摘要:
An electrically erasable programmable logic device (EEPLD) includes a P type semiconductor substrate. An N type well is formed on the P type semiconductor substrate. A first PMOS transistor is formed on the N well. The first PMOS transistor comprises a floating gate, a first P+ doped region serving as a drain of the first PMOS transistor, and a P− doped region encompassing an N+ doped region for erasing the first PMOS transistor. A second PMOS transistor is also formed on the N well and serially connected to the first PMOS transistor. The first P+ doped region functions as a source of the second PMOS transistor, and the second PMOS transistor further comprises a select gate and a second P+ doped region serving as a drain of the second PMOS transistor.
摘要:
A method for forming an electrically programmable read-only memory(EPROM) includes forming a first p+ doped region, a second p+ doped region, and a third p+ doped region on an N-well, forming a control gate between the first p+ doped region and the second p+ doped region, and forming a p+ floating gate between the second p+ doped region and the third p+ doped region.
摘要:
A system on chip (SOC) contains a core circuit and an input/output (I/O) circuit embedded with an array of single-poly erasable programmable read only memory cells, each of which comprises a first PMOS transistor serially connected to a second PMOS transistor. The first and second PMOS transistors are both formed on an N-well of a P-type substrate. The first PMOS transistor includes a single-poly floating gate, a first P+ doped drain region and a first P+ doped source region, the second PMOS transistor includes a single-poly select gate and a second P+ doped source region, and the first P+ doped source region of the first PMOS transistor serves as a drain of the second PMOS transistor.
摘要:
A non-volatile memory formed on a first conductive type substrate is provided. The non-volatile memory includes a gate, a second conductive type drain region, a charge storage layer, and a second conductive type first lightly doped region. The gate is formed on the first conductive type substrate. The second conductive type drain region is formed in the first conductive type substrate at the first side of the gate. The charge storage layer is formed on the first conductive type substrate at the first side of the gate and between the second conductive type drain region and the gate. The second conductive type first lightly doped region is formed in the first conductive type substrate at the second side of the gate. The second side is opposite to the first side.
摘要:
A non-volatile memory formed on a first conductive type substrate is provided. The non-volatile memory includes a gate, a second conductive type drain region, a charge storage layer, and a second conductive type first lightly doped region. The gate is formed on the first conductive type substrate. The second conductive type drain region is formed in the first conductive type substrate at the first side of the gate. The charge storage layer is formed on the first conductive type substrate at the first side of the gate and between the second conductive type drain region and the gate. The second conductive type first lightly doped region is formed in the first conductive type substrate at the second side of the gate. The second side is opposite to the first side.
摘要:
A NVM device encompasses a MOS select transistor including a select gate electrically connected to a word line, a first source doping region electrically connected to a source line, and a first drain doping region. A MOS floating gate transistor is serially electrically connected to the MOS select transistor. The MOS floating gate transistor comprises a floating gate, a second source doping region electrically connected to the first drain doping region of the MOS select transistor, and a second drain doping region electrically connected to a bit line. The second source doping region and the second drain doping region define a floating gate channel. When the MOS floating gate transistor is programmed via a hot electron injection (HEI) mode, the floating gate is a P+ doped floating gate; when the MOS floating gate transistor is programmed via a hot hole injection (HHI) mode, the floating gate is an N+ doped floating gate.
摘要:
An electrically erasable programmable logic device (EEPLD) contains a P-type substrate. A first N-type doped region is disposed in the P-type substrate. A first gate, which is used to store data, overlies the P-type substrate and is adjacent to the first N-type doped region. A second N-type doped region is laterally disposed in the P-type substrate. The second N-type doped region is also adjacent to the first gate. A second gate, which acts as a select gate or select gate of the EEPLD, overlies the P-type substrate and is adjacent to the second N-type doped region. A third N-type doped region is disposed in the P-type substrate. The third N-type doped region is adjacent to the second gate. By Applying a sufficient voltage on the first N-type doped region (VBL), and changing a select gate voltage (VSG) or the third N-type doped region voltage (VSL) applied on the second gate of the EEPLD, the operation of the EEPLD can be selectively implemented either under a channel hot hole (CHH) program mode or a channel hot electron (CHE) erase mode.
摘要:
A single-poly non-volatile memory cell that is fully compatible with nano-scale semiconductor manufacturing process is provided. The single-poly non-volatile memory cell includes an ion well, a gate formed on the ion well, a gate dielectric layer between the gate and the ion well, a dielectric stack layer on sidewalls of the gate, a source doping region and a drain doping region. The dielectric stack layer includes a first oxide layer deposited on the sidewalls of the gate and extends to the ion well, and a silicon nitride layer formed on the first oxide layer. The silicon nitride layer functions as a charge-trapping layer.
摘要:
A non-volatile memory formed on a first conductive type substrate is provided. The non-volatile memory includes a gate, a second conductive type drain region, a charge storage layer, and a second conductive type first lightly doped region. The gate is formed on the first conductive type substrate. The second conductive type drain region is formed in the first conductive type substrate at the first side of the gate. The charge storage layer is formed on the first conductive type substrate at the first side of the gate and between the second conductive type drain region and the gate. The second conductive type first lightly doped region is formed in the first conductive type substrate at the second side of the gate. The second side is opposite to the first side.
摘要:
A single-poly non-volatile memory cell that is fully compatible with nano-scale semiconductor manufacturing process is provided. The single-poly non-volatile memory cell includes an ion well, a gate formed on the ion well, a gate dielectric layer between the gate and the ion well, a dielectric stack layer on sidewalls of the gate, a source doping region and a drain doping region. The dielectric stack layer includes a first oxide layer deposited on the sidewalls of the gate and extends to the ion well, and a silicon nitride layer formed on the first oxide layer. The silicon nitride layer functions as a charge-trapping layer.