Laminated film for head applications
    5.
    发明授权
    Laminated film for head applications 有权
    用于头部应用的层压膜

    公开(公告)号:US07773341B2

    公开(公告)日:2010-08-10

    申请号:US11825034

    申请日:2007-07-03

    IPC分类号: G11B5/33

    CPC分类号: G11B5/3116 G11B5/1278

    摘要: A laminated main pole layer is disclosed in which a non-AFC scheme is used to break the magnetic coupling between adjacent high moment layers and reduce remanence in a hard axis direction while maintaining a high magnetic moment and achieving low values for Hch, Hce, and Hk. An amorphous material layer with a thickness of 3 to 20 Angstroms and made of an oxide, nitride, or oxynitride of one or more of Hf, Zr, Ta, Al, Mg, Zn, or Si is inserted between adjacent high moment stacks. The laminated structure also includes an alignment layer below each high moment layer within each stack. In one embodiment, a Ru coupling layer is inserted between two high moment layers in each stack to introduce an AFC scheme. An uppermost Ru layer is used as a CMP stop layer. A post annealing process may be employed to further reduce the anisotropy field (Hk).

    摘要翻译: 公开了一种层叠主极层,其中使用非AFC方案来破坏相邻的高力矩层之间的磁耦合,并且在保持高磁矩的同时降低硬轴方向的剩磁,并实现Hch,Hce和 Hk。 由Hf,Zr,Ta,Al,Mg,Zn或Si中的一种或多种的氧化物,氮化物或氧氮化物形成的厚度为3〜20埃的无定形材料层插入相邻的高强度叠层之间。 层叠结构还包括在每个堆叠内的每个高力矩层下面的对准层。 在一个实施例中,Ru耦合层插入每个堆叠中的两个高矩层之间以引入AFC方案。 使用最上层的Ru层作为CMP停止层。 可以采用后退火工艺来进一步降低各向异性场(Hk)。

    Laminated film for head applications
    6.
    发明申请
    Laminated film for head applications 有权
    用于头部应用的层压膜

    公开(公告)号:US20090009907A1

    公开(公告)日:2009-01-08

    申请号:US11825034

    申请日:2007-07-03

    IPC分类号: G11B5/127 G11B5/147

    CPC分类号: G11B5/3116 G11B5/1278

    摘要: A laminated main pole layer is disclosed in which a non-AFC scheme is used to break the magnetic coupling between adjacent high moment layers and reduce remanence in a hard axis direction while maintaining a high magnetic moment and achieving low values for Hch, Hce, and Hk. An amorphous material layer with a thickness of 3 to 20 Angstroms and made of an oxide, nitride, or oxynitride of one or more of Hf, Zr, Ta, Al, Mg, Zn, or Si is inserted between adjacent high moment stacks. The laminated structure also includes an alignment layer below each high moment layer within each stack. In one embodiment, a Ru coupling layer is inserted between two high moment layers in each stack to introduce an AFC scheme. An uppermost Ru layer is used as a CMP stop layer. A post annealing process may be employed to further reduce the anisotropy field (Hk).

    摘要翻译: 公开了一种层叠主极层,其中使用非AFC方案来破坏相邻的高力矩层之间的磁耦合,并且在保持高磁矩的同时降低硬轴方向的剩磁,并实现Hch,Hce和 Hk。 由Hf,Zr,Ta,Al,Mg,Zn或Si中的一种或多种的氧化物,氮化物或氧氮化物形成的厚度为3〜20埃的无定形材料层插入相邻的高强度叠层之间。 层叠结构还包括在每个堆叠内的每个高力矩层下面的对准层。 在一个实施例中,Ru耦合层插入每个堆叠中的两个高矩层之间以引入AFC方案。 使用最上层的Ru层作为CMP停止层。 可以采用后退火工艺来进一步降低各向异性场(Hk)。

    Robust protective layer for MTJ devices
    8.
    发明申请
    Robust protective layer for MTJ devices 审中-公开
    坚固的MTJ设备保护层

    公开(公告)号:US20070080381A1

    公开(公告)日:2007-04-12

    申请号:US11248965

    申请日:2005-10-12

    IPC分类号: H01L29/94

    摘要: MTJ devices commonly degrade when subjected to the heat treatments required by subsequent further processing. This problem has been overcome by protecting the MTJ's sidewalls with a two layer laminate. The first layer is laid down under oxygen-free conditions, no attempt being made to replace any oxygen that is lost during the deposition. This is followed immediately by the deposition of the second layer (usually, but not mandatorily, of the same material as the first layer) in the presence of some oxygen.

    摘要翻译: 当经过后续进一步处理所需的热处理时,MTJ装置通常会降解。 通过用双层层压板保护MTJ的侧壁已经克服了这个问题。 第一层被放置在无氧条件下,没有试图取代沉积过程中损失的任何氧气。 这是在存在一些氧气的情况下立即通过沉积第二层(通常但不强制地与第一层相同的材料)沉积。