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公开(公告)号：US09272497B2
公开(公告)日：2016-03-01
申请号：US13808422
申请日：2011-07-22
申请人： Chandrashekhar S. Khadilkar , Robert P. Blonski , Srinivasan Sridharan , Jackie D. Davis , John J. Maloney , James D. Walker , Andrew M. Rohn, Jr.
发明人： Chandrashekhar S. Khadilkar , Robert P. Blonski , Srinivasan Sridharan , Jackie D. Davis , John J. Maloney , James D. Walker , Andrew M. Rohn, Jr.
CPC分类号： B32B37/12 , B05D3/007 , C08K7/14 , C09D5/34 , C09D7/70 , H01L31/048 , H01L31/0481 , H01L31/0488 , H01L51/5246 , Y02E10/50 , Y10T428/1314
摘要： A glass-flake loaded organic sealant system is useful for sealing active layers such as those in electronic devices and solar cells.
摘要翻译： 玻璃片装载的有机密封剂系统可用于密封诸如电子设备和太阳能电池中的活性层的活性层。
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公开(公告)号：US20130164466A1
公开(公告)日：2013-06-27
申请号：US13808422
申请日：2011-07-22
申请人： Chandrashekhar S. Khadilkar , Robert P. Blonski , Srinivasan Sridharan , Jackie D. Davis , John J. Maloney , James D. Walker , Andrew M. Rohn, JR.
发明人： Chandrashekhar S. Khadilkar , Robert P. Blonski , Srinivasan Sridharan , Jackie D. Davis , John J. Maloney , James D. Walker , Andrew M. Rohn, JR.
CPC分类号： B32B37/12 , B05D3/007 , C08K7/14 , C09D5/34 , C09D7/70 , H01L31/048 , H01L31/0481 , H01L31/0488 , H01L51/5246 , Y02E10/50 , Y10T428/1314
摘要： A glass-flake loaded organic sealant system is useful for sealing active layers such as those in electronic devices and solar cells.
摘要翻译： 玻璃片装载的有机密封剂系统可用于密封诸如电子设备和太阳能电池中的活性层的活性层。
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公开(公告)号：US09499428B2
公开(公告)日：2016-11-22
申请号：US13947301
申请日：2013-07-22
申请人： John J. Maloney , Andrew M. Rohn, Jr. , Chandrashekhar S. Khadilkar , Srinivasan Sridharan , Robert P. Blonski , George E. Sakoske
发明人： John J. Maloney , Andrew M. Rohn, Jr. , Chandrashekhar S. Khadilkar , Srinivasan Sridharan , Robert P. Blonski , George E. Sakoske
IPC分类号： C03B23/24 , C03C3/066 , C03C3/072 , C03C3/093 , C03C8/04 , C03C8/10 , C03C8/24 , C03C23/00 , C03C27/00
CPC分类号： C03B23/245 , C03C3/066 , C03C3/072 , C03C3/093 , C03C8/04 , C03C8/10 , C03C8/24 , C03C23/001 , C03C27/00
摘要： Broadband infrared radiation is used to heat and fuse an enamel paste to form an enamel seal between at least two solid substrates such as glass, ceramic or metal.
摘要翻译： 宽带红外线辐射用于加热和熔化搪瓷膏，以在至少两个固体基底如玻璃，陶瓷或金属之间形成搪瓷密封。
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公开(公告)号：US09156735B2
公开(公告)日：2015-10-13
申请号：US13642553
申请日：2011-04-27
IPC分类号： H01L31/048 , C03C27/04 , H01L21/02 , H01L21/50 , H01L23/10 , C03C3/066 , C03C3/12 , C03C3/14 , C03C8/04 , C03C8/14 , H01L51/52
CPC分类号： C03C27/044 , C03C3/066 , C03C3/122 , C03C3/14 , C03C8/04 , C03C8/14 , H01L21/02345 , H01L21/50 , H01L23/10 , H01L31/0481 , H01L31/0488 , H01L51/5246 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , Y02E10/50 , H01L2924/00
摘要： Durable hermetic seals between two inorganic substrates are produced using a high-intensity electromagnetic energy source, such as laser, to heat and seal enamel layers with controlled absorption of high-intensity energy source. Durable hermetic seals incorporating electrical feedthroughs are also produced.
