公开(公告)号：US07038316B2

公开(公告)日：2006-05-02

申请号：US10811370

申请日：2004-03-25

申请人： Chuan Hu ,  Daoqiang Lu ,  Zhiyong Wang ,  Gilroy Vandentop

发明人： Chuan Hu ,  Daoqiang Lu ,  Zhiyong Wang ,  Gilroy Vandentop

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05099

摘要： An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier.

摘要翻译： IC封装由无冲击模具，其上具有多个焊料凸块的模具载体和散热器盖组装。 将无凸起的模具结合到散热器盖上以形成模块，然后将模块结合到凸起的模具载体上。

公开(公告)号：US20050211749A1

公开(公告)日：2005-09-29

申请号：US10811370

申请日：2004-03-25

申请人： Chuan Hu ,  Daoqiang Lu ,  Zhiyong Wang ,  Gilroy Vandentop

发明人： Chuan Hu ,  Daoqiang Lu ,  Zhiyong Wang ,  Gilroy Vandentop

IPC分类号： B23K3/06 ,  B23K31/02

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05099

摘要： An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier.

摘要翻译： IC封装由无冲击模具，其上具有多个焊料凸块的模具载体和散热器盖组装。 将无凸起的模具结合到散热器盖上以形成模块，然后将模块结合到凸起的模具载体上。

公开(公告)号：US20080277779A1

公开(公告)日：2008-11-13

申请号：US11800686

申请日：2007-05-07

申请人： Abhishek Gupta ,  Zhiyong Wang ,  Chuan Hu

发明人： Abhishek Gupta ,  Zhiyong Wang ,  Chuan Hu

IPC分类号： H01L23/34 ,  H01L21/58 ,  H01L23/36

CPC分类号： H01L23/473 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A microelectronic package comprises a substrate (110), a die (120) having a front side (121) and a back side (122) located over the substrate, a thermally conducting layer (130) on the back side of the die, a microchannel (140) above the thermally conducting layer, and a cap (150) on the microchannel. The thermally conducting layer between the die and the microchannel may lend mechanical strength to the package, may be thin enough to be compliant and avoid contributing meaningful CTE mismatch with the die, and may prevent the formation or propagation of cracks in the microchannel.

摘要翻译： 微电子封装包括衬底（110），具有位于衬底上方的前侧（121）和后侧（122）的管芯（120），位于管芯背面的导热层（130）， 在导热层上方的微通道（140）和微通道上的盖（150）。 管芯和微通道之间的导热层可以对包装提供机械强度，可以足够薄以使其顺从并且避免与管芯产生有意义的CTE失配，并且可以防止微通道中的裂纹的形成或扩展。

公开(公告)号：US07236844B1

公开(公告)日：2007-06-26

申请号：US11307907

申请日：2006-02-27

申请人： Xue Bai ,  Zhiyong Wang

发明人： Xue Bai ,  Zhiyong Wang

IPC分类号： G06F19/00

CPC分类号： G06Q10/06 ,  G06Q10/0631 ,  G06Q10/0875

摘要： The present invention is directed to Lean and Agile methods and their applications to manufacturing operations on production floors. A web assessable, modular, user modifiable, and graphically-enriched system and software is disclosed in this document. It provides real time Lean and Agile solutions to reduce production wastes and to enhance productivity and efficiency for manufacturing organizations.

摘要翻译： 本发明涉及精益和敏捷方法及其在生产地板上的制造操作的应用。 本文档介绍了可评估网络，模块化，用户可修改和图形丰富的系统和软件。 它提供实时的精益和敏捷解决方案，以减少生产废物，并提高制造组织的生产率和效率。

公开(公告)号：US20070025661A1

公开(公告)日：2007-02-01

申请号：US11397054

申请日：2006-04-04

申请人： Zhiyong Wang ,  James Heflin ,  Siddharth Ramachandran

发明人： Zhiyong Wang ,  James Heflin ,  Siddharth Ramachandran

IPC分类号： G02B6/34

CPC分类号： G01N21/774 ,  B82Y15/00 ,  B82Y30/00 ,  G02B6/02195

摘要： The provision of an ionic self-assembled multilayer (ISAM) film on a fiber-optic element including a long period grating (LPG) by a simple, room temperature process provides tuning of the LPG and/or high sensitivity to the refractive index of the ambient environment of the fiber-optic element. Inclusion of a final layer or a probe, receptor or affinity ligand in the multi-layer film provides a highly sensitive sensor for specific chemical and biological materials. Use of a turn around point (TAP) LPG allows detection to be performed by detection of light intensity rather than wavelength of attenuation. Use of a material having an electro-optical response to an electrical field by change of dimension or refractive index allows the combination of a LPG or TAP LPG and ISAM film to function as a light modulator.

