公开(公告)号：US20070162661A1

公开(公告)日：2007-07-12

申请号：US11317005

申请日：2005-12-27

Applicant: Pei-Yuan Fu ,  Chih-Chin Yang ,  Tai-Chieh Chen

Inventor： Pei-Yuan Fu ,  Chih-Chin Yang ,  Tai-Chieh Chen

IPC: G06F13/38

CPC classification number: G06F13/385

Abstract: A memory extension apparatus and the method of data transfer applied therein. The memory extension apparatus comprises a first interface, a protocol converter, a processor, a file system, a memory unit, and a trigger unit. The protocol converter receives a first command from the first electronic device via the first interface for converting the same. The processor receives the converted first command from the protocol converter, and utilizes the file system to access the memory unit for files corresponding to the converted first command. The trigger unit is for triggering the processor to generate a second command, for accessing the first electronic device through a pre-defined protocol when the trigger unit is triggered. Without sacrificing size and weight of the first electronic device, the invention provides memory extension, file backup, and file sharing without the need of an external host device.

Abstract translation: 一种应用于其中的存储器扩展装置和数据传输方法。 存储器扩展装置包括第一接口，协议转换器，处理器，文件系统，存储器单元和触发器单元。 协议转换器经由第一接口从第一电子设备接收第一命令以进行转换。 处理器从协议转换器接收转换后的第一命令，利用文件系统访问对应于转换的第一命令的文件的存储单元。 触发单元用于触发处理器产生第二命令，用于当触发单元触发时通过预定义的协议访问第一电子设备。 本发明在不牺牲第一电子设备的大小和重量的情况下提供存储器扩展，文件备份和文件共享，而不需要外部主机设备。

公开(公告)号：US20090023362A1

公开(公告)日：2009-01-22

申请号：US11778650

申请日：2007-07-17

Applicant: Tzu-Shin Chen ,  Chih-Chin Yang ,  Min-Hao Yeh ,  Kai-Chun Yang ,  Chan Lu ,  Tzu-Hui Wu ,  Cheng-Hsun Wu

Inventor： Tzu-Shin Chen ,  Chih-Chin Yang ,  Min-Hao Yeh ,  Kai-Chun Yang ,  Chan Lu ,  Tzu-Hui Wu ,  Cheng-Hsun Wu

IPC: B24B37/04 ,  B24B1/00 ,  B24B41/06

CPC classification number: B24B37/32 ,  B24B7/228

Abstract: A retaining ring for CMP is disclosed. The retaining ring has a plurality of grooves. The grooves have rounded sidewalls. Because the sidewalls of the grooves of the retaining ring are rounded, the slurry is not apt to accumulate around them and the pad is less scratched. Accordingly, the micro-scratches on the wafer surface are reduced and the yield of the CMP step is increased. Its operational method and application system are also disclosed in this invention.

Abstract translation: 公开了一种用于CMP的保持环。 保持环具有多个槽。 凹槽具有圆形的侧壁。 由于保持环的槽的侧壁是圆形的，所以浆料不易于在其周围积聚，并且垫较少划伤。 因此，晶片表面上的微划痕减小，并且CMP步骤的产量增加。 其操作方法和应用系统也在本发明中公开。

公开(公告)号：US20120289066A1

公开(公告)日：2012-11-15

申请号：US13430724

申请日：2012-03-27

Applicant: Kuo-Jung Wang ,  Chih-Chin Yang ,  Yu-Ming Chiu ,  Chun-Lung Hsiao ,  Ming-Chen Chiu ,  Jen-Hao Liu

Inventor： Kuo-Jung Wang ,  Chih-Chin Yang ,  Yu-Ming Chiu ,  Chun-Lung Hsiao ,  Ming-Chen Chiu ,  Jen-Hao Liu

IPC: H01R12/71

CPC classification number: H01R12/73 ,  H01R12/83

Abstract: A connector mechanism for connecting a board card is disclosed. The connector mechanism includes a circuit board, and a connector installed on the circuit board. An end of the board card is for inserting into the connector. The connector mechanism further includes a socket installed on the circuit board and located on a side of the connector, a rotating component pivoted to the socket, and at least one connecting component sliably installed on the rotating component and coupled to the circuit board for contacting with the other end of the board card so as to electrically connect to the board card as the end of the board card is inserted into the connector and the rotating component rotates to a connection position.

