公开(公告)号：US09666453B2

公开(公告)日：2017-05-30

申请号：US13546281

申请日：2012-07-11

申请人： Chang-Fu Lin ,  Ho-Yi Tsai ,  Chin-Tsai Yao

发明人： Chang-Fu Lin ,  Ho-Yi Tsai ,  Chin-Tsai Yao

IPC分类号： H01L21/56 ,  H01L23/498

CPC分类号： H01L23/49838 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3142 ,  H01L23/3675 ,  H01L23/49827 ,  H01L24/06 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/35121

摘要： A semiconductor package is provided, which includes: a substrate having a metal pattern layer; a semiconductor die formed on the substrate; and an underfill filled between the substrate and the semiconductor die. At least an opening is formed in the metal pattern layer to reduce the area of the metal pattern layer on the substrate, thereby reducing the contact area between the underfill and the metal pattern layer, hence eliminating the underfill delamination.

公开(公告)号：US20130299968A1

公开(公告)日：2013-11-14

申请号：US13546281

申请日：2012-07-11

申请人： Chang-Fu Lin ,  Ho-Yi Tsai ,  Chin-Tsai Yao

发明人： Chang-Fu Lin ,  Ho-Yi Tsai ,  Chin-Tsai Yao

IPC分类号： H01L23/498 ,  H01L21/28

CPC分类号： H01L23/49838 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3142 ,  H01L23/3675 ,  H01L23/49827 ,  H01L24/06 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/35121

摘要： A semiconductor package is provided, which includes: a substrate having a metal pattern layer; a semiconductor die formed on the substrate; and an underfill filled between the substrate and the semiconductor die. At least an opening is formed in the metal pattern layer to reduce the area of the metal pattern layer on the substrate, thereby reducing the contact area between the underfill and the metal pattern layer, hence eliminating the underfill delamination.

摘要翻译： 提供一种半导体封装，其包括：具有金属图案层的基板; 形成在所述基板上的半导体管芯; 以及填充在基板和半导体管芯之间的底部填充物。 在金属图案层中形成至少一个开口以减小基底上的金属图案层的面积，从而减小底部填充物和金属图案层之间的接触面积，从而消除了底部填充物的分层。

公开(公告)号：US20110198737A1

公开(公告)日：2011-08-18

申请号：US12769024

申请日：2010-04-28

申请人： Chin-Tsai Yao ,  Chien-Ping Huang ,  Chun-Chi Ke

发明人： Chin-Tsai Yao ,  Chien-Ping Huang ,  Chun-Chi Ke

IPC分类号： H01L23/552 ,  H01L21/60

CPC分类号： H01L24/96 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A quad flat non-leaded (QFN) package structure with an electromagnetic interference (EMI) shielding function is proposed, including: a lead frame having a die pad, a plurality of supporting portions connecting to the die pad and a plurality of leads disposed around the periphery of the die pad without connecting to the die pad; a chip mounted on the die pad; bonding wires electrically connecting the chip and the leads; an encapsulant for encapsulating the chip, the bonding wires and the lead frame and exposing the side and bottom surfaces of the leads and the bottom surface of the die pad; and a shielding film disposed on the top and side surfaces of the encapsulant and electrically connecting to the supporting portions for shielding from EMI. A method of fabricating the package structure as described above is further proposed.

摘要翻译： 提出了一种具有电磁干扰（EMI）屏蔽功能的四边形扁平非引线（QFN）封装结构，包括：具有管芯焊盘的引线框架，连接到管芯焊盘的多个支撑部分和围绕 裸片焊盘的周边不连接到管芯焊盘; 安装在芯片焊盘上的芯片; 电连接芯片和引线的接合线; 用于封装芯片，接合线和引线框架并暴露引线的侧表面和底表面以及管芯焊盘的底表面的密封剂; 以及屏蔽膜，其设置在密封剂的顶表面和侧表面上，并且电连接到用于屏蔽EMI的支撑部分。 进一步提出如上所述的制造封装结构的方法。

公开(公告)号：US20110175210A1

公开(公告)日：2011-07-21

申请号：US12769053

申请日：2010-04-28

申请人： Chin-Tsai Yao ,  Chien-Ping Huang ,  Chun-Chi Ke

发明人： Chin-Tsai Yao ,  Chien-Ping Huang ,  Chun-Chi Ke

IPC分类号： H01L23/552 ,  H01L21/78

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/78 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An EMI shielding package structure includes a substrate unit having a first surface with a die mounting area and a second surfaces opposite to the first surface, metallic pillars formed on the first surface, a chip mounted on and electrically connected to the die-mounting area, an encapsulant covering the chip and the first surface while exposing a portion of each of the metallic pillars from the encapsulant, and a shielding film enclosing the encapsulant and electrically connecting to the metallic pillars. A fabrication method of the above structure by two cutting processes is further provided. The first cutting process forms grooves by cutting the encapsulant. After a shielding film is formed in the grooves and electrically connected to the metallic pillars, the complete package structure is formed by the second cutting process, thereby simplifying the fabrication process while overcoming inferior grounding of the shielding film as encountered in prior techniques.

