公开(公告)号：US20130113095A1

公开(公告)日：2013-05-09

申请号：US13482313

申请日：2012-05-29

申请人： Chien-Lung Chuang ,  Po-Yi Wu ,  Meng-Tsung Lee ,  Yih-Jenn Jiang

发明人： Chien-Lung Chuang ,  Po-Yi Wu ,  Meng-Tsung Lee ,  Yih-Jenn Jiang

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L23/3157 ,  H01L24/13 ,  H01L2224/02126 ,  H01L2224/0231 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/03 ,  H01L2224/034 ,  H01L2224/0361 ,  H01L2224/03614 ,  H01L2224/03622 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05558 ,  H01L2224/05562 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/2064 ,  H01L2924/37001 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： A packaging substrate includes a base body having at least a conductive pad on a surface thereof, a dielectric layer formed on the surface of the base body and having at least a first opening for exposing the conductive pad and at least a second opening formed at a periphery of the first opening, and a metal layer formed on the conductive pad and the dielectric layer and extending to a sidewall of the second opening, thereby effectively eliminating side-etching of the metal layer under a solder bump.

摘要翻译： 封装基板包括基体，该基体在其表面上至少具有导电焊盘，形成在基体表面上的至少一个第一开口用于暴露导电焊盘的至少一个第二开口， 第一开口的周边，以及形成在导电焊盘和电介质层上并延伸到第二开口的侧壁的金属层，从而有效地消除了焊料凸块下方的金属层的侧蚀刻。