公开(公告)号：US08481425B2

公开(公告)日：2013-07-09

申请号：US13108969

申请日：2011-05-16

申请人： Yen-Liang Lu ,  Chun-Ling Lin ,  Chi-Mao Hsu ,  Chin-Fu Lin ,  Chun-Hung Chen ,  Tsun-Min Cheng ,  Meng-Hong Tsai

发明人： Yen-Liang Lu ,  Chun-Ling Lin ,  Chi-Mao Hsu ,  Chin-Fu Lin ,  Chun-Hung Chen ,  Tsun-Min Cheng ,  Meng-Hong Tsai

IPC分类号： H01L21/44

CPC分类号： H01L21/76898 ,  H01L21/76828 ,  H01L21/76831

摘要： A method for fabricating through-silicon via structure is disclosed. The method includes the steps of: providing a semiconductor substrate; forming a through-silicon via in the semiconductor substrate; covering a liner in the through-silicon via; performing a baking process on the liner; forming a barrier layer on the liner; and forming a through-silicon via electrode in the through-silicon via.

摘要翻译： 公开了一种制造硅通孔结构的方法。 该方法包括以下步骤：提供半导体衬底; 在半导体衬底中形成穿硅通孔; 覆盖穿通硅通孔内的衬垫; 在衬垫上进行烘烤过程; 在衬垫上形成阻挡层; 以及在所述贯通硅通孔中形成贯通硅通孔电极。

公开(公告)号：US20120295437A1

公开(公告)日：2012-11-22

申请号：US13108969

申请日：2011-05-16

申请人： Yen-Liang Lu ,  Chun-Ling Lin ,  Chi-Mao Hsu ,  Chin-Fu Lin ,  Chun-Hung Chen ,  Tsun-Min Cheng ,  Meng-Hong Tsai

发明人： Yen-Liang Lu ,  Chun-Ling Lin ,  Chi-Mao Hsu ,  Chin-Fu Lin ,  Chun-Hung Chen ,  Tsun-Min Cheng ,  Meng-Hong Tsai

IPC分类号： H01L21/283

CPC分类号： H01L21/76898 ,  H01L21/76828 ,  H01L21/76831

摘要： A method for fabricating through-silicon via structure is disclosed. The method includes the steps of: providing a semiconductor substrate; forming a through-silicon via in the semiconductor substrate; covering a liner in the through-silicon via; performing a baking process on the liner; forming a barrier layer on the liner; and forming a through-silicon via electrode in the through-silicon via.

摘要翻译： 公开了一种制造硅通孔结构的方法。 该方法包括以下步骤：提供半导体衬底; 在半导体衬底中形成穿硅通孔; 覆盖穿通硅通孔内的衬垫; 在衬垫上进行烘烤过程; 在衬垫上形成阻挡层; 以及在所述贯通硅通孔中形成贯通硅通孔电极。

公开(公告)号：US20120305403A1

公开(公告)日：2012-12-06

申请号：US13154420

申请日：2011-06-06

申请人： Chun-Ling Lin ,  Yen-Liang Lu ,  Chi-Mao Hsu ,  Chin-Fu Lin ,  Chun-Hung Chen ,  Tsun-Min Cheng ,  Meng-Hong Tsai

发明人： Chun-Ling Lin ,  Yen-Liang Lu ,  Chi-Mao Hsu ,  Chin-Fu Lin ,  Chun-Hung Chen ,  Tsun-Min Cheng ,  Meng-Hong Tsai

IPC分类号： C25D7/12 ,  C25D5/00

CPC分类号： C25D5/54 ,  C25D3/38 ,  C25D5/00 ,  C25D5/10 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76879

摘要： An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.

摘要翻译： 提供电化学镀工艺。 半导体结构设置在电镀平台中。 进行预电镀步骤，其中预电镀步骤在固定电压环境下进行，并且在电流高于电镀平台的阈值电流之后持续0.2至0.5秒。 在预电镀步骤之后，对半导体结构进行第一电镀步骤。

公开(公告)号：US09416459B2

公开(公告)日：2016-08-16

申请号：US13154420

申请日：2011-06-06

申请人： Chun-Ling Lin ,  Yen-Liang Lu ,  Chi-Mao Hsu ,  Chin-Fu Lin ,  Chun-Hung Chen ,  Tsun-Min Cheng ,  Chi-Ray Tsai

发明人： Chun-Ling Lin ,  Yen-Liang Lu ,  Chi-Mao Hsu ,  Chin-Fu Lin ,  Chun-Hung Chen ,  Tsun-Min Cheng ,  Chi-Ray Tsai

IPC分类号： C25D5/00 ,  C25D7/12

CPC分类号： C25D5/54 ,  C25D3/38 ,  C25D5/00 ,  C25D5/10 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76879

摘要： An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.