摘要翻译： EMI屏蔽封装结构包括具有第一表面和芯片安装区域的基板单元和与第一表面相对的第二表面，形成在第一表面上的金属柱，安装在芯片安装区域上并与之电连接的芯片， 在将所述金属柱的一部分从所述密封剂暴露出来的同时覆盖所述芯片和所述第一表面的密封剂以及封装所述密封剂并电连接到所述金属柱的屏蔽膜。 进一步提供通过两个切割工艺的上述结构的制造方法。 第一切割工艺通过切割密封剂形成凹槽。 在凹槽中形成屏蔽膜并与金属柱电连接之后，通过第二切割工艺形成完整的封装结构，从而在克服现有技术中遇到的屏蔽膜的不良接地的同时简化制造工艺。

公开(公告)号：US08963298B2

公开(公告)日：2015-02-24

申请号：US12769053

申请日：2010-04-28

申请人： Chin-Tsai Yao ,  Chien-Ping Huang ,  Chun-Chi Ke

发明人： Chin-Tsai Yao ,  Chien-Ping Huang ,  Chun-Chi Ke

IPC分类号： H01L23/552 ,  H01L23/00

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/78 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An EMI shielding package structure includes a substrate unit having a first surface with a die mounting area and a second surfaces opposite to the first surface, metallic pillars formed on the first surface, a chip mounted on and electrically connected to the die-mounting area, an encapsulant covering the chip and the first surface while exposing a portion of each of the metallic pillars from the encapsulant, and a shielding film enclosing the encapsulant and electrically connecting to the metallic pillars. A fabrication method of the above structure by two cutting processes is further provided. The first cutting process forms grooves by cutting the encapsulant. After a shielding film is formed in the grooves and electrically connected to the metallic pillars, the complete package structure is formed by the second cutting process, thereby simplifying the fabrication process while overcoming inferior grounding of the shielding film as encountered in prior techniques.

摘要翻译： EMI屏蔽封装结构包括具有第一表面和芯片安装区域的基板单元和与第一表面相对的第二表面，形成在第一表面上的金属柱，安装在芯片安装区域上并与之电连接的芯片， 在将所述金属柱的一部分从所述密封剂暴露出来的同时覆盖所述芯片和所述第一表面的密封剂以及封装所述密封剂并电连接到所述金属柱的屏蔽膜。 进一步提供通过两个切割工艺的上述结构的制造方法。 第一切割工艺通过切割密封剂形成凹槽。 在凹槽中形成屏蔽膜并与金属柱电连接之后，通过第二切割工艺形成完整的封装结构，从而在克服现有技术中遇到的屏蔽膜的不良接地的同时简化制造工艺。

公开(公告)号：US08736030B2

公开(公告)日：2014-05-27

申请号：US12769024

申请日：2010-04-28

申请人： Chin-Tsai Yao ,  Chien-Ping Huang ,  Chun-Chi Ke

发明人： Chin-Tsai Yao ,  Chien-Ping Huang ,  Chun-Chi Ke

IPC分类号： H01L23/552

CPC分类号： H01L24/96 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A quad flat non-leaded (QFN) package structure with an electromagnetic interference (EMI) shielding function is proposed, including: a lead frame having a die pad, a plurality of supporting portions connecting to the die pad and a plurality of leads disposed around the periphery of the die pad without connecting to the die pad; a chip mounted on the die pad; bonding wires electrically connecting the chip and the leads; an encapsulant for encapsulating the chip, the bonding wires and the lead frame and exposing the side and bottom surfaces of the leads and the bottom surface of the die pad; and a shielding film disposed on the top and side surfaces of the encapsulant and electrically connecting to the supporting portions for shielding from EMI. A method of fabricating the package structure as described above is further proposed.

摘要翻译： 提出了一种具有电磁干扰（EMI）屏蔽功能的四边形扁平非引线（QFN）封装结构，包括：具有管芯焊盘的引线框架，连接到管芯焊盘的多个支撑部分和围绕 裸片焊盘的周边不连接到管芯焊盘; 安装在芯片焊盘上的芯片; 电连接芯片和引线的接合线; 用于封装芯片，接合线和引线框架并暴露引线的侧表面和底表面以及管芯焊盘的底表面的密封剂; 以及屏蔽膜，其设置在密封剂的顶表面和侧表面上，并且电连接到用于屏蔽EMI的支撑部分。 进一步提出如上所述的制造封装结构的方法。