摘要:
Disclosed are a synchronous rectifier control device and a forward synchronous rectifier circuit. The synchronous rectifier control device is coupled with the secondary side of the forward synchronous rectifier circuit, comprising a condition detecting unit, a reference time circuit and a synchronous signal generator. The condition detecting unit receives at least one reference signal and a detecting signal in response to the condition of the secondary side of the forward synchronous rectifier circuit, and accordingly generates a first synchronous control signal. The reference time circuit is coupled with the condition detecting unit, and generates a reference time signal in response to the first synchronous control signal. The synchronous signal generator generates a second synchronous control signal in response to the first synchronous control signal and the reference time signal.
摘要:
Disclosed are a synchronous rectifier control device and a forward synchronous rectifier circuit. The synchronous rectifier control device is coupled with the secondary side of the forward synchronous rectifier circuit, comprising a condition detecting unit, a reference time circuit and a synchronous signal generator. The condition detecting unit receives at least one reference signal and a detecting signal in response to the condition of the secondary side of the forward synchronous rectifier circuit, and accordingly generates a first synchronous control signal. The reference time circuit is coupled with the condition detecting unit, and generates a reference time signal in response to the first synchronous control signal. The synchronous signal generator generates a second synchronous control signal in response to the first synchronous control signal and the reference time signal.
摘要:
The present application discloses a semiconductor structure and a method of manufacturing a semiconductor structure. The semiconductor structure includes a conductive line of an Nth metal layer, a first insulating layer, a dielectric layer, a second insulating layer, an interconnect base, and an interconnect body. The first insulating layer is on the conductive line and free from covering a portion of the conductive line. The dielectric layer is on the first insulating layer and free from covering the portion of the conductive line. The second insulating layer is on the dielectric layer and free from covering the portion of the conductive line. The interconnect base is laterally surrounded by the dielectric layer, the first insulating layer, and the second insulating layer. A top surface of the interconnect base and a top surface of the second insulating layer are coplanar.
摘要:
A synchronous rectifying apparatus suitable for use in a forward synchronous converter having a transforming unit with a primary and secondary side, and a first and second rectifying switches coupled to the secondary side is provided. The synchronous rectifying apparatus has a condition detecting unit and a synchronous rectifying controller. The condition detecting unit; coupled to the secondary side of the transforming unit, for detecting if the operation condition of the forward synchronous converter is at boundary between discontinuous current mode and continuous current mode or under discontinuous current mode based on the rising slope of the secondary side voltage of the transforming unit. If so, the condition detecting unit outputs a reset signal. The synchronous rectifying controller, coupled to the secondary side of the transforming unit and the condition detecting unit, to turn off the second rectifying switch for a predetermined time period in response to the reset signal.
摘要:
The present disclosure provides a device for assisting agitation of liquid. The device includes a frame having a bottom and a sidewall forming an angle with the bottom; a first flexible film attached to the frame at a periphery portion of the first flexible film; a first magnetic field generator at the sidewall of the frame and adjacent to the periphery portion of the first flexible film; and a second magnetic field generator at the bottom of the frame, wherein the first magnetic field generator and the second magnetic field generator are configured to provide a magnetic field parallel to at least a portion of the first flexible film, and wherein a portion of the frame and the first flexible film are configured to be in contact with the solution.
摘要:
A method for locking data of a program memory embedded in a microcontroller is provided. The method keeps the data stored in the program memory from being dumped. The program memory consists of a one-time-programmable read only memory and is configured into a plurality of storage sectors. The method, according to the present invention, first receives a lock command in which the lock command corresponds to a specific storage sector of the program memory. Next, according to the lock command, which storage sector is the specific sector is recognized. Finally, an access lock module is activated for locking the specific storage sector.
摘要:
A three-dimensional switching device includes an image switching panel, at least a first and a second driver unit, and at least a signal connection circuit. The image switching panel has a plurality of first electrodes criss-crossing with a plurality of second electrodes. The first driver unit has a first flexible circuit board with a first driver circuit disposed thereon that connects to a side of the image switching panel, and has a first output terminal electrically connected to the first electrodes. The second driver unit similarly has a second flexible circuit board having a second driver circuit connecting to the other side of the image switching panel with a second output terminal electrically connected to the second electrodes. The signal connection circuit connects to the image switching panel. The first and second driver circuits respectively have a first and second input terminal electrically connected to the signal connection circuit.
摘要:
A pulse width modulation regulator IC is provided for controlling a duty cycle of at least one switch to convert one input voltage signal into an output voltage. An input pin is provided for receiving an input signal different from the input voltage signal. The input signal has a lasting time substantially the same as the time that input voltage signal situated at a high level, but the waveforms of the two signals are different. The input signal is converted into a square wave signal by a conversion unit, and a PWM signal is generated by a PWM controller according to the square wave signal to control the duty cycle of the switch. Therefore, the input pin can be saved by adjusting an internal or external circuit of the IC for the usage of the different kinds of input signals without increasing the number of input pins of the IC.
摘要:
Disclosed is a gastrointestinal endoscope, including a deflectable direction-change tube, which consists of plural ring units, each having a hollow section. Adjacent ring units are spaced by a predetermined distance, having opposing end faces between which at least two integrally formed connectors are provided to connect the adjacent ring units together. An end of the deflectable direction-change tube is operatively coupled to a direction-change operation device and an opposite end coupled to a capsule endoscope clamping structure. At least one control wire extends through a bore of the deflectable direction-change tube and connected between the direction-change operation device and the capsule endoscope clamping structure. By operating an operation capstan to have the control wire pulling the capsule endoscope clamping structure, the deflectable direction-change tube is controlled to change direction, thereby changing direction of a capsule endoscope retained by the capsule endoscope clamping structure.
摘要:
The present disclosure provides a package structure and a method for forming a package structure. The package structure includes a first die having a front surface and a back surface opposite to the front surface; and a thermal management structure over the back surface. The thermal management structure includes a first copper-phosphorous alloy layer thermally coupled to the back surface of the first die.