公开(公告)号：US07718984B2

公开(公告)日：2010-05-18

申请号：US11431474

申请日：2006-05-10

申请人： Carl S. Edwards ,  Michael Featherby ,  David J. Strobel

发明人： Carl S. Edwards ,  Michael Featherby ,  David J. Strobel

IPC分类号： G21F3/00 ,  G21F1/00 ,  G21F7/00

CPC分类号： G21F1/00 ,  G21F3/00 ,  G21Y2002/304 ,  G21Y2004/10

摘要： A composition for radiation shielding or range of compositions which compositions may be used for a variety of radiation shielding applications. With proper adhesive selection and processing, the construction forms an integral bond with the craft as compatible adhesives form strong bonds. This eliminates the potential for delaminating associated with the use of metallic layered shielding. While prior art protects electronics with a direct coating to electronic packages, this approach allows larger equipment systems, such as optics, or spectrometers, to be shielded.

摘要翻译： 用于辐射屏蔽的组合物或组合物的范围，该组合物可用于各种辐射屏蔽应用。 通过适当的粘合剂选择和加工，该构造与工艺形成了与粘合剂形成牢固结合的兼容粘合剂的整体粘合。 这消除了与使用金属层状屏蔽相关的分层的可能性。 虽然现有技术通过直接涂覆到电子封装来保护电子元件，但是该方法允许屏蔽更大的设备系统，例如光学器件或光谱仪。

公开(公告)号：US06583432B2

公开(公告)日：2003-06-24

申请号：US10247187

申请日：2002-09-18

申请人： Michael Featherby ,  David J. Strobel ,  Phillip J. Layton ,  Edward Li

发明人： Michael Featherby ,  David J. Strobel ,  Phillip J. Layton ,  Edward Li

IPC分类号： G21F100

CPC分类号： H05K9/0083 ,  H01L23/055 ,  H01L23/057 ,  H01L23/18 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K9/0088 ,  Y10T428/25 ,  Y10T428/256 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

公开(公告)号：US06261508B1

公开(公告)日：2001-07-17

申请号：US09375881

申请日：1999-08-17

申请人： Michael Featherby ,  David J. Strobel ,  Phillip J. Layton ,  Edward Li

发明人： Michael Featherby ,  David J. Strobel ,  Phillip J. Layton ,  Edward Li

IPC分类号： B29C7060

CPC分类号： H05K9/0083 ,  H01L23/055 ,  H01L23/057 ,  H01L23/18 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

摘要翻译： 本发明的辐射屏蔽组合物和方法涉及由密集堆积的辐射屏蔽颗粒的基质组成的共形涂层材料，其在粘合剂内分发。 屏蔽组合物被应用于要保护的物体，例如集成电路，或其包装物，以及用于保护包括人在内的动物不受外界空间或其他环境中的辐射的辐射。

公开(公告)号：US06455864B1

公开(公告)日：2002-09-24

申请号：US09727717

申请日：2000-11-30

申请人： Michael Featherby ,  David J. Strobel ,  Phillip J. Layton ,  Edward Li

发明人： Michael Featherby ,  David J. Strobel ,  Phillip J. Layton ,  Edward Li

IPC分类号： G21F300

CPC分类号： H05K9/0083 ,  H01L23/055 ,  H01L23/057 ,  H01L23/18 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K9/0088 ,  Y10T428/25 ,  Y10T428/256 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.

摘要翻译： 本发明的辐射屏蔽组合物和方法涉及由密集堆积的辐射屏蔽颗粒的基质组成的共形涂层材料，其在粘合剂内分发。 屏蔽组合物被应用于要保护的物体，例如集成电路，或其包装物，以及用于保护包括人在内的动物不受外界空间或其他环境中的辐射的辐射。

公开(公告)号：US5635754A

公开(公告)日：1997-06-03

申请号：US372289

申请日：1995-01-13

申请人： David J. Strobel ,  David R. Czajkowski

发明人： David J. Strobel ,  David R. Czajkowski

IPC分类号： H01L25/18 ,  H01L23/00 ,  H01L23/02 ,  H01L23/04 ,  H01L23/055 ,  H01L23/057 ,  H01L23/06 ,  H01L23/08 ,  H01L23/18 ,  H01L23/552 ,  H01L25/04 ,  H01L25/065 ,  H01L23/043

CPC分类号： H01L23/055 ,  H01L23/057 ,  H01L23/18 ,  H01L23/552 ,  H01L25/0655 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025

摘要： The radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose the integrated circuit die within, wherein the lid and the base are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high-Z material disposed between the integrated circuit die and a base, in combination with a high-Z material lid to substantially block incident radiation.

