泡沫膜，所述膜包含数均分子量大于25,000和至少25重量％的导热填料的聚合物热熔压敏粘合剂的共混物 所述膜具有至少占所述泡沫膜体积的5％的空隙体积。
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公开(公告)号：US20070177380A1
公开(公告)日：2007-08-02
申请号：US11669622
申请日：2007-01-31
申请人： John C. Schultz , Andrew J. Ouderkirk , Joel S. Peiffer , Nelson B. O'Bryan , John A. Wheatley , Cameron T. Murray
发明人： John C. Schultz , Andrew J. Ouderkirk , Joel S. Peiffer , Nelson B. O'Bryan , John A. Wheatley , Cameron T. Murray
IPC分类号： F21V21/00
CPC分类号： H05K1/189 , F21K9/00 , G02F1/133603 , G02F2001/133628 , H01L2224/48091 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/07811 , H01L2924/3011 , H05K1/0203 , H05K1/0373 , H05K1/0393 , H05K3/0061 , H05K3/386 , H05K2201/0209 , H05K2201/091 , H05K2201/09363 , H05K2201/10106 , Y10S362/80 , H01L2924/00 , H01L2224/4554
摘要： An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.
摘要翻译： 照明组件包括柔性衬底，其包括由电绝缘层分隔开的第一和第二导电箔。 绝缘层包括装载有增强绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。
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公开(公告)号：US08308991B2
公开(公告)日：2012-11-13
申请号：US12206942
申请日：2008-09-09
IPC分类号： H01B1/06
CPC分类号： H05K3/323 , C08L2666/02 , C08L2666/24 , C09J4/06 , C09J179/08 , H05K3/361 , H05K2201/0129 , H05K2201/0133 , H05K2201/0154 , Y10T428/10 , Y10T428/1059
摘要： Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.
摘要翻译： 提供了包含马来酰亚胺封端的聚酰亚胺树脂，与马来酰亚胺封端的聚酰亚胺树脂相容的热塑性树脂，液体橡胶和热活化的自由基固化剂的混合物的粘合剂组合物。 各种实施方案添加一种或多种硅烷偶联剂，具有酸官能团的烯属不饱和化合物，导电颗粒和导电稀松布。 还提供了使用组合物的方法。
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公开(公告)号：US07572031B2
公开(公告)日：2009-08-11
申请号：US11669622
申请日：2007-01-31
申请人： John C. Schultz , Andrew J Ouderkirk , Joel S. Peiffer , Nelson B. O'Bryan , John A. Wheatley , Cameron T. Murray
发明人： John C. Schultz , Andrew J Ouderkirk , Joel S. Peiffer , Nelson B. O'Bryan , John A. Wheatley , Cameron T. Murray
IPC分类号： F21V33/00
CPC分类号： H05K1/189 , F21K9/00 , G02F1/133603 , G02F2001/133628 , H01L2224/48091 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/07811 , H01L2924/3011 , H05K1/0203 , H05K1/0373 , H05K1/0393 , H05K3/0061 , H05K3/386 , H05K2201/0209 , H05K2201/091 , H05K2201/09363 , H05K2201/10106 , Y10S362/80 , H01L2924/00 , H01L2224/4554
摘要： An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.
摘要翻译： 照明组件包括柔性衬底，其包括由电绝缘层分隔开的第一和第二导电箔。 绝缘层包括装载有增强绝缘层导热性的颗粒的聚合物材料。 多个LED管芯设置在第一导电箔上。
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公开(公告)号：US20090087591A1
公开(公告)日：2009-04-02
申请号：US12206942
申请日：2008-09-09
IPC分类号： C09K19/02 , H01B1/20 , C09J179/08 , H05K1/00 , B32B27/20
CPC分类号： H05K3/323 , C08L2666/02 , C08L2666/24 , C09J4/06 , C09J179/08 , H05K3/361 , H05K2201/0129 , H05K2201/0133 , H05K2201/0154 , Y10T428/10 , Y10T428/1059
摘要： Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.
摘要翻译： 提供了包含马来酰亚胺封端的聚酰亚胺树脂，与马来酰亚胺封端的聚酰亚胺树脂相容的热塑性树脂，液体橡胶和热活化的自由基固化剂的混合物的粘合剂组合物。 各种实施方案添加一种或多种硅烷偶联剂，具有酸官能团的烯属不饱和化合物，导电颗粒和导电稀松布。 还提供了使用组合物的方法。
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