摘要翻译： 通过简单的室温过程在包括长周期光栅（LPG）的光纤元件上提供离子自组装多层（ISAM）膜，提供LPG的调谐和/或高灵敏度的折射率 光纤元件的周围环境。 在多层膜中包含最终层或探针，受体或亲和配体为特定化学和生物材料提供了高灵敏度的传感器。 使用转向点（TAP）LPG允许通过检测光强而不是衰减波长进行检测。 通过改变尺寸或折射率使用具有对电场的电光响应的材料允许LPG或TAP LPG和ISAM膜的组合用作光调制器。

公开(公告)号：US20060223239A1

公开(公告)日：2006-10-05

申请号：US11096427

申请日：2005-03-31

申请人： Lee Khaw ,  Kam Chong ,  Diego Diaz ,  Zhiyong Wang ,  Zezhong Fu

发明人： Lee Khaw ,  Kam Chong ,  Diego Diaz ,  Zhiyong Wang ,  Zezhong Fu

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/10165 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： An apparatus, method, and system for providing a mechanical divider adapted to shield at least a portion of an active surface of an integrated circuit from out-gassing from underfill material. The mechanical divider is attached to a mounting substrate. The underfill material is dispensed on the mounting substrate. The integrated circuit is placed on both the mechanical divider and on the underfill material after the mechanical divider has been at least partially cured. The mechanical divider may include a base surface adapted to contact the mounting substrate, a lower wall surface extending upwardly from the base surface, an upper wall surface adapted to abut a side wall of the integrated circuit, and a ledge surface extending between the lower wall surface and the upper wall surface, the ledge surface adapted to contact at least a portion of the active surface of the integrated circuit.

摘要翻译： 一种用于提供适于屏蔽集成电路的有源表面的至少一部分的机械分配器的装置，方法和系统，以防止来自底部填充材料的泄漏。 机械分配器连接到安装基板。 底部填充材料被分配在安装基板上。 在机械分配器至少部分固化之后，集成电路放置在机械分隔器和底部填充材料上。 机械分隔器可以包括适于接触安装基板的基面，从基面向上延伸的下壁面，适于邻接集成电路侧壁的上壁面，以及在下壁 表面和上壁表面，所述凸缘表面适于接触所述集成电路的所述有源表面的至少一部分。

公开(公告)号：US20050177887A1

公开(公告)日：2005-08-11

申请号：US11080713

申请日：2005-03-15

申请人： Shlomo Melmed ,  Zhiyong Wang

发明人： Shlomo Melmed ,  Zhiyong Wang

IPC分类号： C07K14/82 ,  C12N15/85 ,  A01K67/027 ,  C12N5/06

CPC分类号： C12N15/8509 ,  A01K67/0276 ,  A01K2217/075 ,  A01K2227/105 ,  A01K2267/03 ,  A01K2267/0362 ,  C07K14/82 ,  C12N2517/02

摘要： Disclosed is a null mutant (or knockout) rodent comprising in its germ cells an artificially induced PTTG null mutation. In some embodiments, the null mutant rodent can be generated by way of homologous recombination in an embryonic stem cell or germ cell. The inventive null mutant rodent can be used to study mammalian physiology at the cellular, tissue, and/or organismal level with respect to various phenotypes, including hyperglycemia, hypoinsulinaemia, hypoleptinemia, diabetes, chromosomal aneuploidy, premature centromere division, chromosomal damage, aberrant mitotic cellular division, thrombocytopenia, thymic hyperplasia, splenic hypoplasia, testicular hypoplasia, and female subfertility. Also disclosed is an animal model for diabetes. Also disclosed is a somatic or germ cell obtained from the null mutant rodent. Also disclosed is a cell line derived from a cell obtained from the null mutant rodent.

摘要翻译： 公开了一种无效突变（或敲除）啮齿动物，其在其生殖细胞中包含人工诱导的PTTG无效突变。 在一些实施方案中，无效突变啮齿动物可以通过在胚胎干细胞或生殖细胞中的同源重组产生。 关于各种表型，本发明的无效突变啮齿动物可用于研究细胞，组织和/或生物体水平的哺乳动物生理学，包括高血糖症，低胰岛素血症，hypoleptinemia，糖尿病，染色体非整倍性，早熟着丝粒分裂，染色体损伤，异常有丝分裂 细胞分裂，血小板减少症，胸腺增生，脾发育不全，睾丸发育不全和女性亚不孕。 还公开了一种用于糖尿病的动物模型。 还公开了从无效突变啮齿动物获得的体细胞或生殖细胞。 还公开了衍生自从无效突变啮齿动物获得的细胞的细胞系。

公开(公告)号：US06921848B2

公开(公告)日：2005-07-26

申请号：US09995938

申请日：2001-11-27

申请人： Joanne Chory ,  Zhiyong Wang

发明人： Joanne Chory ,  Zhiyong Wang

IPC分类号： C07K14/415 ,  C12N15/82 ,  C12N12/29 ,  A01H5/00

CPC分类号： C12N15/8298 ,  C07K14/415

摘要： The present invention provides a BZR1 gene and an altered gene, bzr1-D, involved in the brassinosteroid response pathway. The expression of BZR1 genes in transgenic plants causes such plants to become significantly larger and more robust than their wild-type counterparts, thus increasing plant yields.