Abstract translation: 公开了一种用于连接板卡的连接机构。 连接器机构包括电路板和安装在电路板上的连接器。 板卡的一端用于插入连接器。 所述连接器机构还包括安装在所述电路板上且位于所述连接器一侧的插座，枢转到所述插座的旋转部件，以及至少一个可滑动地安装在所述旋转部件上并连接到所述电路板的连接部件， 板卡的另一端，以便当板卡的端部插入连接器中并且旋转部件旋转到连接位置时，电连接到板卡。

公开(公告)号：US07761647B2

公开(公告)日：2010-07-20

申请号：US11763457

申请日：2007-06-15

Applicant: Chih-Chin Yang

Inventor： Chih-Chin Yang

IPC: G06F13/00

CPC classification number: G06F13/385 ,  G06F3/0605 ,  G06F3/0661 ,  G06F3/0676

Abstract: A storage device with automatic-switching function is disclosed. When the storage device is coupled to a USB interface, the power provided by the USB interface turns the USB/SATA converter on to convert data from the USB interface into SATA format and transmit to a hard disk. When the storage device is coupled to a SATA interface instead of the USB interface, the power provided by the USB interface does not turn the USB/SATA converter on to convert data. In this way, the data from the SATA interface directly transmit to the hard disk.

Abstract translation: 公开了具有自动切换功能的存储装置。 当存储设备耦合到USB接口时，由USB接口提供的电源将USB / SATA转换器打开，将USB接口的数据转换为SATA格式并传输到硬盘。 当存储设备耦合到SATA接口而不是USB接口时，由USB接口提供的电源不会打开USB / SATA转换器来转换数据。 以这种方式，SATA接口的数据直接传输到硬盘。

公开(公告)号：US20090024786A1

公开(公告)日：2009-01-22

申请号：US11875964

申请日：2007-10-22

Applicant: Cheng-Sheng Chan ,  Chih-Chin Yang ,  Chia-Chang Lee

Inventor： Cheng-Sheng Chan ,  Chih-Chin Yang ,  Chia-Chang Lee

IPC: G06F12/02

CPC classification number: G06F12/0866 ,  G06F3/061 ,  G06F3/0656 ,  G06F3/0659 ,  G06F3/068 ,  G06F2212/222

Abstract: An external storage device includes a hard-drive, a flash memory, and a memory arrangement unit. The memory arrangement determines if the tag of the data accessed by a computer stored in the tag list of the memory arrangement unit and controls the hard-drive and the flash memory according to the result of the determination.

Abstract translation: 外部存储装置包括硬盘驱动器，闪速存储器和存储器布置单元。 存储器装置确定由存储在存储器配置单元的标签列表中的计算机访问的数据的标签是否根据确定的结果来控制硬盘驱动器和闪速存储器。

公开(公告)号：US20080070485A1

公开(公告)日：2008-03-20

申请号：US11532090

申请日：2006-09-14

Applicant: Chien-Hsuan Chen ,  Ho-Da Jiang ,  Chih-Yueh Li ,  Chih-Chin Yang ,  Cheng-Hsun Wu

Inventor： Chien-Hsuan Chen ,  Ho-Da Jiang ,  Chih-Yueh Li ,  Chih-Chin Yang ,  Cheng-Hsun Wu

IPC: B24B1/00

CPC classification number: B24B53/017 ,  B24B37/042

Abstract: A chemical mechanical polishing (CMP) process at least includes a polishing step and an ex-situ conditioning step, and the ex-situ conditioning step must be immediately performed after the polishing step. Therefore, it can save the process time. Furthermore, when applying to a CMP apparatus with several polishing regions, it can integrate these polishing regions having different polishing time in order to shorten total manufacturing time, thereby improving throughput.

