摘要:
The present invention relates to a light emitting diode with enhanced luminance and light emitting performance due to increase in efficiency of current diffusion into an ITO layer, and a method of fabricating the light emitting diode. According to the present invention, there is manufactured at least one light emitting cell including an N-type semiconductor layer, an active layer and a P-type semiconductor layer on a substrate. The method of the present invention comprises the steps of (a) forming at least one light emitting cell with an ITO layer formed on a top surface of the P-type semiconductor layer; (b) forming a contact groove for wiring connection in the ITO layer through dry etching; and (c) filling the contact groove with a contact connection portion made of a conductive material for the wiring connection.
摘要:
Disclosed herein is an AC light emitting diode. The light emitting diode comprises a plurality of light emitting cells two-dimensionally arranged on a single substrate. Wires electrically connect the light emitting cells to one another to thereby form a serial array of the light emitting cells. Further, the light emitting cells are spaced apart from one another by distances within a range of 10 to 30 μm, and the serial array is operated while connected to an AC power source. Accordingly, the excellent operating characteristics and light output power can be secured in an AC light emitting diode with a limited size.
摘要:
The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted.
摘要:
Disclosed is a light emitting device having an isolating insulative layer for isolating light emitting cells from one another and a method of fabricating the same. The light emitting device comprises a substrate and a plurality of light emitting cells formed on the substrate. Each of the light emitting cells includes a lower semiconductor layer, an upper semiconductor layer positioned on one region of the lower semiconductor layer, and an active layer interposed between the lower and upper semiconductor layers. Furthermore, an isolating insulative layer is filled in regions between the plurality of light emitting cells to isolate the light emitting cells from one another. Further, wirings electrically connect the light emitting cells with one another. Each of the wirings connects the lower semiconductor layer of one light emitting cell and the upper semiconductor layer of another light emitting cell adjacent to the one light emitting cell.
摘要:
The disclosed light emitting device comprises at least one first light emitting element including at least one light emitting chip for emitting light having a wavelength of 400 to 500 nm and a phosphor; and at least one second light emitting element disposed adjacent to the first light emitting element to emit light having a wavelength of 560 to 880 nm.
摘要:
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要:
The present invention relates to a network-based Internet worm detection apparatus and method using vulnerability analysis and attack modeling. In the network-based Internet worm detection apparatus, a vulnerability information storage unit stores the vulnerability information of an application program that is necessary for attack detection. A threat determiner determines whether a packet transmitted over a network is destined for a vulnerable application program with vulnerability. A packet content extractor extracts, using the vulnerability information, information for determination of an attack packet from the packet determined to be destined for the vulnerable application program. An attack determiner compares and analyzes the extracted information and the vulnerability information to determine whether the packet is an attack packet. The vulnerability information of the application program and attack modeling are used to detect an Internet worm, thereby making it possible to counteract the attack packet. In addition, only a portion of information belonging to a specific session of a segmented or disordered packet is stored, thereby making it possible to increase the use efficiency of a storage device and to reduce the resource necessary for processing a packet.
摘要:
The sensing device is provided. A sensing device according to an exemplary embodiment of the present invention includes a lower panel, an upper panel facing the lower panel, a liquid crystal layer positioned between the lower panel and the upper panel, an infrared ray sensor formed in at least one of the lower panel and the upper panel, a visible light sensor formed in at least one of the lower panel and the upper panel, and a backlight device positioned at an outer surface of the lower panel, wherein the backlight device includes a plurality of light emitting members representing different colors and an infrared ray light emitting member.
摘要:
An optical semiconductor lighting apparatus having at least one or more clamping units are formed along a longitudinal direction of a race way. A first sealing unit finishes both ends of a housing attached to or detached from the clamping unit. A second sealing unit surrounds upper and lower portions of both edges of an optical member disposed on the bottom surface of the housing. A wireless communication unit receives a dimming signal through a wireless communication network, and outputs the received dimming signal to a power supply unit. The power supply unit supplies a DC voltage to the light emitting module to control the illuminance of the light emitting module according to the dimming signal input from the wireless communication unit.
摘要:
An AC light emitting device is disclosed. The AC light emitting device includes at least four substrates. Serial arrays each of which has a plurality of light emitting cells connected in series are positioned on the substrates, respectively. Meanwhile, first connector means electrically connect the serial arrays formed on respective different substrates. At least two array groups each of which has at least two of the serial arrays connected in series by the first connector means are formed. The at least two array groups are connected in reverse parallel to operate. Accordingly, there is provided an AC light emitting device capable of being driven under an AC power source.