公开(公告)号：US09209509B2

公开(公告)日：2015-12-08

申请号：US14218634

申请日：2014-03-18

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster ,  David Piede

IPC: G02B6/12 ,  H01P3/00 ,  G02F1/01 ,  H05K1/02 ,  G02F1/03 ,  G02F1/225

CPC classification number: H01P3/00 ,  G02F1/011 ,  G02F1/0121 ,  G02F1/0327 ,  G02F1/225 ,  G02F1/2255 ,  G02F2201/124 ,  G02F2201/126 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/10121

Abstract: A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.

Abstract translation: 在常规电子集成电路（IC）和光电子组件之间布置电信号的配置被形成为在相邻路径上承载相反信号的信号路径阵列，以降低与IC和IC之间的连接相关联的电感 光电子组件。 信号路径阵列可以采取在IC和子组件之间的引线阵列的形式，形成在光电子组件上的导电迹线阵列，或两者。

公开(公告)号：US09164235B1

公开(公告)日：2015-10-20

申请号：US14322661

申请日：2014-07-02

Applicant: Cisco Technology, Inc.

Inventor： Ravi Sekhar Tummidi ,  David Piede

IPC: G02B6/43 ,  G02B6/26 ,  G02B6/42 ,  G02B6/12

CPC classification number: G02B6/42 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/4208 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12061

Abstract: Embodiments disclosed herein generally relate to optical couplers for transmitting an optical signal between a waveguide in an optical device to an external light-carrying medium and vice versa. The couplers include first and second portions that extend away from the waveguide towards an optical interface that faces the light-carrying medium. The first portion is attached to the waveguide, while the second portion is not. In one example, a first end of the first portion is attached to the waveguide, while a second end, opposite the first end, faces the optical interface. The first portion may taper as it extends from the first end to the second. The second portion of the coupler may be physically separated from both the first portion and the waveguide. However, in one embodiment, the first and second portions extend in the same direction towards the optical interface.

Abstract translation: 本文公开的实施例通常涉及用于在光学装置中的波导与外部光载体之间传输光信号的光耦合器，反之亦然。 耦合器包括从波导向面向光载体的光学接口延伸的第一和第二部分。 第一部分附接到波导，而第二部分不是。 在一个示例中，第一部分的第一端附接到波导，而与第一端相对的第二端面向光学界面。 当第一部分从第一端延伸到第二端时，第一部分可以逐渐变细。 耦合器的第二部分可以与第一部分和波导两者物理分离。 然而，在一个实施例中，第一和第二部分沿相同的方向朝向光学接口延伸。

公开(公告)号：US20150125110A1

公开(公告)日：2015-05-07

申请号：US14070962

申请日：2013-11-04

Applicant: Cisco Technology, Inc.

Inventor： Sean Philip Anderson ,  Vipulkumar Patel ,  David Piede

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/13

CPC classification number: G02B6/122 ,  G02B6/124 ,  G02B6/13 ,  G02B6/136 ,  G02B6/3897 ,  G02B6/4228 ,  G02B6/423 ,  G02B2006/12176 ,  Y10T29/49826

Abstract: An optical integrated circuit (IC) is provided that includes a waveguide to propagate light in the IC. A diffractive element, such as a grating, couples light between the waveguide and an external optical connector. At least one alignment feature is lithographically formed in the optical IC to facilitate precise positioning of the optical connector on the optical IC. Since the alignment feature is lithographically formed in a precise relation to the diffractive element, the optical connector can be accurately positioned and optically coupled to the optical IC. Complex optical-feedback-based alignment equipment and operations to achieve optical coupling of the optical connector with the waveguide in the optical IC are not necessary.

Abstract translation: 提供了一种包括在IC中传播光的波导的光学集成电路（IC）。 诸如光栅的衍射元件在波导和外部光学连接器之间耦合光。 在光学IC中光刻地形成至少一个对准特征以促进光学连接器在光学IC上的精确定位。 由于对准特征以与衍射元件精确关系的方式光刻形成，因此可以将光学连接器精确地定位并光学耦合到光学IC。 基于光学反馈的基于光学反馈的对准设备和光学连接器与光学IC中的波导的光耦合的操作是不必要的。

公开(公告)号：US09971096B2

公开(公告)日：2018-05-15

申请号：US15169836

申请日：2016-06-01

Applicant: Cisco Technology, Inc.

Inventor： Kal Shastri ,  Rao Yelamarty ,  Neeraj Dubey ,  David Piede ,  Weizhuo Li

IPC: G02B6/30 ,  G02B6/36 ,  G02B6/136 ,  G02B6/12

CPC classification number: G02B6/30 ,  G02B6/136 ,  G02B6/3652 ,  G02B6/3692 ,  G02B2006/12097 ,  G02B2006/121

Abstract: Embodiments herein include an optical system that passively aligns a fiber array connector (FAC) to a waveguide in a photonic chip. A substrate of the FAC is machined or etched to include multiple grooves along a common axis or plane to hold optical waveguides, or more specifically, the fibers of the optical cables in the FAC. To align the fibers to the photonic chip, one of the fibers is disposed in an alignment trench which has a width that is substantially the same as the diameter of the fiber. When the fiber registers with the alignment trench, the fiber is aligned with a waveguide disposed at the end of the trench. Because the pitch between the fibers can be precisely controlled, aligning one of the fibers using the alignment trench results in the other fibers becoming passively aligned to respective waveguides in the photonic chip.