摘要翻译： 使用高强度电磁能源（例如激光）产生两个无机基底之间的耐久气密密封，以加热和密封具有受控吸收的高强度能量源的搪瓷层。 还生产结合电馈通的耐用气密密封件。
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公开(公告)号：US20130111953A1
公开(公告)日：2013-05-09
申请号：US13642553
申请日：2011-04-27
IPC分类号： C03C27/04
CPC分类号： C03C27/044 , C03C3/066 , C03C3/122 , C03C3/14 , C03C8/04 , C03C8/14 , H01L21/02345 , H01L21/50 , H01L23/10 , H01L31/0481 , H01L31/0488 , H01L51/5246 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , Y02E10/50 , H01L2924/00
摘要： Durable hermetic seals between two inorganic substrates are produced using a high-intensity electromagnetic energy source, such as laser, to heat and seal enamel layers with controlled absorption of high-intensity energy source. Durable hermetic seals incorporating electrical feedthroughs are also produced.
摘要翻译： 使用高强度电磁能源（例如激光）产生两个无机基底之间的耐久气密密封，以加热和密封具有受控吸收的高强度能量源的搪瓷层。 还生产结合电馈通的耐用气密密封件。
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公开(公告)号：US09969648B2
公开(公告)日：2018-05-15
申请号：US14240399
申请日：2012-09-12
申请人： Srinivasan Sridharan , George E. Sakoske , Chandrashekhar S. Khadilkar , Gregory R. Prinzbach , John J. Maloney
发明人： Srinivasan Sridharan , George E. Sakoske , Chandrashekhar S. Khadilkar , Gregory R. Prinzbach , John J. Maloney
CPC分类号： C03C27/10 , C03C8/04 , C03C8/14 , C03C8/18 , C03C8/22 , C03C8/24 , C04B37/005 , C04B2235/667 , C04B2237/10
摘要： A method of sealing at least two inorganic substrates together using an induction energy source comprising applying to at least one of the substrates a paste composition including a glass frit, and an induction coupling additive, bringing at least a second substrate into contact with the paste composition, and subjecting the substrates and paste to induction heating, thereby forming a hermetic seal between the two inorganic substrates.
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公开(公告)号：US20140299256A1
公开(公告)日：2014-10-09
申请号：US14240399
申请日：2012-09-12
申请人： Srinivasan Sridharan , George E. Sakoske , Chandrashekhar S. Khadilkar , Gregory R. Prinzbach , John J. Maloney
发明人： Srinivasan Sridharan , George E. Sakoske , Chandrashekhar S. Khadilkar , Gregory R. Prinzbach , John J. Maloney
CPC分类号： C03C27/10 , C03C8/04 , C03C8/14 , C03C8/18 , C03C8/22 , C03C8/24 , C04B37/005 , C04B2235/667 , C04B2237/10
摘要： A method of sealing at least two inorganic substrates together using an induction energy source comprising applying to at least one of the substrates a paste composition including a glass frit, and an induction coupling additive, bringing at least a second substrate into contact with the paste composition, and subjecting the substrates and paste to induction heating, thereby forming a hermetic seal between the two inorganic substrates.
