公开(公告)号：US20170145137A1

公开(公告)日：2017-05-25

申请号：US14907925

申请日：2014-06-17

Applicant: DIC CORPORATION

Inventor： Shunsuke Yamada ,  Takeshi Ibe ,  Nobuo Kobayashi ,  Yasuko Odani ,  Masashi Sugiyama

IPC: C08F290/06 ,  G02B1/04

CPC classification number: C08F290/067 ,  C08F290/06 ,  G02B1/041 ,  C08L75/14

Abstract: Provided is a photocurable resin composition that has a low viscosity and is capable of yielding a high refractive index. Specifically, a urethane (meth)acrylate resin (A) obtained by a reaction of an aromatic diisocyanate compound (a), a polyol compound (b), and a hydroxyl-group-containing (meth)acrylate compound (c) as essential raw material components is used. The urethane (meth)acrylate resin (A) contains a structural moiety (a-1) represented by structural formula (1) below: (where R1 represents a hydrogen atom or a methyl group) and a structural moiety (a-2) represented by structural formula (2) below: (where R1, R2, R3, X1, and X2 each independently represent a hydrogen atom or a methyl group) at a (a-1)/(a-2) molar ratio of 45/55 to 60/40. The polyol compound (b) has an aromatic hydrocarbon skeleton.

公开(公告)号：US10066042B2

公开(公告)日：2018-09-04

申请号：US14907925

申请日：2014-06-17

Applicant: DIC Corporation

Inventor： Shunsuke Yamada ,  Takeshi Ibe ,  Nobuo Kobayashi ,  Yasuko Odani ,  Masashi Sugiyama

IPC: C08F290/06 ,  G02B1/04

Abstract: Provided is a photocurable resin composition that has a low viscosity and is capable of yielding a high refractive index. Specifically, a urethane (meth)acrylate resin (A) obtained by a reaction of an aromatic diisocyanate compound (a), a polyol compound (b), and a hydroxyl-group-containing (meth)acrylate compound (c) as essential raw material components is used. The urethane (meth)acrylate resin (A) contains a structural moiety (a-1) represented by structural formula (1) below: (where R1 represents a hydrogen atom or a methyl group) and a structural moiety (a-2) represented by structural formula (2) below: (where R1, R2, R3, X1, and X2 each independently represent a hydrogen atom or a methyl group) at a (a-1)/(a-2) molar ratio of 45/55 to 60/40. The polyol compound (b) has an aromatic hydrocarbon skeleton.

公开(公告)号：US11226553B2

公开(公告)日：2022-01-18

申请号：US16077265

申请日：2017-04-25

Applicant: DIC Corporation

Inventor： Takeshi Ibe ,  Makoto Yada

IPC: G03F7/00 ,  C08F283/12 ,  C08F2/48 ,  C08L83/10 ,  G03F7/027 ,  G03F7/075 ,  C08F299/08 ,  C08L53/00 ,  H01L21/027 ,  C08F220/20 ,  C08F212/14 ,  C08F220/58 ,  C08F226/02 ,  C08G77/442 ,  C08F222/38 ,  C08F220/28

Abstract: An object of the present invention is to provide an imprinting curable composition which includes a silicon-containing polymerizable compound such as polysiloxane, exhibits outstanding adhesion to a substrate and excellent demoldability from a fine pattern mold, and causes very little mold contamination. The object is attained by providing a photo-imprinting curable composition including a polymerizable compound (A) containing a silicon atom in the molecule, a photopolymerization initiator (B) and an additive (C), the additive (C) being a compound represented by the following formula (C1) or (C2): R1OC2H4OnX1  (C1) X2OC2H4OpC3H6OqC2H4OrX3  (C2) (In the formula (C1), R1 is a C12-30 alkyl group, X1 is a hydrogen atom or an acyl group, and n is an integer of 0 to 50. In the formula (C2), X2 and X3 are each independently a hydrogen atom or an acyl group, and p, q and r are each independently an integer of 1 to 50).

