Method and apparatus for forming an epitaxial titanium silicide film by
low pressure chemical vapor deposition
    3.
    发明授权
    Method and apparatus for forming an epitaxial titanium silicide film by low pressure chemical vapor deposition 失效
    通过低压化学气相沉积形成外延硅化钛膜的方法和装置

    公开(公告)号:US6019839A

    公开(公告)日:2000-02-01

    申请号:US62292

    申请日:1998-04-17

    摘要: A method and apparatus for forming an epitaxial titanium silicide film is described. According to the present invention, a monocrystalline silicon substrate is placed in a deposition chamber and heated to a temperature between 710-770.degree. C. A silicon source gas and titanium tetrachloride are then provided into the deposition chamber. The deposition pressure is maintained between 5-10 torr. An epitaxial titanium silicide film is then formed on the substrate from the silicon source gas and the titanium tetrachloride.

    摘要翻译: 描述了用于形成外延硅化钛膜的方法和装置。 根据本发明,将单晶硅衬底放置在沉积室中并加热至710-770℃之间的温度。然后将硅源气体和四氯化钛提供到沉积室中。 沉积压力保持在5-10托之间。 然后从硅源气体和四氯化钛在衬底上形成外延硅化钛膜。

    Real time process monitoring and control for semiconductor junctions
    4.
    发明授权
    Real time process monitoring and control for semiconductor junctions 失效
    实时过程监测和半导体连接控制

    公开(公告)号:US07964418B2

    公开(公告)日:2011-06-21

    申请号:US11893416

    申请日:2007-08-16

    IPC分类号: H01L21/66

    摘要: A method of manufacturing a semiconductor layer is provided. In a first deposition during a first period of time, at least one Group IIIA element and at least one Group VIA element are deposited on a substrate or on a layer optional disposed on the substrate such as a back-electrode. During a second deposition during a second period of time, at least one Group IB element and the at least one group VIA element are deposited on the substrate or the optional layer. The one Group IB element combines with the Group VIA element to form a IB2VIA composition. A first deposition state is monitored, during the second deposition by making a first plurality of measurements of a first deposition state. The second deposition is terminated or attenuated based on a function of the first plurality of measurements of the indicia of the first deposition state.

    摘要翻译: 提供一种制造半导体层的方法。 在第一时间段内的第一沉积中,至少一个IIIA族元素和至少一个第VIA族元素沉积在衬底上或可选择地设置在诸如背面电极的衬底上的层上。 在第二时间段期间的第二沉积期间,至少一个IB族元件和至少一个VIA元件沉积在基底或可选层上。 一组IB元素与VIA元素组合形成IB2VIA组合物。 通过进行第一沉积状态的第一多个测量,在第二沉积期间监测第一沉积状态。 基于第一沉积状态的标记的第一多个测量的函数,第二沉积被终止或衰减。

    Fast axis beam profile shaping for high power laser diode based annealing system
    5.
    发明申请
    Fast axis beam profile shaping for high power laser diode based annealing system 有权
    基于高功率激光二极管的退火系统的快轴光束轮廓成形

    公开(公告)号:US20090152247A1

    公开(公告)日:2009-06-18

    申请号:US12291002

    申请日:2008-11-04

    IPC分类号: B23K26/00

    摘要: A dynamic surface anneal apparatus for annealing a semiconductor workpiece has a workpiece support for supporting a workpiece, an optical source and scanning apparatus for scanning the optical source and the workpiece support relative to one another along a fast axis. The optical source includes an array of laser emitters arranged generally in successive rows of the emitters, the rows being transverse to the fast axis. Plural collimating lenslets overlie respective ones of the rows of emitters and provide collimation along the fast axis. The selected lenslets have one or a succession of optical deflection angles corresponding to beam deflections along the fast axis for respective rows of emitters. Optics focus light from the array of laser emitters onto a surface of the workpiece to form a succession of line beams transverse to the fast axis spaced along the fast axis in accordance with the succession of deflection angles.

    摘要翻译: 用于退火半导体工件的动态表面退火装置具有用于支撑工件的工件支撑件,用于沿着快轴相对于彼此扫描光源和工件支撑件的光源和扫描装置。 光源包括大致以发射器的连续行布置的激光发射器的阵列,该列横向于快轴。 多个准直的小透镜叠加在发射器排中的相应行上,并沿着快轴提供准直。 所选择的小透镜具有对应于沿着快轴的光束偏转的相应行发射器的一个或一系列光学偏转角。 将来自激光发射器阵列的光聚焦到工件的表面上,以根据偏转角的顺序形成一系列沿着快轴间隔开的快轴的线束。

    Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system
    6.
    发明申请
    Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system 有权
    基于高功率激光二极管的退火系统的准直小透镜的快轴光束轮廓成形

    公开(公告)号:US20080210671A1

    公开(公告)日:2008-09-04

    申请号:US11508781

    申请日:2006-08-23

    IPC分类号: B23K26/00

    摘要: A dynamic surface anneal apparatus for annealing a semiconductor workpiece has a workpiece support for supporting a workpiece, an optical source and scanning apparatus for scanning the optical source and the workpiece support relative to one another along a fast axis. The optical source includes an array of laser emitters arranged generally in successive rows of the emitters, the rows being transverse to the fast axis. Plural collimating lenslets overlie respective ones of the rows of emitters and provide collimation along the fast axis. The selected lenslets have one or a succession of optical deflection angles corresponding to beam deflections along the fast axis for respective rows of emitters. Optics focus light from the array of laser emitters onto a surface of the workpiece to form a succession of line beams transverse to the fast axis spaced along the fast axis in accordance with the succession of deflection angles.

