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公开(公告)号:US20190144372A1
公开(公告)日:2019-05-16
申请号:US16304429
申请日:2017-06-01
Applicant: DIC Corporation
Inventor: Kazuo Arita , Tomohiro Shimono , Junji Yamaguchi
IPC: C07C213/08 , C08G59/64 , C08G73/06 , C07C215/74 , C07C215/86 , C07C215/78
CPC classification number: C07C213/08 , C07C215/74 , C07C215/76 , C07C215/78 , C07C215/80 , C07C215/86 , C08G59/50 , C08G59/64 , C08G73/0672
Abstract: A task is to provide a method for producing a polycyclic aromatic aminophenol compound through a reduced number of steps at a low cost with high safety. The method for producing a polycyclic aromatic aminophenol compound includes the step of reacting a compound represented by the general formula (1) below and an aromatic amino compound with each other: Wherein n represents an integer of 1 to 8, Ar represents a benzene ring optionally having a substituent, or a naphthalene ring optionally having a substituent, each of R1 and R2 independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms and optionally having a substituent, or an aromatic group optionally having a substituent, and R3 represents a hydroxyl group, a methoxy group, or a halogen atom.
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公开(公告)号:US20160122578A1
公开(公告)日:2016-05-05
申请号:US14896157
申请日:2014-05-23
Applicant: DIC CORPORATION
Inventor: Junji Yamaguchi , Hisashi Tanimoto , Takeshi Ibe , Makoto Yada , Naoto Yagi
IPC: C09D141/00 , C09D133/08 , C09D4/00 , C09D133/14
CPC classification number: C09D141/00 , C08F222/1006 , C08L2312/00 , C09D4/00 , C09D133/08 , C09D133/14 , G03F7/0002 , G03F7/027 , G03F7/033 , Y10T428/24802
Abstract: There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25° C. and in a state of not containing a solvent is in the range of 3 mPa·s to 8,000 mPa·s.
Abstract translation: 提供了含有可聚合化合物的可印刷的可固化组合物,其中(a)可聚合化合物中的可聚合基团的浓度在4.3mmol / g至7.5mmol / g的范围内,(b)可聚合化合物X 相对于所有聚合性化合物,其Ohnishi参数为3.5以下,环参数为0.35以上,为40质量%〜95质量%的范围,(c)具有3个以上聚合性基团的聚合性化合物C 相对于所有可聚合化合物,其含量为5质量%〜20质量%,(d)组合物的粘度为25℃,不含溶剂的状态为 范围为3 mPa·s至8,000 mPa·s。
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公开(公告)号:US10981865B2
公开(公告)日:2021-04-20
申请号:US16304875
申请日:2017-06-01
Applicant: DIC Corporation
Inventor: Junji Yamaguchi , Tomohiro Shimono , Kazuo Arita , Masato Otsu
Abstract: Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.
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公开(公告)号:US10399312B2
公开(公告)日:2019-09-03
申请号:US15781869
申请日:2016-11-08
Applicant: DIC Corporation
Inventor: Masato Otsu , Tomohiro Shimono , Kazuo Arita , Junji Yamaguchi
IPC: C07D265/16 , C08F2/44 , C08F216/12 , C08G14/073 , H05K1/03 , H01L23/14 , H01L23/29 , H01L23/31 , B32B27/42 , C08L61/34 , C08L39/00 , H01L23/00 , H01L23/373 , C08K7/02
Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.
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公开(公告)号:US10295901B2
公开(公告)日:2019-05-21
申请号:US14896157
申请日:2014-05-23
Applicant: DIC Corporation
Inventor: Junji Yamaguchi , Hisashi Tanimoto , Takeshi Ibe , Makoto Yada , Naoto Yagi
IPC: G03F7/00 , C09D4/00 , G03F7/027 , G03F7/033 , C09D133/08 , C09D133/14 , C09D141/00 , C08F222/10
Abstract: There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25° C. and in a state of not containing a solvent is in the range of 3 mPa·s to 8,000 mPa·s.
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公开(公告)号:US11104788B2
公开(公告)日:2021-08-31
申请号:US16470420
申请日:2017-12-14
Applicant: DIC Corporation
Inventor: Masato Otsu , Kazuo Arita , Etsuko Suzuki , Junji Yamaguchi , Tomohiro Shimono
IPC: C08L35/00 , C08F222/40 , C08J5/24 , H01L23/29 , H05K1/03
Abstract: An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.
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公开(公告)号:US11028059B2
公开(公告)日:2021-06-08
申请号:US15781801
申请日:2016-11-24
Applicant: DIC Corporation
Inventor: Tomohiro Shimono , Junji Yamaguchi , Masato Otsu , Kazuo Arita
IPC: C07D265/16 , C08G61/12 , C08J5/24 , H01L23/29 , H05K1/03 , H01L23/31 , B32B15/08 , C08K3/013 , B32B5/02 , B32B15/14 , B32B15/20 , B32B27/42 , H01L23/14 , H01L23/373 , H05K1/02
Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.
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公开(公告)号:US20180362477A1
公开(公告)日:2018-12-20
申请号:US15781801
申请日:2016-11-24
Applicant: DIC Corporation
Inventor: Tomohiro Shimono , Junji Yamaguchi , Masato Otsu , Kazuo Arita
IPC: C07D265/16 , C08G61/12 , C08K3/013 , C08J5/24 , H05K1/03 , H05K1/02 , H01L23/373 , H01L23/14 , B32B5/02 , B32B15/14 , B32B27/42 , B32B15/20
Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.
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公开(公告)号:US20180333941A1
公开(公告)日:2018-11-22
申请号:US15781869
申请日:2016-11-08
Applicant: DIC Corporation
Inventor: Masato Otsu , Tomohiro Shimono , Kazuo Arita , Junji Yamaguchi
IPC: B32B27/42 , C07D265/16 , C08L39/00
CPC classification number: B32B27/42 , B32B2457/08 , C07D265/16 , C08K7/02 , C08L39/00 , C08L61/34 , H01L23/14 , H01L23/293 , H01L23/31 , H01L23/3737 , H01L24/26 , H05K1/0346 , H05K1/0366 , H05K1/0373
Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.
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公开(公告)号:US11117873B2
公开(公告)日:2021-09-14
申请号:US15781890
申请日:2016-11-24
Applicant: DIC Corporation
Inventor: Kazuo Arita , Tomohiro Shimono , Masato Otsu , Junji Yamaguchi , Etsuko Suzuki
Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.
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