公开(公告)号：US09837390B1

公开(公告)日：2017-12-05

申请号：US15344736

申请日：2016-11-07

Applicant: Corning Incorporated

Inventor： Michael Lesley Sorensen ,  Sean Mathew Garner

IPC: H01L25/075 ,  H05K3/10 ,  H05K3/30 ,  H05K3/28 ,  H05K1/18 ,  H01L33/54 ,  H01L33/62 ,  H05K1/11 ,  H01L33/56

CPC classification number: H01L25/0753 ,  H01L24/98 ,  H01L33/20 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/115 ,  H05K1/186 ,  H05K3/10 ,  H05K3/284 ,  H05K3/285 ,  H05K3/30 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10674 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Embodiments are related to fluidic assembly and, more particularly, to systems and methods for forming physical structures on a substrate.

公开(公告)号：US20180130705A1

公开(公告)日：2018-05-10

申请号：US15344760

申请日：2016-11-07

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Sean Mathew Garner

IPC: H01L21/768 ,  H01L21/683

CPC classification number: H01L21/76877 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76802 ,  H01L23/49827 ,  H01L2221/68345

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for forming vias in a substrate with non-via processing intervening between via processing steps.