Method and apparatus for providing excitation for a process controller
    1.
    发明授权
    Method and apparatus for providing excitation for a process controller 失效
    为过程控制器提供激励的方法和装置

    公开(公告)号:US07020535B1

    公开(公告)日:2006-03-28

    申请号:US10702877

    申请日:2003-11-06

    IPC分类号: G06F19/00

    摘要: A method includes defining a design window for a manufacturing process performed by a tool and a process window within the design window. A workpiece likely to have a characteristic outside the process window is identified. The characteristic of the identified workpiece is measured. A control model for controlling the tool is updated using the measured characteristic. A system includes a tool, a process controller, a metrology tool, and a sampling controller. The tool is adapted to process workpieces in accordance with a manufacturing process. The manufacturing process has an associated design window and a process window defined within the design window. The process controller is adapted to control the tool using a control model. The sampling controller is adapted to identify a workpiece likely to have a characteristic outside the process window and direct the metrology tool to measure the characteristic of the identified workpiece. The process controller is further adapted to update the control model using the measured characteristic.

    摘要翻译: 一种方法包括定义由设计窗口内的工具和处理窗口执行的制造过程的设计窗口。 识别出可能具有处理窗口外的特征的工件。 测量所识别的工件的特性。 使用测量特性更新用于控制刀具的控制模型。 系统包括工具,过程控制器,计量工具和采样控制器。 该工具适于根据制造过程处理工件。 制造过程具有关联的设计窗口和在设计窗口内定义的过程窗口。 过程控制器适用于使用控制模型来控制工具。 采样控制器适于识别可能具有处理窗口外的特征的工件,并引导计量工具测量所识别的工件的特性。 过程控制器还适于使用所测量的特征来更新控制模型。

    Updating process controller based upon fault detection analysis
    3.
    发明授权
    Updating process controller based upon fault detection analysis 失效
    基于故障检测分析更新过程控制器

    公开(公告)号:US06871114B1

    公开(公告)日:2005-03-22

    申请号:US10231713

    申请日:2002-08-30

    IPC分类号: G05B19/404 G06F19/00

    摘要: A method and an apparatus for adjusting a process controller based upon a fault detection analysis. A process step upon a workpiece is performed using a processing tool. Manufacturing data relating to processing of the workpiece is acquired. The manufacturing data may include metrology data relating to the processed workpiece and/or tool state data relating to the tool state of a processing tool. A metrology/tool state data integration process is performed based upon the acquired manufacturing data. The metrology/tool state data integration process includes performing an assessment of a tool health related to the processing tool and adjusting an emphasis of the metrology data based upon the assessment of the tool health.

    摘要翻译: 一种基于故障检测分析调整过程控制器的方法和装置。 使用加工工具进行工件的加工步骤。 获取与工件的加工有关的制造数据。 制造数据可以包括与处理工具有关的计量学数据和/或与加工工具的工具状态有关的刀具状态数据。 基于获取的制造数据执行计量/工具状态数据集成处理。 计量/工具状态数据集成过程包括对与处理工具相关的工具健康进行评估,并且基于对工具健康的评估来调整计量数据的重点。

    Method of controlling exposure processes by monitoring photon levels, and system for accomplishing same
    4.
    发明授权
    Method of controlling exposure processes by monitoring photon levels, and system for accomplishing same 有权
    通过监控光子水平来控制曝光过程的方法以及完成相同的系统

    公开(公告)号:US07186487B1

    公开(公告)日:2007-03-06

    申请号:US10771109

    申请日:2004-02-03

    申请人: Robert J. Chong

    发明人: Robert J. Chong

    IPC分类号: G03C5/00

    CPC分类号: G03F7/70558 G03B7/00

    摘要: The present invention is generally directed to various methods of controlling exposure processes by monitoring photon levels, and various systems for accomplishing same. In one embodiment, the method comprises performing an exposure process by generating light comprised of a number of photons from a light source to expose at least a portion of a layer of photo-sensitive material, counting a number of photons incident on at least a portion of the layer of photo-sensitive material, and controlling at least one of a duration of the exposure process and an irradiance of the light source based upon the counted number of photons. In another illustrative embodiment, the method comprises performing an exposure process by generating light comprised of a number of photons from a light source to expose at least a portion of a layer of photo-sensitive material, determining a rate at which the photons impact at least a portion of the layer of photo-sensitive material, and controlling at least one of a duration of the exposure process and an irradiance of the light source based upon the determined rate of the photons impacting the layer of photo-sensitive material.

