公开(公告)号：US06995460B1

公开(公告)日：2006-02-07

申请号：US11123489

申请日：2005-05-06

申请人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan ,  Wing Him Lau

发明人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan ,  Wing Him Lau

IPC分类号： H01L23/495

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H05K1/185 ,  H05K1/187 ,  H05K3/205 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.

摘要翻译： 无引线塑料芯片载体是通过将封装设计的一面或两面半蚀刻到引线框条上构建的，以便产生独特的设计特征，例如围绕芯片附接焊盘的电源和/或接地环，用于触点的互锁铆钉头结构 垫，以及用于管芯附接垫的互锁图案。 在引线接合和模制之后，进行另外的蚀刻来隔离和暴露接触焊盘。 然后通过锯切单模或冲模进行从引线框条单独的单个芯片封装。

公开(公告)号：US08330270B1

公开(公告)日：2012-12-11

申请号：US11008593

申请日：2004-12-09

申请人： Geraldine Tsui Yee Lin ,  Walter de Munnik ,  Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

发明人： Geraldine Tsui Yee Lin ,  Walter de Munnik ,  Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

IPC分类号： H01L23/495 ,  H01L23/04 ,  H01L23/34

CPC分类号： H01L21/561 ,  H01L21/4828 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit package having a selectively etched leadframe strip defining a die attach pad and a plurality of contact pads, at least one side of the die attach pad having a plurality of spaced apart pad portions; a semiconductor die mounted to the die attach pad and wires bonding the semiconductor die to respective ones of the contact pads; a first surface of the leadframe strip, including the semiconductor die and wire bonds, encapsulated in a molding material such that at least one surface of the leadframe strip is exposed, and wherein solder paste is disposed on said contact pads and said at least one side of said die attach pad.

摘要翻译： 一种集成电路封装，其具有限定管芯附接焊盘和多个接触焊盘的选择性蚀刻的引线框条，所述管芯附接焊盘的至少一侧具有多个间隔开的焊盘部分; 安装到管芯附接焊盘的半导体管芯和将半导体管芯接合到相应的接触焊盘的引线; 引线框带的第一表面，包括半导体管芯和引线接合，封装在模制材料中，使得引线框架条的至少一个表面被暴露，并且其中焊膏设置在所述接触焊盘和所述至少一个侧面上 的所述管芯附接垫。

公开(公告)号：US06989294B1

公开(公告)日：2006-01-24

申请号：US10353241

申请日：2003-01-28

申请人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan ,  Wing Him Lau

发明人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan ,  Wing Him Lau

IPC分类号： H01L21/48

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H05K1/185 ,  H05K1/187 ,  H05K3/205 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.

公开(公告)号：US06933594B2

公开(公告)日：2005-08-23

申请号：US09802678

申请日：2001-03-09

申请人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan ,  Wing Him Lau

发明人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan ,  Wing Him Lau

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.

摘要翻译： 无引线塑料芯片载体是通过将封装设计的一面或两面半蚀刻到引线框条上构建的，以便产生独特的设计特征，例如围绕芯片附接焊盘的电源和/或接地环，用于触点的互锁铆钉头结构 垫，以及用于管芯附接垫的互锁图案。 在引线接合和模制之后，进行另外的蚀刻来隔离和暴露接触焊盘。 然后通过锯切单模或冲模进行从引线框条单独的单个芯片封装。

公开(公告)号：US09520306B2

公开(公告)日：2016-12-13

申请号：US13618509

申请日：2012-09-14

申请人： Geraldine Tsui Yee Lin ,  Walter de Munnik ,  Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

发明人： Geraldine Tsui Yee Lin ,  Walter de Munnik ,  Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

IPC分类号： H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L21/561 ,  H01L21/4828 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A process for fabricating an integrated circuit package includes selectively etching a leadframe strip to define a die attach pad and a plurality of contact pads. At least one side of the die attach pad has a plurality of spaced apart pad portions. A semiconductor die is mounted to the die attach pad and wires are bonded from the semiconductor die to respective ones of the contact pads. A first surface of the leadframe strip, including the semiconductor die and wire bonds, is encapsulated in a molding material such that at least one surface of the leadframe strip is exposed. The integrated circuit package is singulated from a remainder of the leadframe strip.

摘要翻译： 一种用于制造集成电路封装的工艺包括选择性地蚀刻引线框条以限定管芯附接焊盘和多个接触焊盘。 管芯附接垫的至少一侧具有多个间隔开的垫部分。 将半导体管芯安装到管芯附接焊盘，并且将导线从半导体管芯接合到相应的接触焊盘。 包括半导体管芯和引线接合的引线框条的第一表面被封装在模制材料中，使得引线框带的至少一个表面被暴露。 集成电路封装从引线框条的其余部分分离。

公开(公告)号：US07270867B1

公开(公告)日：2007-09-18

申请号：US11022130

申请日：2004-12-22

申请人： Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

发明人： Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

IPC分类号： H01L21/48

CPC分类号： H01L23/49582 ,  H01L21/4821 ,  H01L21/4832 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/85001 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T428/24107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A process for fabricating a leadless plastic chip carrier includes selectively depositing a plurality of base layers on a first surface of a base of a leadframe strip to at least partially define a die attach pad and at least one row of contact pads. At least one further layer is selectively deposited on portions of the plurality of layers to further define at least the contact pads. The leadframe strip is then treated with a surface preparation. A semiconductor die is mounted to the die attach pad, followed by wire bonding the semiconductor die to at least the contact pads. Molding the semiconductor die, the wire bonds, the die attach pad and the contact pads on the surface of the leadframe strip, in a molding compound follows. The leadframe strip is etched to expose the contact pads and the die attach pad and the leadless plastic chip carrier is singulated from a remainder of the leadframe strip.