Abstract translation: 化学机械抛光（CMP）工艺至少包括抛光步骤和非原位调节步骤，并且必须在抛光步骤之后立即进行外部位置调节步骤。 因此，可以节省处理时间。 此外，当施加到具有多个抛光区域的CMP装置时，可以将具有不同抛光时间的这些抛光区域整合，以缩短总制造时间，从而提高生产量。

公开(公告)号：US07051081B2

公开(公告)日：2006-05-23

申请号：US10172974

申请日：2002-06-18

Applicant: Chih-Chin Yang ,  Ming-Hsiao Hsieh

Inventor： Chih-Chin Yang ,  Ming-Hsiao Hsieh

IPC: G06F15/16

CPC classification number: G06Q10/087

Abstract: A server system and method is proposed for use with an automatic storage and retrieval system (AS/RS) to allow a user to perform AS/RS controls and access related inventory management data. The proposed AS/RS server system and method is characterized by the use of a point-to-point multiplex communication interface, such as a TCP/IP communication interface, instead of SQL server as in the case of the prior art, for performing data transmission between the control platform and the main server. The SQL server is only used for storing the history of user-issued commands and related AS/RS operating status data. Compared to the prior art, the proposed AS/RS server system and method allows the utilization of DCOM (Distributed Component Object Model) modules for control of the data exchange among the main server, the SQL server, and the control platform, so that it can be implemented without the use of QEODBC drivers, thereby eliminating the problems caused by the use of QEODBC driver in the prior art. In addition, the proposed AS/RS server system and method allows real-time synchronization in the data transmission between the control platform and the automatic storage and retrieval system, thereby making the AS/RS operation more efficient than the prior art.

Abstract translation: 提出了一种与自动存储和检索系统（AS / RS）一起使用的服务器系统和方法，以允许用户执行AS / RS控制并访问相关的库存管理数据。 所提出的AS / RS服务器系统和方法的特征在于使用诸如TCP / IP通信接口的点对点多路复用通信接口，而不是现有技术的SQL服务器，用于执行数据 控制平台与主服务器之间的传输。 SQL服务器仅用于存储用户发出的命令和相关AS / RS操作状态数据的历史记录。 与现有技术相比，提出的AS / RS服务器系统和方法允许使用DCOM（分布式组件对象模型）模块来控制主服务器，SQL服务器和控制平台之间的数据交换，从而使其 可以在不使用QEODBC驱动器的情况下实现，从而消除了在现有技术中使用QEODBC驱动器所引起的问题。 此外，所提出的AS / RS服务器系统和方法允许控制平台和自动存储和检索系统之间的数据传输中的实时同步，从而使AS / RS操作比现有技术更有效。

公开(公告)号：US08759219B2

公开(公告)日：2014-06-24

申请号：US13012211

申请日：2011-01-24

Applicant: Ya-Hsueh Hsieh ,  Teng-Chun Tsai ,  Wen-Chin Lin ,  Hsin-Kuo Hsu ,  Ren-Peng Huang ,  Chih-Hsien Chen ,  Chih-Chin Yang ,  Hung-Yuan Lu ,  Jen-Chieh Lin ,  Wei-Che Tsao

Inventor： Ya-Hsueh Hsieh ,  Teng-Chun Tsai ,  Wen-Chin Lin ,  Hsin-Kuo Hsu ,  Ren-Peng Huang ,  Chih-Hsien Chen ,  Chih-Chin Yang ,  Hung-Yuan Lu ,  Jen-Chieh Lin ,  Wei-Che Tsao

IPC: H01L21/331 ,  H01L21/463

CPC classification number: H01L21/7684 ,  H01L21/3212 ,  H01L29/4966 ,  H01L29/517

Abstract: A planarization method of manufacturing a semiconductor component is provided. A dielectric layer is formed above a substrate and defines a trench therein. A barrier layer and a metal layer are formed in sequence in the trench. A first planarization process is applied to the metal layer by using a first reactant so that a portion of the metal layer is removed. An etching rate of the first reactant to the metal layer is greater than that of the first reactant to the barrier layer. A second planarization process is applied to the barrier layer and the metal layer by using a second reactant so that a portion of the barrier layer and the metal layer are removed to expose the dielectric layer. An etching rate of the second reactant to the barrier layer is greater than that of the second reactant to the metal layer.