摘要翻译： 辐射屏蔽和封装的集成电路半导体器件包括固定到基座以将集成电路管芯封装在其内的盖，其中盖和基座各自由高Z材料构成以防止辐射穿过其中。 另一实施例包括由设置在集成电路管芯和基座之间的高Z材料构成的芯片附接块，与高Z材料盖组合以基本上阻挡入射辐射。

公开(公告)号：US5889316A

公开(公告)日：1999-03-30

申请号：US595266

申请日：1996-02-01

申请人： David J. Strobel ,  David R. Czajkowski

发明人： David J. Strobel ,  David R. Czajkowski

IPC分类号： G21F1/08 ,  G21F3/00 ,  H01L23/552 ,  H01L27/02 ,  H01L23/28

CPC分类号： H01L23/552 ,  G21F1/08 ,  G21F3/00 ,  H01L27/02 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10S257/921 ,  Y10S438/953

摘要： A new and improved process by which plastic material forming the plastic body package of an integrated circuit is selectively removed and replaced with a radiation shield having a specific formulation that is customized for a given radiation environment dependent upon the space application in which the integrated circuit is to be used.

摘要翻译： 选择性地移除形成集成电路的塑料主体封装的塑料材料的新的和改进的过程，并且用具有针对给定辐射环境定制的特定配方的辐射屏蔽替代，这取决于集成电路的空间应用 要使用的。

公开(公告)号：US06720493B1

公开(公告)日：2004-04-13

申请号：US09456631

申请日：1999-12-08

申请人： David J. Strobel ,  David R. Czajkowski

发明人： David J. Strobel ,  David R. Czajkowski

IPC分类号： H05K900

CPC分类号： H01L25/0655 ,  H01L23/055 ,  H01L23/057 ,  H01L23/18 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose an integrated circuit die within, wherein the lid and the base are each constructed from a high Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high Z material disposed between the integrated circuit die and the base, in combination with a high Z material lid to substantially block incident radiation.

摘要翻译： 辐射屏蔽和封装的集成电路半导体器件包括固定到基座以封装集成电路管芯的盖子，其中盖子和基座各自由高Z材料构成以防止辐射穿透其中。 另一个实施例包括由设置在集成电路管芯和基座之间的高Z材料构成的芯片附接块，与高Z材料盖组合以基本上阻挡入射辐射。

公开(公告)号：US5825042A

公开(公告)日：1998-10-20

申请号：US372235

申请日：1995-01-13

申请人： David J. Strobel ,  David R. Czajkowski

发明人： David J. Strobel ,  David R. Czajkowski

IPC分类号： G21F1/08 ,  G21F3/00 ,  H01L23/552 ,  H01L27/02

CPC分类号： H01L23/552 ,  G21F1/08 ,  G21F3/00 ,  H01L27/02 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10S257/921 ,  Y10S438/953

摘要： A new and improved process by which plastic material forming the plastic body package of an integrated circuit is selectively removed and replaced with a radiation shield having a specific formulation that is customized for a given radiation environment dependent upon the space application in which the integrated circuit is to be used.

公开(公告)号：US07148084B2

公开(公告)日：2006-12-12

申请号：US10821409

申请日：2004-04-09

申请人： David J. Strobel ,  David R. Czajkowski

发明人： David J. Strobel ,  David R. Czajkowski

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/0655 ,  H01L23/055 ,  H01L23/057 ,  H01L23/18 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/167 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose an integrated circuit die within, wherein the lid and the base are each constructed from a high Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high Z material disposed between the integrated circuit die and the base, in combination with a high Z material lid to substantially block incident radiation.

摘要翻译： 辐射屏蔽和封装的集成电路半导体器件包括固定到基座以封装集成电路管芯的盖子，其中盖子和基座各自由高Z材料构成以防止辐射穿透其中。 另一个实施例包括由设置在集成电路管芯和基座之间的高Z材料构成的芯片附接块，与高Z材料盖组合以基本上阻挡入射辐射。