    摘要翻译: 用于退火半导体工件的动态表面退火装置具有用于支撑工件的工件支撑件,用于沿着快轴相对于彼此扫描光源和工件支撑件的光源和扫描装置。 光源包括大致以发射器的连续行布置的激光发射器的阵列,这些行横向于快轴。 多个准直的小透镜叠加在发射器排中的相应行上,并沿着快轴提供准直。 所选择的小透镜具有对应于沿着快轴的光束偏转的相应行发射器的一个或一系列光学偏转角。 将来自激光发射器阵列的光聚焦到工件的表面上,以根据偏转角的顺序形成一系列沿着快轴间隔开的快轴的线束。

    Method and apparatus for improving film deposition uniformity on a
substrate
    7.
    发明授权
    Method and apparatus for improving film deposition uniformity on a substrate 失效
    提高基板上成膜均匀性的方法和装置

    公开(公告)号:US6022587A

    公开(公告)日:2000-02-08

    申请号:US855247

    申请日:1997-05-13

    CPC分类号: C23C16/44 C23C16/4404

    摘要: A method and apparatus for depositing a film on a substrate. According to the present invention a prewafer reaction layer is deposited onto a susceptor placed in the reaction chamber to form a prewafer reaction layer coated susceptor prior to film deposition. A deposition gas is then fed into the reaction chamber so that it flows over the prewafer reaction layer coated susceptor and the substrate to form a film on the prewafer reaction layer coated susceptor and the substrate.

    摘要翻译: 一种用于在基板上沉积膜的方法和装置。 根据本发明,预沉积反应层沉积在放置在反应室中的基座上,以便在膜沉积之前形成预先覆盖的反应层涂覆的基座。 然后将沉积气体进料到反应室中,使其流过预先预处理的反应层涂覆的基座和基底,以在预先涂覆的反应层涂覆的基座和基底上形成膜。

    Real time process monitoring and control for semiconductor junctions
    8.
    发明授权
    Real time process monitoring and control for semiconductor junctions 失效
    实时过程监测和半导体连接控制

    公开(公告)号:US08110828B2

    公开(公告)日:2012-02-07

    申请号:US13157058

    申请日:2011-06-09

    IPC分类号: H01L29/08

    摘要: A method of manufacturing a semiconductor layer is provided. In a first deposition during a first period of time, at least one Group IIIA element and at least one Group VIA element are deposited on a substrate or on a layer optional disposed on the substrate such as a back-electrode. During a second deposition during a second period of time, at least one Group IB element and the at least one group VIA element are deposited on the substrate or the optional layer. The one Group IB element combines with the Group VIA element to form a IB2VIA composition. A first deposition state is monitored, during the second deposition by making a first plurality of measurements of a first deposition state. The second deposition is terminated or attenuated based on a function of the first plurality of measurements of the indicia of the first deposition state.

    摘要翻译: 提供一种制造半导体层的方法。 在第一时间段内的第一沉积中,至少一个IIIA族元素和至少一个第VIA族元素沉积在衬底上或可选择地设置在诸如背面电极的衬底上的层上。 在第二时间段期间的第二沉积期间,至少一个IB族元件和至少一个VIA元件沉积在基底或可选层上。 一组IB元素与VIA元素组合形成IB2VIA组合物。 通过进行第一沉积状态的第一多个测量,在第二沉积期间监测第一沉积状态。 基于第一沉积状态的标记的第一多个测量的函数,第二沉积被终止或衰减。

    Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system
    9.
    发明授权
    Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system 有权
    基于高功率激光二极管的退火系统的准直小透镜的快轴光束轮廓成形

    公开(公告)号:US07674999B2

    公开(公告)日:2010-03-09

    申请号:US11508781

    申请日:2006-08-23

    IPC分类号: H01L21/324 H01L21/477

    摘要: A dynamic surface anneal apparatus for annealing a semiconductor workpiece has a workpiece support for supporting a workpiece, an optical source and scanning apparatus for scanning the optical source and the workpiece support relative to one another along a fast axis. The optical source includes an array of laser emitters arranged generally in successive rows of the emitters, the rows being transverse to the fast axis. Plural collimating lenslets overlie respective ones of the rows of emitters and provide collimation along the fast axis. The selected lenslets have one or a succession of optical deflection angles corresponding to beam deflections along the fast axis for respective rows of emitters. Optics focus light from the array of laser emitters onto a surface of the workpiece to form a succession of line beams transverse to the fast axis spaced along the fast axis in accordance with the succession of deflection angles.

    摘要翻译: 用于退火半导体工件的动态表面退火装置具有用于支撑工件的工件支撑件,用于沿着快轴相对于彼此扫描光源和工件支撑件的光源和扫描装置。 光源包括大致以发射器的连续行布置的激光发射器的阵列,该列横向于快轴。 多个准直的小透镜叠加在发射器排中的相应行上,并沿着快轴提供准直。 所选择的小透镜具有对应于沿着快轴的光束偏转的相应行发射器的一个或一系列光学偏转角。 将来自激光发射器阵列的光聚焦到工件的表面上,以根据偏转角的顺序形成一系列沿着快轴间隔开的快轴的线束。