SYSTEM AND METHOD FOR WIRELESS BIOSENSOR MONITORING
    1.
    发明申请
    SYSTEM AND METHOD FOR WIRELESS BIOSENSOR MONITORING 有权
    无线生物传感器监测的系统和方法

    公开(公告)号:US20130018235A1

    公开(公告)日:2013-01-17

    申请号:US13511580

    申请日:2010-11-24

    IPC分类号: A61B5/07

    摘要: A system and method for monitoring a physical parameter of a subject is provided. The system may include a casing with a sensor coupled to the casing. The sensor may be configured to detect a physical parameter of the subject. The physical parameter may include a chemical parameter of the subject. The system includes an endoscopic clip coupled to the casing and may include a wireless transmitter for transmitting a signal via a wireless medium. The signal encodes the physical parameter of the subject detected by the sensor and the wireless transmitter is electronically connected to the endoscopic clip. The system may further include a monitor configured to communicate with the wireless transmitter for receiving the signal encoding the physical parameter of the subject.

    摘要翻译: 提供了一种用于监测被摄体的物理参数的系统和方法。 该系统可以包括具有耦合到壳体的传感器的壳体。 传感器可以被配置为检测对象的物理参数。 物理参数可以包括受试者的化学参数。 该系统包括耦合到壳体的内窥镜夹子,并且可以包括用于经由无线介质发送信号的无线发射器。 信号编码由传感器检测到的被摄体的物理参数,并且无线发射器电连接到内窥镜夹。 系统还可以包括监视器,其被配置为与无线发射器进行通信,用于接收编码对象的物理参数的信号。

    ENDOSCOPIC GASTRIC BYPASS DEFECT REPAIR
    3.
    发明申请
    ENDOSCOPIC GASTRIC BYPASS DEFECT REPAIR 有权
    内窥镜旁路缺损修复

    公开(公告)号:US20100268022A1

    公开(公告)日:2010-10-21

    申请号:US11909728

    申请日:2006-04-05

    摘要: The invention relates to systems or kits and methods for repairing defects in gastric bypass operations, e.g., methods of closing intragastric fistulas (18, 20) and dilated gastrojejunal anastomoses. In various embodiments, an endoscopic suturing device (23) is inserted through a patient's mouth, down through the esophagus, and positioned in the region of the defect, e.g., fistula. Adjacent tissue is then acquired, e.g., by vacuum, and one or more stitches are placed through the tissue and tightened to at least partially close the fistula, forming a suture line. One or more reinforcing clips (30) and sealant (32) can be endoscopically applied to the suture line

    摘要翻译: 本发明涉及用于修复胃旁路操作缺陷的系统或试剂盒和方法,例如关闭胃内瘘(18,20)和扩张的胃肠吻合术的方法。 在各种实施例中,内窥镜缝合装置(23)通过患者的口插入穿过食道,并且定位在缺损区域,例如瘘管中。 然后例如通过真空获取相邻的组织,并且通过组织放置一个或多个缝合并且紧固至少部分地闭合瘘管,形成缝合线。 一个或多个加强夹(30)和密封剂(32)可以内窥镜施加到缝合线

    Endoscopic gastric bypass defect repair
    5.
    发明授权
    Endoscopic gastric bypass defect repair 有权
    内镜胃旁路缺损修复

    公开(公告)号:US08623009B2

    公开(公告)日:2014-01-07

    申请号:US11909728

    申请日:2006-04-05

    IPC分类号: A61B18/04

    摘要: The invention relates to systems or kits and methods for repairing defects in gastric bypass operations, e.g., methods of closing intragastric fistulas (18, 20) and dilated gastrojejunal anastomoses. In various embodiments, an endoscopic suturing device (23) is inserted through a patient's mouth, down through the esophagus, and positioned in the region of the defect, e.g., fistula. Adjacent tissue is then acquired, e.g., by vacuum, and one or more stitches are placed through the tissue and tightened to at least partially close the fistula, forming a suture line. One or more reinforcing clips (30) and sealant (32) can be endoscopically applied to the suture line.

    摘要翻译: 本发明涉及用于修复胃旁路操作缺陷的系统或试剂盒和方法,例如关闭胃内瘘(18,20)和扩张的胃肠吻合术的方法。 在各种实施例中,内窥镜缝合装置(23)通过患者的口插入穿过食道,并且定位在缺损区域,例如瘘管中。 然后例如通过真空获取相邻的组织,并且通过组织放置一个或多个缝合并且紧固至少部分地闭合瘘管,形成缝合线。 一个或多个加强夹(30)和密封剂(32)可以内窥镜施加到缝合线。

    Use of CMP for aluminum mirror and solar cell fabrication
    6.
    发明授权
    Use of CMP for aluminum mirror and solar cell fabrication 有权
    使用CMP用于铝镜和太阳能电池制造

    公开(公告)号:US08062096B2

    公开(公告)日:2011-11-22

    申请号:US11173518

    申请日:2005-06-30

    IPC分类号: B24B1/00

    摘要: The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition comprising an abrasive, an agent that oxidizes aluminum, and a liquid carrier, and abrading at least a portion of the surface to remove at least some aluminum from the substrate and to polish the surface of the substrate, wherein the abrasive is in particulate form and is suspended in the liquid carrier.