摘要翻译： 提供电化学镀工艺。 半导体结构设置在电镀平台中。 进行预电镀步骤，其中预电镀步骤在固定电压环境下进行，并且在电流高于电镀平台的阈值电流之后持续0.2至0.5秒。 在预电镀步骤之后，对半导体结构进行第一电镀步骤。

公开(公告)号：US09620421B2

公开(公告)日：2017-04-11

申请号：US12948184

申请日：2010-11-17

申请人： Chien-Chih Ho ,  Chih-Ping Chao ,  Hua-Chou Tseng ,  Chun-Hung Chen ,  Chia-Yi Su ,  Alex Kalnitsky ,  Jye-Yen Cheng ,  Harry-Hak-Lay Chuang

发明人： Chien-Chih Ho ,  Chih-Ping Chao ,  Hua-Chou Tseng ,  Chun-Hung Chen ,  Chia-Yi Su ,  Alex Kalnitsky ,  Jye-Yen Cheng ,  Harry-Hak-Lay Chuang

IPC分类号： H01L21/8238 ,  H01L21/768 ,  H01L21/8234 ,  H01L29/51 ,  H01L29/66

CPC分类号： H01L23/481 ,  H01L21/76802 ,  H01L21/76816 ,  H01L21/76895 ,  H01L21/823425 ,  H01L21/823475 ,  H01L21/823842 ,  H01L21/823871 ,  H01L27/088 ,  H01L29/0653 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66545

摘要： A method of forming an integrated circuit structure includes providing a gate strip in an inter-layer dielectric (ILD) layer. The gate strip comprises a metal gate electrode over a high-k gate dielectric. An electrical transmission structure is formed over the gate strip and a conductive strip is formed over the electrical transmission structure. The conductive strip has a width greater than a width of the gate strip. A contact plug is formed above the conductive strip and surrounded by an additional ILD layer.

公开(公告)号：US09083326B2

公开(公告)日：2015-07-14

申请号：US13243279

申请日：2011-09-23

申请人： Chun-Hung Chen ,  Tzu-Chi Liu

发明人： Chun-Hung Chen ,  Tzu-Chi Liu

IPC分类号： G09G5/00 ,  H03K5/151

CPC分类号： H03K5/151

摘要： A signal transmitting circuit is provided for cutting off or outputting at least one driving signal for driving a designated light source. The signal transmitting circuit includes an input differential signaling driver, an output differential amplifier, and a fixed-voltage-level-difference supply device. The input differential signaling driver is for receiving a display signal, and outputting an inverting signal and a non-inverting signal according to the display signal. The output differential amplifier is for receiving the inverting signal and non-inverting signal and outputting or cutting off the driving signal according to the voltage-level difference between the inverting signal and the non-inverting signal. The fixed-voltage-level-difference supply device is for supplying a fixed-voltage-level difference to replace the inverting signal and the non-inverting signal received by the output differential amplifier; therefore the output of the output differential amplifier remains low voltage-level to cut off the output of light with a designated color.

摘要翻译： 提供信号发送电路，用于切断或输出用于驱动指定光源的至少一个驱动信号。 信号发送电路包括输入差分信号驱动器，输出差分放大器和固定电压电平差供给装置。 输入差分信号驱动器用于接收显示信号，并根据显示信号输出反相信号和非反相信号。 输出差分放大器用于接收反相信号和非反相信号，并根据反相信号和非反相信号之间的电压电平差输出或切断驱动信号。 固定电压电平差供给装置用于提供固定电压电平差，以代替由输出差分放大器接收的反相信号和非反相信号; 因此输出差分放大器的输出保持低电压电平，以切断指定颜色的光输出。

公开(公告)号：US08878555B2

公开(公告)日：2014-11-04

申请号：US13046780

申请日：2011-03-14

申请人： He-Wei Huang ,  Chun-Hung Chen ,  Chih-Yuan Chang

发明人： He-Wei Huang ,  Chun-Hung Chen ,  Chih-Yuan Chang

IPC分类号： G01R27/26 ,  H03K17/96 ,  G06F3/044

CPC分类号： G01R27/2605 ,  G06F3/044 ,  H03K17/962 ,  H03K2217/960725

摘要： A capacitance measurement device includes a charging control unit for charging a measured capacitor, a discharging control unit for discharging the measured capacitor, a first switch coupled to the measured capacitor and the charging control unit for controlling a connection between the measured capacitor and the charging control unit according to a first switching signal, a second switch coupled to the measured capacitor and the discharging control unit for controlling a connection between the measured capacitor and the discharging control unit according to a second switching signal, a first A/D converter coupled to the measured capacitor for converting a voltage signal on the measured capacitor into a first signal, and a duty cycle detecting circuit coupled to the measured capacitor for converting the voltage signal on the measured capacitor into a count value that represents the capacitance of the measured capacitor and outputting the count value to a processing unit.

