Wafer supporting system for semiconductor wafers
    2.
    发明申请
    Wafer supporting system for semiconductor wafers 审中-公开
    晶圆支撑系统用于半导体晶圆

    公开(公告)号:US20050147489A1

    公开(公告)日:2005-07-07

    申请号:US10745923

    申请日:2003-12-24

    IPC分类号: B66C17/08 H01L21/68

    摘要: The embodiments of the present invention include coating a semiconductor wafer with a polymer layer and attaching the polymer layer to a support substrate with a tape. The tape has at least two adhesive sides, and at least one radiation sensitive side. The radiation sensitive side facilitates release of the tape.

    摘要翻译: 本发明的实施例包括用聚合物层涂覆半导体晶片并且用胶带将聚合物层附着到支撑基板上。 胶带具有至少两个粘合剂侧面和至少一个辐射敏感侧。 辐射敏感侧有利于胶带的释放。