摘要翻译： 一种用于制造无引线塑料芯片载体的方法包括在引线框架条的基底的第一表面上选择性地沉积多个基层以至少部分地限定管芯附着垫和至少一排接触垫。 至少一个另外的层选择性地沉积在多个层的部分上以进一步限定至少接触焊盘。 然后用表面处理处理引线框条。 将半导体管芯安装到管芯附接焊盘，然后将半导体管芯引线接合至少于接触焊盘。 在模制化合物中，模制半导体管芯，引线接合，引线框架条的表面上的焊盘和接触焊盘。 蚀刻引线框条以暴露接触焊盘和管芯附接焊盘，并且引线框架条的其余部分分离无引线塑料芯片载体。

公开(公告)号：US07372151B1

公开(公告)日：2008-05-13

申请号：US10660611

申请日：2003-09-12

申请人： Chun Ho Fan ,  Neil McLellan ,  Kwok Cheung Tsang

发明人： Chun Ho Fan ,  Neil McLellan ,  Kwok Cheung Tsang

IPC分类号： H01L23/48

CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A process for manufacturing an integrated circuit package includes forming a plurality of solder balls on a first surface of a substrate and mounting a semiconductor die to the substrate such that bumps of the semiconductor die are electrically connected to conductive traces of the substrate. The semiconductor die and the solder balls are encapsulated in an overmold material on the substrate such that portions of the solder balls are exposed. A ball grid array is formed such that bumps of the ball grid array are electrically connected to the conductive traces and the integrated circuit package is singulated.

摘要翻译： 一种用于制造集成电路封装的方法，包括在衬底的第一表面上形成多个焊球，并将半导体管芯安装到衬底上，使得半导体管芯的凸块与衬底的导电迹线电连接。 半导体管芯和焊球被封装在衬底上的包覆模制材料中，使得焊球的部分暴露。 形成球栅阵列，使得球栅阵列的凸块电连接到导电迹线，并且集成电路封装被分割。

公开(公告)号：US07271032B1

公开(公告)日：2007-09-18

申请号：US11123491

申请日：2005-05-06

申请人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan ,  Wing Him Lau

发明人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan ,  Wing Him Lau

IPC分类号： H01L21/48

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48639 ,  H01L2224/48655 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.

摘要翻译： 无引线塑料芯片载体是通过将封装设计的一面或两面半蚀刻到引线框条上构建的，以便产生独特的设计特征，例如围绕芯片附接焊盘的电源和/或接地环，用于触点的互锁铆钉头结构 垫，以及用于管芯附接垫的互锁图案。 在引线接合和模制之后，进行另外的蚀刻来隔离和暴露接触焊盘。 然后通过锯切单模或冲模进行从引线框条单独的芯片封装。

公开(公告)号：US07232755B1

公开(公告)日：2007-06-19

申请号：US11194993

申请日：2005-08-02

申请人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan

发明人： Neil McLellan ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan

IPC分类号： H01L21/44

CPC分类号： H01L23/49582 ,  H01L21/4821 ,  H01L21/6835 ,  H01L24/45 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00012

摘要： A process for fabricating a pad frame for an integrated circuit package includes building up metal on selective portions of a first side of a substrate to define a plurality of contact pads disposed in a first layer of dielectric material, depositing a metal seed layer on an exposed side of the contact pads and the dielectric material, applying a second metal layer on the metal seed layer, selectively etching the second metal layer and the metal seed layer to provide pad frame circuitry, and building up metal on selective portions of the pad frame circuitry to define a plurality of die connect pads separated by a second layer of dielectric material, the die connect pads being electrically connected to the contact pads by the pad frame circuitry.

摘要翻译： 一种用于制造用于集成电路封装的焊盘框架的工艺包括在衬底的第一侧的选择性部分上建立金属，以限定设置在第一介电材料层中的多个接触焊盘，将金属晶种层沉积在暴露的 接触焊盘和介电材料的侧面，在金属种子层上施加第二金属层，选择性地蚀刻第二金属层和金属种子层以提供衬垫框架电路，以及在衬垫框架电路的选择性部分上建立金属 以限定由第二介电材料层隔开的多个管芯连接焊盘，管芯连接焊盘通过焊盘框架电路电连接到接触焊盘。

公开(公告)号：US06872661B1

公开(公告)日：2005-03-29

申请号：US10318262

申请日：2002-12-13

申请人： Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

发明人： Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

IPC分类号： H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L21/302

CPC分类号： H01L23/49541 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A leadless plastic chip carrier has a plurality of die attach pads on which a singulated semi-conductor die is mounted. At least one row of contact pads circumscribes the plurality of die attach pads and a power/ground ring is intermediate the contact pads and the die attach pads. Wire bonds connect the semiconductor die, the contact pads and the power/ground ring. An overmold covers the semi-conductor die, the die attach pads, the power/ground ring and the contact pads such that each of the die attach pads and the contact pads has one exposed surface.

摘要翻译： 无引线塑料芯片载体具有多个芯片连接焊盘，其上安装有单片半导体裸片。 至少一行接触垫限定多个管芯附接焊盘，并且电源/接地环位于接触焊盘和管芯附接焊盘之间。 导线键连接半导体管芯，接触焊盘和电源/接地环。 包覆模具覆盖半导体管芯，管芯附接焊盘，电源/接地环和接触焊盘，使得每个管芯附接焊盘和接触焊盘都具有一个暴露的表面。