摘要翻译： 本发明提供参与油菜素甾醇应答途径的BZR1基因和改变的基因bzr1-D。 转基因植物中BZR1基因的表达使得这些植物变得比其野生型对应物显着更大和更强壮，从而增加植物产量。

公开(公告)号：US20050100939A1

公开(公告)日：2005-05-12

申请号：US10943752

申请日：2004-09-17

申请人： Eugeni Namsaraev ,  George Karlin-Neumann ,  Malek Faham ,  Maneesh Jain ,  Paul Hardenbol ,  Thomas Willis ,  Zhiyong Wang

发明人： Eugeni Namsaraev ,  George Karlin-Neumann ,  Malek Faham ,  Maneesh Jain ,  Paul Hardenbol ,  Thomas Willis ,  Zhiyong Wang

IPC分类号： C12Q1/68 ,  G01N20060101 ,  G01N33/48 ,  G01N33/50 ,  G06F19/00

CPC分类号： C12Q1/6837 ,  C12Q2563/131

摘要： The present invention provides systems and methods for large-scale genetic measurements by generating from a sample labeled target sequences whose length, orientation, label, and degree of overlap and complementarity are tailored to corresponding end-attached probes of a solid support so that signal-to-noise ratios of measurement from specifically hybridized labeled target sequences are maximized. Systems for implementing methods of the invention include a set of sample-interacting probes to produce amplicons that either each contain a segment of a target polynucleotide or an oligonucleotide tag that corresponds to a segment of a target polynucleotide, one or more solid phase supports that contain a plurality of end-attached probes, and methods of generating from sample-interacting probe amplicons from which labeled target sequences are tailored for hybridization to the solid phase supports, such as microarrays. In one aspect, labeled target sequences and end-attached probe of the solid phase supports comprise oligonucleotide tags and tag complements, respectively, selected from a minimally cross-hybridizing set.

摘要翻译： 本发明提供了用于大规模遗传测量的系统和方法，所述系统和方法通过从样品标记的靶序列产生，所述样品标记的靶序列的长度，取向，标记，重叠度和互补度被量化到固体支持物的相应末端附接探针， 来自特异性杂交的标记靶序列的测量的信噪比最大化。 用于实施本发明方法的系统包括一组样品相互作用探针以产生扩增子，每个扩增子各含有靶多核苷酸片段或对应于靶多核苷酸片段的寡核苷酸标签，一个或多个固相载体含有 多个末端连接的探针，以及从样品相互作用的探针扩增子产生的方法，其中标记的靶序列被定制用于与固相支持物例如微阵列杂交。 在一个方面，固相载体的标记的靶序列和末端连接的探针分别包含选自最小交叉杂交组的寡核苷酸标签和标签互补物。

公开(公告)号：US20170059303A1

公开(公告)日：2017-03-02

申请号：US14840883

申请日：2015-08-31

申请人： Robert Alan May ,  Sri Ranga Sai Boyapati ,  Zhiyong Wang ,  Shuhong Liu ,  Pilin Liu

发明人： Robert Alan May ,  Sri Ranga Sai Boyapati ,  Zhiyong Wang ,  Shuhong Liu ,  Pilin Liu

IPC分类号： G01B11/06

CPC分类号： G01B11/0625 ,  G01B2210/56 ,  H01L22/12

摘要： Some example forms relate to a method of nondestructively measuring a geometry of an electrical component on a substrate. The method includes directing light at the electrical component. The light is at an original intensity. The method further includes measuring light that is reflected off of the electrical component. The reflected light includes undiffracted light and diffracted light. The diffracted light is at a diffracted intensity. The method further includes determining a ratio of diffracted intensity to original intensity and utilizing the ratio to determine a geometry of the electrical component.

摘要翻译： 一些示例形式涉及非破坏性地测量衬底上的电气部件的几何形状的方法。 该方法包括将光引导到电气部件。 光线处于原始强度。 该方法还包括测量从电气部件反射的光。 反射光包括未衍射的光和衍射光。 衍射光的衍射强度。 该方法还包括确定衍射强度与原始强度的比率，并利用该比率来确定电气部件的几何形状。