Method of manufacturing ferromagnetic toroids used in ferrite phase shifters
    1.
    发明授权
    Method of manufacturing ferromagnetic toroids used in ferrite phase shifters 失效
    在铁素体移相器中使用的铁磁环圈的制造方法

    公开(公告)号:US06673181B1

    公开(公告)日:2004-01-06

    申请号:US09984317

    申请日:2001-10-29

    IPC分类号: B32B3126

    摘要: A fabrication process for ferrite toroids which utilizes ferrite ceramic tape having an improved elongation characteristic. The process utilizes a set of rigid mandrels which are employed in the final lamination to support the rectangular cross section of the internal cavity of a respective ferrite tube, thereby reducing stress concentration and permitting the highest lamination pressure to be used in the final step. The mandrels are removed prior to panel densification. The tape and mandrels operate together to minimize cracks and pores in the toroids and provide an added advantage of maintaining high tolerances in the internal cavity dimensions as well as the cavity-to-cavity alignment.

    摘要翻译: 铁氧体环形体的制造方法,其使用具有改善的伸长率特性的铁氧体陶瓷带。 该方法利用一组刚性心轴,其用于最终层压以支撑相应铁氧体管的内腔的矩形横截面,从而减少应力集中并允许在最后步骤中使用最高层压压力。 在面板致密化之前将心轴移除。 带和心轴一起工作以使环形圈中的裂纹和孔隙最小化,并提供了在内部空腔尺寸以及空腔到腔体对准中保持高公差的附加优点。

    Electronic package having buried passive components
    2.
    发明授权
    Electronic package having buried passive components 失效
    具有埋地无源元件的电子封装

    公开(公告)号:US5757611A

    公开(公告)日:1998-05-26

    申请号:US631397

    申请日:1996-04-12

    摘要: The invention provides for an electronic package having a buried passive component such as a capacitor therein, and a method for fabricating the same. The electronic package preferably includes a passive component portion which includes a plurality of layers of high K dielectric material, a signal processing portion which includes a plurality of layers of low K dielectric material, and at least one buffer layer interposed between the passive component portion and the signal processing portion. Metallization is preferably printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material. Preferably, the layers are co-fired at a temperature below approximately 1200.degree. C. to form the electronic package and each of the buffer layers contains approximately 25 to 100% barium compound. Via conductors may also be provided through the buffer layers to electrically couple the passive component portion and the signal processing portion and the metallization and the via conductors may be selected from highly conductive materials such as gold, silver, copper and alloys thereof.

    摘要翻译: 本发明提供一种具有埋入式无源元件(例如电容器)的电子封装及其制造方法。 电子封装优选地包括无源元件部分,其包括多层高K电介质材料,信号处理部分,其包括多层低K电介质材料,以及至少一个缓冲层,介于无源元件部分和 信号处理部分。 金属化优选印刷在高K电介质材料的层中的至少一层和低K电介质材料层中的至少一层中。 优选地,这些层在低于约1200℃的温度下共烧以形成电子封装,并且每个缓冲层含有约25至100%的钡化合物。 还可以通过缓冲层提供通孔导体,以电耦合无源部件部分和信号处理部分,并且金属化和通孔导体可以选自高导电材料,例如金,银,铜及其合金。

    Ceramic tape formulations with green tape stability
    5.
    发明授权
    Ceramic tape formulations with green tape stability 失效
    陶瓷胶带配方,绿带稳定

    公开(公告)号:US5766528A

    公开(公告)日:1998-06-16

    申请号:US800489

    申请日:1997-02-14

    IPC分类号: C04B35/634 C04B35/622

    CPC分类号: C04B35/63472 C04B35/634

    摘要: A method for producing ceramic tape used to fabricate electronic devices while eliminating continued shrinkage of the unfired tape. Chemical agents are added to a mixture of ceramic powder and binder to manipulate the crosslinking of the binder. A first approach involves promoting the crosslinking reaction to completion quickly. The second approach involves preventing the crosslinking reaction during the tape slurry mixing and casting processes. A solvent is used to accelerate the crosslinking of the binder in which the solvent may include one or more of acetone, acetylacetone, toluene and ethanol. Preferably, the solvent is a combination of acetone and acetylacetone. A polyhydroxy compound, such as glycerine, may be added to accelerate the crosslinking reaction of the binder. The boron in the tape may alternatively be rendered inoperative as a crossing agent for the binder by pre-reacting the boron with the Lewis base prior to contact with the binder. The preferred Lewis base is an organic amine, such as piperidine.