公开(公告)号：US10197916B2

公开(公告)日：2019-02-05

申请号：US15517806

申请日：2015-10-06

Applicant: DIC Corporation

Inventor： Takeshi Ibe ,  Naoto Yagi ,  Hisashi Tanimoto ,  Makoto Yada

IPC: G03F7/075 ,  C07F7/18 ,  C08F30/08 ,  C08F290/00 ,  C08F299/08 ,  H01L21/027 ,  C08F290/08 ,  C07F7/21 ,  C08G77/38 ,  G03F7/00 ,  G03F7/027 ,  C08G77/20 ,  C08G77/22 ,  C08G77/26

Abstract: A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.

公开(公告)号：US09777079B2

公开(公告)日：2017-10-03

申请号：US15035897

申请日：2014-12-17

Applicant: DIC Corporation

Inventor： Takeshi Ibe ,  Makoto Yada

IPC: B29C59/02 ,  C08F12/36 ,  H01L21/311 ,  C08F12/34 ,  C08F257/00 ,  C08K5/00 ,  C08L101/02 ,  C08F12/32 ,  C09D125/16 ,  G03F7/00

CPC classification number: C08F12/36 ,  B29C59/026 ,  B81C2201/0153 ,  C08F12/32 ,  C08F12/34 ,  C08F257/00 ,  C08K5/00 ,  C08L101/02 ,  C09D125/16 ,  G03F7/0002 ,  H01L21/31144

Abstract: Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

公开(公告)号：US20160122578A1

公开(公告)日：2016-05-05

申请号：US14896157

申请日：2014-05-23

Applicant: DIC CORPORATION

Inventor： Junji Yamaguchi ,  Hisashi Tanimoto ,  Takeshi Ibe ,  Makoto Yada ,  Naoto Yagi

IPC: C09D141/00 ,  C09D133/08 ,  C09D4/00 ,  C09D133/14

CPC classification number: C09D141/00 ,  C08F222/1006 ,  C08L2312/00 ,  C09D4/00 ,  C09D133/08 ,  C09D133/14 ,  G03F7/0002 ,  G03F7/027 ,  G03F7/033 ,  Y10T428/24802

Abstract: There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25° C. and in a state of not containing a solvent is in the range of 3 mPa·s to 8,000 mPa·s.

Abstract translation: 提供了含有可聚合化合物的可印刷的可固化组合物，其中（a）可聚合化合物中的可聚合基团的浓度在4.3mmol / g至7.5mmol / g的范围内，（b）可聚合化合物X 相对于所有聚合性化合物，其Ohnishi参数为3.5以下，环参数为0.35以上，为40质量％〜95质量％的范围，（c）具有3个以上聚合性基团的聚合性化合物C 相对于所有可聚合化合物，其含量为5质量％〜20质量％，（d）组合物的粘度为25℃，不含溶剂的状态为 范围为3 mPa·s至8,000 mPa·s。

公开(公告)号：US20230159707A1

公开(公告)日：2023-05-25

申请号：US17801353

申请日：2021-02-04

Applicant: DIC Corporation

Inventor： Takeshi Ibe ,  Tomoyuki Imada

IPC: C08G77/20 ,  C09D183/04 ,  C08F299/08 ,  G03F7/075 ,  H01B3/44 ,  H01B19/04 ,  H01B19/02 ,  B29C59/02

CPC classification number: C08G77/20 ,  B29C59/022 ,  C08F299/08 ,  C09D183/04 ,  G03F7/0757 ,  H01B3/44 ,  H01B19/02 ,  H01B19/04 ,  B29K2083/00

Abstract: Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

公开(公告)号：US10295901B2

公开(公告)日：2019-05-21

申请号：US14896157

申请日：2014-05-23

Applicant: DIC Corporation

Inventor： Junji Yamaguchi ,  Hisashi Tanimoto ,  Takeshi Ibe ,  Makoto Yada ,  Naoto Yagi

IPC: G03F7/00 ,  C09D4/00 ,  G03F7/027 ,  G03F7/033 ,  C09D133/08 ,  C09D133/14 ,  C09D141/00 ,  C08F222/10

Abstract: There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25° C. and in a state of not containing a solvent is in the range of 3 mPa·s to 8,000 mPa·s.

