公开(公告)号：US5237485A

公开(公告)日：1993-08-17

申请号：US602926

申请日：1990-10-22

申请人： Carlo Cognetti de Martiis ,  Bruno Murari

发明人： Carlo Cognetti de Martiis ,  Bruno Murari

IPC分类号： H01L23/40 ,  H05K1/02

CPC分类号： H01L23/4006 ,  H01L23/4093 ,  H05K1/0203 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K2201/10166 ,  H05K2201/10386 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K3/0061

摘要： A heat sink and method for heat sinking a package containing electronic components is described. The heat sinking is accomplished by use of a cooling plate located beneath a circuit board. The package having leads extending from more than one side of the package is positioned on the cooling plate so that the leads from the sides of the package can be electrically coupled to conductors on the circuit board wherein the circuit board is disposed about at least two and preferably three sides of the package. The package is secured to the cooling plate by a spring clip. The spring clip permits flexible positioning of the package relative to the cooling plate including positioning the package in close proximity of the edge of the cooling plate. Thermal conduction between the package and the cooling plate can be enhanced by the presence of a compressible thermally-conducting material. The circuit board preferably has an opening therein so as to permit the board to be in close proximity to the three sides of the package for increased connectibility.

摘要翻译： 描述了一种用于散热包含电子部件的包装的散热器和方法。 通过使用位于电路板下方的冷却板来实现散热。 具有从封装的多于一侧延伸的引线的封装被定位在冷却板上，使得来自封装侧面的引线可以电耦合到电路板上的导体，其中电路板被设置在至少两个和 最好是包装的三面。 包装通过弹簧夹固定到冷却板。 弹簧夹允许包装相对于冷却板的灵活定位，包括将包装定位在冷却板的边缘附近。 可以通过存在可压缩的导热材料来增强封装和冷却板之间的热传导。 电路板优选地具有开口，以允许电路板靠近封装的三个侧面，以增加可连接性。

公开(公告)号：US08482116B2

公开(公告)日：2013-07-09

申请号：US13130169

申请日：2009-11-10

申请人： Romain Coffy ,  Remi Brechignac ,  Carlo Cognetti de Martiis

发明人： Romain Coffy ,  Remi Brechignac ,  Carlo Cognetti de Martiis

IPC分类号： H01L23/04

CPC分类号： H01L25/50 ,  H01L21/565 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2224/0401

摘要： A semiconductor device includes at least one first component (5) (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer (2) is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer (8) is formed on the front face of the first component and on the first face of the support layer. An electrical connection network (9) within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component (11) (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network. Electrical connection vias (17) pass through the support layer and selectively connect the electrical connection network to an external electrical connection formed on a second face of the support layer.

摘要翻译： 半导体器件包括至少一个第一部件（5）（例如，第一集成电路），其具有设置有电连接焊盘的正面。 第一部件嵌入在支撑层（2）中，是使得第一部件的前表面不被覆盖并平行于支撑层的第一面的位置。 在第一部件的正面和支撑层的第一面上形成中间层（8）。 中间层内的电连接网络（9）选择性地连接到第一部件的电连接焊盘。 该装置还包括至少一个第二部件（11）（例如，第二集成电路，其中一个面放置在中间层的上方，并且具有选择性地连接到电连接网络的电连接焊盘）。电连接通孔（17）通过 通过支撑层并且将电连接网络选择性地连接到形成在支撑层的第二面上的外部电连接。

公开(公告)号：US4712127A

公开(公告)日：1987-12-08

申请号：US556159

申请日：1983-11-29

申请人： Piero Colombo ,  Marino Cellai ,  Carlo Cognetti de Martiis

发明人： Piero Colombo ,  Marino Cellai ,  Carlo Cognetti de Martiis

IPC分类号： H01L23/48 ,  H01L23/28 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/12

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L23/49562 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01079

摘要： A container for a semiconductor device has a metal plate and a body of synthetic resin which encapsulates a part of the plate, keeping a large surface thereof exposed. In the area separating the part encapsulated within the body of resin and the part without the resin, the plate has two opposed side notches and at least one groove connecting them.

摘要翻译： 用于半导体器件的容器具有金属板和合成树脂体，其封装该板的一部分，从而保持其表面的大部分露出。 在分离封装在树脂体内的部分和没有树脂的部分的区域中，板具有两个相对的侧切口和连接它们的至少一个凹槽。