    摘要翻译: 一种制造用于制造电子装置的陶瓷带的方法,同时消除未烧结带的持续收缩。 将化学试剂加入到陶瓷粉末和粘合剂的混合物中以操纵粘合剂的交联。 第一种方法是促进交联反应迅速完成。 第二种方法涉及在胶带浆料混合和流延过程中防止交联反应。 使用溶剂来加速粘合剂的交联,其中溶剂可以包括丙酮,乙酰丙酮,甲苯和乙醇中的一种或多种。 优选地,溶剂是丙酮和乙酰丙酮的组合。 可以加入多羟基化合物如甘油以加速粘合剂的交联反应。 胶带中的硼可以替代地作为粘合剂的交叉剂不起作用,在与粘合剂接触之前使硼与路易斯碱预反应。 优选的路易斯碱是有机胺,例如哌啶。

    Planar phase shifters using low coercive force and fast switching,
multilayerable ferrite
    8.
    发明授权
    Planar phase shifters using low coercive force and fast switching, multilayerable ferrite 失效
    平面移相器采用低矫顽力和快速切换,多层铁素体

    公开(公告)号:US5774025A

    公开(公告)日:1998-06-30

    申请号:US511927

    申请日:1995-08-07

    IPC分类号: C01G49/00 H01P11/00 H01P1/215

    摘要: A planar phase shifter formed of multiple layers of a ferrite. Selected layers of the ferrite are patterned with a conductor and the multiple layers of magnetic dielectric and conductor are cofired. The phase shifter is fabricated by first obtaining ferrite powder. Then, layers of the ferrite are made, preferably by tape casting. Next the ferrite layers are metallized by applying selected amounts of conductive metals in a selected pattern upon the tape. Selected numbers of vias are placed through selected layers of tape and conductive metal is placed in the vias to provide vertical connections through the layers. The tape layers are then stacked in a predetermined order and are laminated. The laminated stack of layers is then fired to a temperature of approximately 800.degree. C. to 1000.degree. C., sintering the laminated layers into one integrated structure.

    摘要翻译: 由多层铁素体形成的平面移相器。 铁氧体的选定层用导体图案化,并且多层磁介电体和导体共烧。 通过首先获得铁素体粉末来制造移相器。 然后,优选通过带铸造制造铁氧体层。 接下来,通过将选定量的导电金属以选定的图案施加在带上,将铁素体层金属化。 选定数量的通孔通过选定的磁带层放置,并且导电金属放置在通孔中以提供通过层的垂直连接。 然后将胶带层按预定顺序堆叠并层压。 然后将层叠的层叠层烧制至约800℃至1000℃的温度,将层压层烧结成一个整体结构。

    Method for manufacturing a low loss, low temperature cofired ceramic
    9.
    发明授权
    Method for manufacturing a low loss, low temperature cofired ceramic 失效
    低损耗,低温烧结陶瓷的制造方法

    公开(公告)号:US5683528A

    公开(公告)日:1997-11-04

    申请号:US460953

    申请日:1995-06-05

    摘要: A method for forming a low temperature cofired ceramic package which is made using a multi-layered densified spherical powder formed via a sol-gel process. This densified powder is formed from layers of SiO.sub.2 reacted with trimethyl borate. The spherical powder has a preselected particle size and boron content sufficient to render the low temperature cofired ceramic package fully dense, even in the presence of a second phase filler ceramic, at a sintering temperature below 1000.degree. C. Binder material is added to the spherical powder and ceramic filler to form a plurality of tapes. A ceramic assembly is then formed by layering the plurality of tapes upon one another and firing the ceramic assembly at a temperature below 1025.degree. C. to form a fully dense cofired ceramic package. In order to form the multi-layered densified spherical powder, a silica core, which is formed using a sol-gel process, is reacted with trimethyl borate. An additional layer of silica is provided upon the reacted product which, in turn, is reacted with trimethyl borate. This process is continued until a spherical powder of desired size is formed.

    摘要翻译: 一种用于形成低温共烧陶瓷封装的方法,其使用通过溶胶 - 凝胶法形成的多层致密球形粉末制成。 该致密化粉末由与硼酸三甲酯反应的SiO 2层形成。 即使在第二相填料陶瓷的存在下,在低于1000℃的烧结温度下,球形粉末具有足以使低温共烧陶瓷封装完全致密的预选粒度和硼含量。将粘合剂材料加入到球形 粉末和陶瓷填料以形成多个带。 然后通过将多个带彼此层叠并在低于1025℃的温度下烧制陶瓷组件以形成完全致密的共烧陶瓷封装形成陶瓷组件。 为了形成多层致密球形粉末,使用溶胶 - 凝胶法形成的二氧化硅芯与硼酸三甲酯反应。 在反应产物上提供另外的二氧化硅层,其又与硼酸三甲酯反应。 继续该过程,直到形成所需尺寸的球形粉末。