    摘要翻译: 本发明涉及一种抛光包含铝的基材的表面的方法,包括使基材的表面与抛光垫接触,以及抛光组合物,其包含研磨剂,氧化铝的试剂和液体载体,并在 至少一部分表面以从衬底去除至少一些铝并抛光衬底的表面,其中磨料是颗粒形式并悬浮在液体载体中。

    CMP of copper/ruthenium substrates
    7.
    发明授权
    CMP of copper/ruthenium substrates 有权
    铜/钌基板的CMP

    公开(公告)号:US07265055B2

    公开(公告)日:2007-09-04

    申请号:US11259645

    申请日:2005-10-26

    IPC分类号: H01L21/302

    CPC分类号: H01L21/3212 C09G1/02 C23F3/04

    摘要: The invention provides a method of chemically-mechanically polishing a substrate. A substrate comprising ruthenium and copper is contacted with a chemical-mechanical polishing system comprising a polishing component, hydrogen peroxide, an organic acid, at least one heterocyclic compound comprising at least one nitrogen atom, and water. The polishing component is moved relative to the substrate, and at least a portion of the substrate is abraded to polish the substrate. The pH of the polishing system is about 6 to about 12, the ruthenium and copper are in electrical contact, and the difference between the open circuit potential of copper and the open circuit potential of ruthenium in the polishing system is about 50 mV or less.

    摘要翻译: 本发明提供了一种化学机械抛光衬底的方法。 包含钌和铜的基材与包括抛光组分,过氧化氢,有机酸,至少一种包含至少一个氮原子的杂环化合物和水的化学机械抛光系统接触。 抛光组分相对于基底移动,并且研磨衬底的至少一部分以抛光衬底。 抛光系统的pH为约6至约12,钌和铜电接触,并且抛光系统中铜的开路电位与钌的开路电位之间的差为约50mV或更小。

    Polishing composition for noble metals
    8.
    发明授权
    Polishing composition for noble metals 有权
    贵金属抛光组合物

    公开(公告)号:US07161247B2

    公开(公告)日:2007-01-09

    申请号:US10901420

    申请日:2004-07-28

    IPC分类号: H01L23/48 H01L23/52 H01L29/40

    摘要: The invention provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising a noble metal, the polishing composition comprising (a) an oxidizing agent that oxidizes a noble metal, (b) an anion selected from the group consisting of sulfate, borate, nitrate, and phosphate, and (c) a liquid carrier. The invention further provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising ruthenium, the polishing composition comprising (a) an oxidizing agent that oxidizes ruthenium above the +4 oxidation state, (b) a polishing additive selected from the group consisting of metal sequestering polymers, metal chelators, organic thiols, compounds that reduce ruthenium tetraoxide, lactones, and α-hydroxycarbonyl compounds.

    摘要翻译: 本发明提供一种抛光组合物和一种化学机械抛光包含贵金属的基材的方法,所述抛光组合物包含(a)氧化贵金属的氧化剂,(b)选自硫酸盐, 硼酸盐,硝酸盐和磷酸盐,和(c)液体载体。 本发明还提供一种抛光组合物和一种化学机械抛光包含钌的基材的方法,该抛光组合物包含(a)氧化高于+4氧化态的钌的氧化剂,(b)选自下组的抛光添加剂: 由金属螯合聚合物,金属螯合剂,有机硫醇,还原四氧化钌的化合物,内酯和α-羟基羰基化合物组成。

    Sterile Access Conduit
    9.
    发明申请
    Sterile Access Conduit 审中-公开
    无菌通道

    公开(公告)号:US20080319258A1

    公开(公告)日:2008-12-25

    申请号:US11994678

    申请日:2006-07-14

    IPC分类号: A61B1/018

    摘要: An elongate flexible conduit including a sealing membrane is positioned through a natural body orifice and along the gastrointestinal (GI) tract of a patient. The sealing membrane is advanced along the GI tract until proximate a target wall segment of an inner wall of the GI tract. The sealing membrane is then permanently or releasably attached to the target wall segment thereby sealing off and isolating the target wall segment from the rest of the GI tract establishing a sterile pathway from the target wall to the natural body orifice. An incision is made through both the sealing membrane and the wall of the GI tract to gain access to the peritoneum to perform surgical techniques without allowing bacteria, stomach acids, and other contaminants in the GI tract to enter the peritoneum. An instrument can then be introduced into the peritoneal cavity through the incision along the sterile pathway.

    摘要翻译: 包括密封膜的细长柔性导管通过天然体孔和沿着患者的胃肠(GI)通道定位。 密封膜沿胃肠道前进,直到胃肠道内壁的目标壁段附近。 然后将密封膜永久地或可释放地附接到目标壁段,从而密封并将目标壁段与GI道的其余部分隔离,从而形成从目标壁到自然体孔的无菌路径。 通过密封膜和GI道的壁进行切口以进入腹膜进行外科手术,而不会使胃肠道中的细菌,胃酸和其他污染物进入腹膜。 然后可以通过沿着无菌途径的切口将器械引入腹膜腔。

    CMP of copper/ruthenium/tantalum substrates
    10.
    发明申请
    CMP of copper/ruthenium/tantalum substrates 审中-公开
    铜/钌/钽基板的CMP

    公开(公告)号:US20080105652A1

    公开(公告)日:2008-05-08

    申请号:US11591730

    申请日:2006-11-02

    IPC分类号: C09K13/00 B44C1/00

    摘要: The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an abrasive, an oxidizing agent, an amphiphilic nonionic surfactant, calcium ion or magnesium ion, a corrosion inhibitor for copper, and water, wherein the pH of the polishing composition is about 6 to about 12. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.

    摘要翻译: 本发明提供了一种用于抛光基材的化学机械抛光组合物。 抛光组合物包括研磨剂,氧化剂,两亲性非离子表面活性剂,钙离子或镁离子,铜的防腐蚀剂和水,其中抛光组合物的pH为约6至约12.本发明还提供了一种 用上述抛光组合物对衬底进行化学机械研磨的方法。