公开(公告)号：US20190341531A1

公开(公告)日：2019-11-07

申请号：US15972152

申请日：2018-05-05

Applicant: Cree, Inc.

Inventor： Fan Zhang ,  Ryan Gresback ,  James Ibbetson ,  Bernd Keller ,  Antony Paul Van de Ven

IPC: H01L33/50 ,  H01L33/08

Abstract: A solid state lighting device includes at least one electrically activated solid state light emitter configured to stimulate emissions of first through third lumiphoric materials having peak wavelengths in ranges of from 485 nm to 530 nm, from 575 nm to 595 nm, and from 605 nm to 640 nm, respectively (or subranges thereof defined herein), with the third peak having a full width half maximum value of less than 60 nm. The resulting device generates aggregated emissions having a suitably high color rendering index (e.g., CRI Ra) value (e.g., at least 70), and also having a spectral power distribution with a Melanopic/Photopic ratio within a specified target range as a function of correlated color temperature, thereby providing increased perceived brightness.

公开(公告)号：US10349484B1

公开(公告)日：2019-07-09

申请号：US15994483

申请日：2018-05-31

Applicant: Cree, Inc.

Inventor： Fan Zhang ,  Ryan Gresback ,  Antony Paul van de Ven ,  Robert Glass ,  Bernd P. Keller

IPC: H05B33/08 ,  H01L33/08 ,  H01L33/26 ,  A61N5/06 ,  A61M21/02 ,  H01L33/50 ,  A61M21/00

Abstract: Solid state lighting devices with melatonin suppression characteristics that ameliorate or reduce symptoms of circadian rhythm disorders or other health conditions. Aspects disclosed herein additionally relate to providing one or more of the foregoing effects while maintaining color rendering index (CRI) values acceptably high for the intended use, as well as providing lighting devices with high luminous efficacy and enhanced energy efficiency. A solid state lighting device includes one or more solid state emitters and one or more lumiphoric materials that provide aggregated emissions of the solid state lighting device. The aggregated emissions have a warm correlated color temperature (CCT) with a color point that is off of the blackbody locus (BBL) by a certain distance.

公开(公告)号：US20150348948A1

公开(公告)日：2015-12-03

申请号：US14289305

申请日：2014-05-28

Applicant: Cree, Inc.

Inventor： Peter S. Andrews ,  Christopher P. Hussell ,  Fan Zhang ,  Theodore D. Lowes

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/54 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: A Light Emitting Diode (LED) component includes discrete LED dies that are spaced apart from one another. An electrical connection element is provided adjacent the LED dies and configured to electrically connect the discrete LED dies in series and/or in parallel. A unitary optically transparent structure is provided on the second faces of the LED dies remote from the anode and cathode contacts, that spans the plurality of LED dies. The LED component is unsupported by a submount that spans adjacent ones of the LED dies. The electrical connection element may be a patterned metal sheet that is patterned to electrically connect the discrete LED dies in series and/or in parallel. The electrical connection element may also be wire bonds adjacent the LED dies that are arranged to electrically connect the discrete LED dies in series and/or in parallel.

Abstract translation: 发光二极管（LED）组件包括彼此间隔开的分立的LED管芯。 电连接元件设置在LED管芯附近，并且被配置为将分立的LED管芯串联和/或并联电连接。 在距离阳极和阴极接触件的LED管芯的第二面上设置有跨越多个LED管芯的单一光学透明结构。 LED组件不支持跨越相邻的LED管芯的子安装座。 电连接元件可以是图案化的金属片，其被图案化以将分立的LED管串联和/或并联电连接。 电连接元件还可以是与LED管芯相邻的线接合，其被布置成串联和/或并联电连接分立的LED管芯。

公开(公告)号：US10439107B2

公开(公告)日：2019-10-08

申请号：US14053404

申请日：2013-10-14

Applicant: CREE, INC.

Inventor： Sten Heikman ,  James Ibbetson ,  Zhimin Jamie Yao ,  Fan Zhang ,  Matthew Donofrio ,  Christopher P. Hussell ,  John A. Edmond

IPC: H01L33/44 ,  H01L33/50 ,  H01L33/00 ,  H01L33/20 ,  H01L33/48

Abstract: This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

公开(公告)号：US20140217443A1

公开(公告)日：2014-08-07

申请号：US14053404

申请日：2013-10-14

Applicant: CREE, INC.

Inventor： Sten Heikman ,  James Ibbetson ,  Zhimin Jamie Yao ,  Fan Zhang ,  Matthew Donofrio ,  Christopher P. Hussell ,  John A. Edmond

IPC: H01L33/50 ,  H01L33/60

CPC classification number: H01L33/50 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/44 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

Abstract translation: 本公开涉及发光器件及其制造方法，包括侧面和/或多面发光器件。 根据本公开的实施例包括使用功能层，其可以包括与发光器的一个或多个部分的间隔距离，以在进一步的器件处理期间提高功能层的稳定性。 功能层可以进一步包括翼状部分，允许光发射器的下侧部分的涂覆进一步与发射的光和功能层上的反射层涂层相互作用，以进一步改善光提取和发光均匀性。 还公开了包括使用虚拟晶片结构的方法的制造方法。

公开(公告)号：US20150200336A1

公开(公告)日：2015-07-16

申请号：US14201490

申请日：2014-03-07

Applicant: CREE, INC.

Inventor： Chandon Bhat ,  Fan Zhang ,  Theodore Lowes ,  Peter Andrews

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/54 ,  H01L33/56 ,  H01L33/46 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/11 ,  H01L2933/0066

Abstract: This disclosure relates to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads in relation to a mount surface, such that contact bumps and a reflective material are disposed to form a planar mounting surface. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at a reflective layer, forming at least a portion of a mounting surface. The device also includes one or more contact pads on the device, such that the contact pads are recessed in relation to the reflective layer. Contact bumps are formed on the contact pads, protruding beyond the contact pads, wherein the contact bumps compose at least a portion of the mounting surface. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

Abstract translation: 本公开涉及诸如发光器件的表面贴装器件及其制造方法，包括相对于安装表面的凹陷接触焊盘，使得接触凸块和反射材料被设置成形成平面安装表面。 根据本公开的实施例包括发光器件，其中所述器件包括在反射层处，形成安装表面的至少一部分。 器件还包括器件上的一个或多个接触焊盘，使得接触焊盘相对于反射层凹陷。 接触凸块形成在接触垫上，突出超过接触垫，其中接触凸块组成安装表面的至少一部分。 还公开了包括使用虚拟晶片结构的方法的制造方法。