摘要翻译： 一种使用感应能源将至少两种无机基材密封在一起的方法，包括将包含玻璃料的糊料组合物和感应耦合添加剂施加到至少一个基底上，使至少第二基底与糊料组合物接触 并对基板和浆料进行感应加热，从而在两个无机基板之间形成气密密封。
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公开(公告)号：US20130206230A1
公开(公告)日：2013-08-15
申请号：US13808571
申请日：2011-07-22
IPC分类号： B23K1/19 , B23K31/02 , H01L31/18 , H05K13/00 , H01L31/048
CPC分类号： B23K1/0008 , B23K1/0016 , B23K1/002 , B23K1/005 , B23K1/0053 , B23K1/0056 , B23K1/06 , B23K1/19 , B23K31/02 , B23K35/262 , C03C27/08 , H01G9/2077 , H01L23/10 , H01L31/048 , H01L31/0488 , H01L31/18 , H01L51/5246 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K13/00 , Y02E10/50 , Y10T156/10 , Y10T156/1062 , H01L2924/00
摘要： Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
摘要翻译： 焊接可用于将玻璃基板湿润并粘合在一起，以确保在电气和电子应用中比常规聚合物（热塑性或热塑性弹性体）密封件更好（更不易穿透）的气密密封。
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公开(公告)号：US09540274B2
公开(公告)日：2017-01-10
申请号：US13641046
申请日：2011-04-15
申请人： Srinivasan Sridharan , John J. Maloney , Chandrashekhar Khadilkar , Robert P. Blonski , David L. Widlewski
发明人： Srinivasan Sridharan , John J. Maloney , Chandrashekhar Khadilkar , Robert P. Blonski , David L. Widlewski
IPC分类号： C03C8/24 , C03C27/10 , H01L31/048 , B81C1/00 , H01L23/29 , H01L31/0203 , C03C8/22
CPC分类号： C03C8/24 , B81C1/00317 , B81C2203/019 , C03C8/22 , C03C27/10 , H01L23/291 , H01L31/0203 , H01L31/048 , H01L31/0481 , H01L2224/48091 , H01L2224/48465 , H01L2924/09701 , H01L2924/12044 , H01L2924/1461 , Y02E10/50 , Y10T428/1314 , H01L2924/00014 , H01L2924/00
摘要： Glasses comprising Bi203, ZnO B203 and optionally a colorant including an oxide of a metal such as iron, cobalt, manganese, nickel, copper and chromium are suitable to form hermetic seals in solar cell modules, architectural glass windows and MEMS devices. Glass frit and paste compositions suitable for flow and bonding to various substrates—glass, metal, silicon, in the temperature range of 400-500 degrees Centigrade. The broad compositional range in mole % is 25-70% Bi203, up to 65% ZnO, and 1-70% B203. Such glasses do not have batched in alumina or silica. Such glasses lack alumina and silica.
摘要翻译： 包括Bi 2 O 3，ZnO B 2 O 3和任选的包含金属如铁，钴，锰，镍，铜和铬的氧化物的着色剂的玻璃适合于在太阳能电池模块，建筑玻璃窗和MEMS装置中形成气密密封。 在400-500摄氏度的温度范围内适用于各种基材（玻璃，金属，硅）流动和粘合的玻璃料和糊状组合物。 摩尔％的广泛组成范围是25-70％Bi 2 O 3，高达65％的ZnO和1-70％的B 2 O 3。 这种玻璃没有在氧化铝或二氧化硅中分批。 这种玻璃缺乏氧化铝和二氧化硅。
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公开(公告)号：US09205505B2
公开(公告)日：2015-12-08
申请号：US13808571
申请日：2011-07-22
IPC分类号： B23K31/02 , B23K1/19 , H01L23/10 , H01L31/048 , H01L31/18 , H05K13/00 , B23K1/00 , H01G9/20 , H01L51/52
CPC分类号： B23K1/0008 , B23K1/0016 , B23K1/002 , B23K1/005 , B23K1/0053 , B23K1/0056 , B23K1/06 , B23K1/19 , B23K31/02 , B23K35/262 , C03C27/08 , H01G9/2077 , H01L23/10 , H01L31/048 , H01L31/0488 , H01L31/18 , H01L51/5246 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K13/00 , Y02E10/50 , Y10T156/10 , Y10T156/1062 , H01L2924/00
摘要： Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
摘要翻译： 焊接可用于将玻璃基板湿润并粘合在一起，以确保在电气和电子应用中比常规聚合物（热塑性或热塑性弹性体）密封件更好（更不易穿透）的气密密封。
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