公开(公告)号：US20160272737A1

公开(公告)日：2016-09-22

申请号：US15035897

申请日：2014-12-17

Applicant: DIC CORPORATION

Inventor： Takeshi Ibe ,  Makoto Yada

IPC: C08F12/36 ,  H01L21/311 ,  B29C59/02

CPC classification number: C08F12/36 ,  B29C59/026 ,  B81C2201/0153 ,  C08F12/32 ,  C08F12/34 ,  C08F257/00 ,  C08K5/00 ,  C08L101/02 ,  C09D125/16 ,  G03F7/0002 ,  H01L21/31144

Abstract: Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

Abstract translation: 提供一种干蚀刻抗蚀剂用固化性树脂组合物，该固化性树脂组合物含有在侧链具有包含具有乙烯基的芳香族基团的特定结构的聚合物（A）。 聚合物（A）包括80至100重量％的特定结构。 此外，提供了通过固化用于干蚀刻抗蚀剂的可固化组合物获得的干蚀刻抗蚀剂掩模，以及具有通过纳米压印法形成的图案的干蚀刻抗蚀剂掩模。

公开(公告)号：US20140255714A1

公开(公告)日：2014-09-11

申请号：US14352690

申请日：2012-10-18

Applicant: DIC Corporation

Inventor： Masashi Sugiyama ,  Ikue Hamamoto ,  Naoto Inoue ,  Daisuke Nakazawa ,  Takeshi Ibe

IPC: C09J175/14 ,  B32B7/12

CPC classification number: C09J175/14 ,  B32B7/12 ,  B32B27/308 ,  B32B27/36 ,  B32B2270/00 ,  C08F299/065 ,  C08G18/4216 ,  C08G18/4238 ,  C08G18/672 ,  C08G18/755 ,  C08G18/7621 ,  C08L67/02 ,  C09J4/06 ,  C09J167/07 ,  C09J175/16 ,  Y10T428/31786

Abstract: To provide an active-energy-ray-curable resin composition that exhibits high bonding strength even to plastic films that are difficult to bond such as untreated PET films, fluorine-based films, and polycarbonate films, which are referred to as difficult-to-bond films, and that can maintain the bonding strength even under wet heat conditions; an adhesive including the resin composition; and a laminate film obtained by using the adhesive. The essential components contained are a (meth)acrylate compound (A), a polyester resin (B), and a polymerization initiator (D), the (meth)acrylate compound (A) having a weight-average molecular weight (Mw) in a range of 5,000 to 30,000 and including, in a molecular structure, a (meth)acryloyl group and a polyester moiety, and the polyester resin (B) having an acid value in a range of 40 to 90 mgKOH/g.

Abstract translation: 为了提供即使对于未被处理的PET膜，氟基膜和聚碳酸酯膜等难以接合的塑料膜也显示出高的接合强度的活性能量射线固化树脂组合物，这被称为难以接合的树脂组合物， 粘结膜，即使在湿热条件下也能保持粘合强度; 包含树脂组合物的粘合剂; 和通过使用粘合剂获得的层压膜。 所含的主要成分是（甲基）丙烯酸酯化合物（A），聚酯树脂（B）和聚合引发剂（D），（甲基）丙烯酸酯化合物（A）的重均分子量（Mw） 范围为5000〜30,000，在分子结构中包含（甲基）丙烯酰基和聚酯部分，并且酸值在40〜90mgKOH / g的范围内的聚酯树脂（B）。