摘要翻译： 电容测量装置包括用于对测量的电容器充电的充电控制单元，用于放电测量的电容器的放电控制单元，耦合到测量电容器的第一开关和用于控制测量的电容器与充电控制之间的连接的充电控制单元 根据第一切换信号的单元，耦合到测量的电容器的第二开关和放电控制单元，用于根据第二开关信号控制测量的电容器和放电控制单元之间的连接;第一A / D转换器， 测量电容器，用于将测量的电容器上的电压信号转换为第一信号;以及占空比检测电路，耦合到所测量的电容器，用于将测量的电容器上的电压信号转换成表示测量的电容器的电容的计数值，并输出 计数值到处理单元。

公开(公告)号：US08562619B2

公开(公告)日：2013-10-22

申请号：US12630078

申请日：2009-12-03

申请人： Chun-Jen Liao ,  Yang-Hwei Tsuang ,  Huang-Chien Liang ,  Chun-Hung Chen ,  Fon-Yih Tsuang ,  Yi-Jie Kuo

发明人： Chun-Jen Liao ,  Yang-Hwei Tsuang ,  Huang-Chien Liang ,  Chun-Hung Chen ,  Fon-Yih Tsuang ,  Yi-Jie Kuo

IPC分类号： A61B17/56 ,  A61F2/28

CPC分类号： A61B17/8822 ,  A61B17/8836 ,  A61L24/001 ,  A61L24/02 ,  A61L24/06 ,  A61L2430/02 ,  C08L67/04

摘要： A method for filling a bone defect in a subject in need thereof is disclosed. The method includes heating a bone cement composition at a first temperature where the bone cement composition is fluidic, and delivering an effective amount of the fluidic bone cement composition at a second temperature to the bone defect thereby filling the bone defect and allowing the fluidic bone cement composition to solidify, the second temperature being sufficiently high for maintaining the bone cement composition fluidic without causing thermal necrosis. Also disclosed are systems for carrying out the method.

摘要翻译： 公开了一种在有需要的受试者中填充骨缺损的方法。 该方法包括在骨水泥组合物为流体的第一温度下加热骨水泥组合物，并将有效量的第二温度下的流体骨粘固剂组合物输送到骨缺损，由此填充骨缺损并允许流体骨粘固剂 组合物固化，第二温度足够高以保持骨水泥组合物流体化而不引起热坏死。 还公开了用于执行该方法的系统。

公开(公告)号：US20100027722A1

公开(公告)日：2010-02-04

申请号：US12342051

申请日：2008-12-22

申请人： Chun-Hung Chen ,  Tsun-Tu Wang ,  Wing-Kai Tang

发明人： Chun-Hung Chen ,  Tsun-Tu Wang ,  Wing-Kai Tang

IPC分类号： H04L27/06

CPC分类号： H04L1/1854 ,  H04L5/0053

摘要： A wired signal receiving apparatus including a signal receiver, a signal peak detector, and a signal comparator is disclosed. The signal receiver includes an operation current detecting circuit for detecting an operation current. The signal receiver further receives a transmission signal. The signal peak detector receives the operation current, detects a peak thereof, and generates a peak current. The signal comparator compares a reference signal and the peak current to generate an output current for regulating the operation current.

摘要翻译： 公开了一种包括信号接收机，信号峰值检测器和信号比较器的有线信号接收装置。 信号接收机包括用于检测操作电流的操作电流检测电路。 信号接收机还接收发送信号。 信号峰值检测器接收工作电流，检测其峰值，并产生峰值电流。 信号比较器比较参考信号和峰值电流，以产生用于调节工作电流的输出电流。

公开(公告)号：US07514977B2

公开(公告)日：2009-04-07

申请号：US11309636

申请日：2006-09-01

申请人： Chun-Hung Chen

发明人： Chun-Hung Chen

IPC分类号： G06F1/04 ,  H03K3/00

CPC分类号： H03B19/16 ,  G06F1/04

摘要： A clock signal generating circuit is provided. The clock signal generating circuit includes a clock signal generator for generating a first clock signal having a predetermined frequency; a frequency dividing circuit receiving the first clock signal, for providing a second clock signal with a frequency that is lower than the predetermined frequency of the first clock signal; and a frequency multiplier circuit receiving the second clock signal, for providing a system clock signal resuming the predetermined frequency to a load.

摘要翻译： 提供时钟信号发生电路。 时钟信号发生电路包括用于产生具有预定频率的第一时钟信号的时钟信号发生器; 接收所述第一时钟信号的分频电路，用于提供具有低于所述第一时钟信号的预定频率的频率的第二时钟信号; 以及接收所述第二时钟信号的倍频电路，用于提供恢复到所述负载的所述预定频率的系统时钟信号。