    摘要翻译: 本发明一般涉及通过监控光子水平来控制曝光过程的各种方法以及用于实现其的各种系统。 在一个实施例中,该方法包括通过产生由来自光源的多个光子组成的光来曝光光敏材料层的至少一部分,对入射在至少一部分上的光子计数 的光敏材料层,并且基于计数的光子数来控制曝光过程的持续时间和光源的辐照度中的至少一个。 在另一说明性实施例中,该方法包括通过产生由光源产生的多个光子的光进行曝光处理,以暴露光敏材料层的至少一部分,确定光子至少影响的速率 光敏材料层的一部分,并且基于影响光敏材料层的光子的确定速率来控制曝光过程的持续时间和光源的辐照度中的至少一个。

    Method and apparatus for controlling a fabrication process based on a measured electrical characteristic
    6.
    发明授权
    Method and apparatus for controlling a fabrication process based on a measured electrical characteristic 有权
    基于测量的电气特性来控制制造工艺的方法和装置

    公开(公告)号:US06912437B2

    公开(公告)日:2005-06-28

    申请号:US10262620

    申请日:2002-09-30

    IPC分类号: H01L21/66 G06F19/00

    CPC分类号: H01L22/20 H01L22/12

    摘要: A method includes performing at least one process for forming a feature of a semiconductor device in accordance with an operating recipe. An electrical performance characteristic of the feature is measured. The measured electrical performance characteristic is compared to a target value for the electrical performance characteristic. At least one parameter of the operating recipe is determined based on the comparison. A system includes a process tool, a metrology tool, and a controller. The process tool is configured to perform at least one process for forming a feature of a semiconductor device in accordance with an operating recipe. The metrology tool is configured to measure an electrical performance characteristic of the feature. The controller is configured to compare the measured electrical performance characteristic to a target value for the electrical performance characteristic and determine at least one parameter of the operating recipe based on the comparison.

    摘要翻译: 一种方法包括根据操作配方执行用于形成半导体器件的特征的至少一个处理。 测量该特征的电气性能特征。 将测量的电性能特性与电性能特性的目标值进行比较。 基于比较确定操作配方的至少一个参数。 系统包括处理工具,计量工具和控制器。 处理工具被配置为执行根据操作配方形成半导体器件的特征的至少一个处理。 测量工具被配置为测量该特征的电性能特征。 控制器被配置为将测量的电性能特性与电性能特性的目标值进行比较,并且基于该比较确定操作配方的至少一个参数。

    Method and apparatus for dynamically monitoring controller tuning parameters
    9.
    发明授权
    Method and apparatus for dynamically monitoring controller tuning parameters 有权
    动态监控控制器调谐参数的方法和装置

    公开(公告)号:US06961636B1

    公开(公告)日:2005-11-01

    申请号:US10126172

    申请日:2002-04-19

    摘要: A method includes processing a plurality of workpieces in accordance with an operating recipe. Metrology data associated with the processing is collected. A control model including at least one tuning parameter having a default value is provided. A plurality of perturbations is introduced to shift the tuning parameter from its default value. Control actions are generated based on the metrology data and the perturbations to the tuning parameter in the control model to modify the operating recipe. An error signal associated with each of the perturbations is generated. The default value of the tuning parameter is modified based on the error signals.

    摘要翻译: 一种方法包括根据操作配方处理多个工件。 收集与处理相关的计量数据。 提供了包括具有默认值的至少一个调谐参数的控制模型。 引入多个扰动以从其默认值移位调谐参数。 基于测量数据和控制模型中的调谐参数的扰动来生成控制动作,以修改操作配方。 产生与每个扰动相关联的误差信号。 调整参数的默认值根据错误信号进行修改。