Abstract translation: 提供了制造半导体部件的平面化方法。 介电层形成在衬底之上并在其中限定沟槽。 在沟槽中依次形成阻挡层和金属层。 通过使用第一反应物将第一平面化工艺施加到金属层，使得金属层的一部分被去除。 第一反应物对金属层的蚀刻速率大于第一反应物对阻挡层的蚀刻速率。 通过使用第二反应物将阻挡层和金属层施加第二平坦化工艺，使得去除阻挡层和金属层的一部分以暴露电介质层。 第二反应物对阻挡层的蚀刻速率大于第二反应物对金属层的蚀刻速率。

公开(公告)号：US08579645B2

公开(公告)日：2013-11-12

申请号：US13430724

申请日：2012-03-27

Applicant: Kuo-Jung Wang ,  Chih-Chin Yang ,  Yu-Ming Chiu ,  Chun-Lung Hsiao ,  Ming-Chen Chiu ,  Jen-Hao Liu

Inventor： Kuo-Jung Wang ,  Chih-Chin Yang ,  Yu-Ming Chiu ,  Chun-Lung Hsiao ,  Ming-Chen Chiu ,  Jen-Hao Liu

IPC: H01R13/62

CPC classification number: H01R12/73 ,  H01R12/83

Abstract: A connector mechanism for connecting a board card is disclosed. The connector mechanism includes a circuit board, and a connector installed on the circuit board. An end of the board card is for inserting into the connector. The connector mechanism further includes a socket installed on the circuit board and located on a side of the connector, a rotating component pivoted to the socket, and at least one connecting component slidably installed on the rotating component and coupled to the circuit board for contacting with the other end of the board card so as to electrically connect to the board card as the end of the board card is inserted into the connector and the rotating component rotates to a connection position.

Abstract translation: 公开了一种用于连接板卡的连接机构。 连接器机构包括电路板和安装在电路板上的连接器。 板卡的一端用于插入连接器。 所述连接器机构还包括安装在所述电路板上且位于所述连接器一侧的插座，枢转到所述插座的旋转部件，以及至少一个可滑动地安装在所述旋转部件上并连接到所述电路板的连接部件， 板卡的另一端，以便当板卡的端部插入连接器中并且旋转部件旋转到连接位置时，电连接到板卡。

公开(公告)号：US20120187563A1

公开(公告)日：2012-07-26

申请号：US13012211

申请日：2011-01-24

Applicant: Ya-Hsueh HSIEH ,  Teng-Chun Tsai ,  Wen-Chin Lin ,  Hsin-Kuo Hsu ,  Ren-Peng Huang ,  Chih-Hsien Chen ,  Chih-Chin Yang ,  Hung-Yuan Lu ,  Jen-Chieh Lin ,  Wei-Che Tsao

Inventor： Ya-Hsueh HSIEH ,  Teng-Chun Tsai ,  Wen-Chin Lin ,  Hsin-Kuo Hsu ,  Ren-Peng Huang ,  Chih-Hsien Chen ,  Chih-Chin Yang ,  Hung-Yuan Lu ,  Jen-Chieh Lin ,  Wei-Che Tsao

IPC: H01L23/532 ,  H01L21/28

CPC classification number: H01L21/7684 ,  H01L21/3212 ,  H01L29/4966 ,  H01L29/517

Abstract: A planarization method of manufacturing a semiconductor component is provided. A dielectric layer is formed above a substrate and defines a trench therein. A barrier layer and a metal layer are formed in sequence in the trench. A first planarization process is applied to the metal layer by using a first reactant so that a portion of the metal layer is removed. An etching rate of the first reactant to the metal layer is greater than that of the first reactant to the barrier layer. A second planarization process is applied to the barrier layer and the metal layer by using a second reactant so that a portion of the barrier layer and the metal layer are removed to expose the dielectric layer. An etching rate of the second reactant to the barrier layer is greater than that of the second reactant to the metal layer.

Abstract translation: 提供了制造半导体部件的平面化方法。 介电层形成在衬底之上并在其中限定沟槽。 在沟槽中依次形成阻挡层和金属层。 通过使用第一反应物将第一平面化工艺施加到金属层，使得金属层的一部分被去除。 第一反应物对金属层的蚀刻速率大于第一反应物对阻挡层的蚀刻速率。 通过使用第二反应物将阻挡层和金属层施加第二平坦化工艺，使得去除阻挡层和金属层的一部分以暴露电介质层。 第二反应物对阻挡层的蚀刻速率大于第二反应物对金属层的蚀刻速率。