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1.发明授权
公开(公告)号：US5311405A
公开(公告)日：1994-05-10
申请号：US100834
申请日：1993-08-02
CPC分类号： H05K1/111 , B23K1/0016 , H05K13/0465 , H05K3/3442 , B23K2201/36 , H05K2201/0939 , H05K2201/0989 , H05K2201/10636 , H05K2203/048 , H05K2203/0545 , Y02P70/611 , Y02P70/613
摘要： A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702) portions for attaching to a corresponding pad on a substrate (102) by a reflow solder process (1200). A pad arrangement (100) is formed including two opposite pads (108), each pad (108) occupying a tri-oval-shaped area. The tri-oval-shaped area includes an elliptical area (110) substantially centered under the bottom portion (704) of the corresponding termination of the component (402) when the component (402) is aligned with the pad arrangement (100), and an arcuate area (112) contiguous with the elliptical area (110) and extending towards the opposite pad (108) in a central lengthwise direction. A solder paste (202) is applied to the elliptical area (110), and thereafter reflowed, whereby solder (302) in the solder paste (202) liquefies and flows onto the arcuate area (112), thereby facilitating alignment of the component (402) with the pad arrangement (100).
摘要翻译： 一种方法和装置将包括在组件（402）的每个端部处的端接件的无引线表面安装部件（402）对准和附接。 终端具有底部（704）和端部（702）部分，用于通过回流焊接工艺（1200）附接到衬底（102）上的对应衬垫。 形成包括两个相对的焊盘（108）的焊盘装置（100），每个焊盘（108）占据三椭圆形的区域。 当所述部件（402）与所述垫装置（100）对准时，所述三椭圆形区域包括基本上位于所述部件（402）的相应终端的底部（704）下方的中心的椭圆形区域（110），以及 与椭圆形区域（110）相邻并在中心纵向方向上朝向相对的垫（108）延伸的弧形区域（112）。 将焊膏（202）施加到椭圆形区域（110）上，然后回流焊接，由此焊膏（202）中的焊料（302）液化并流到弧形区域（112），从而有助于部件 402）。
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公开(公告)号：US5453581A
公开(公告)日：1995-09-26
申请号：US112928
申请日：1993-08-30
CPC分类号： H05K1/111 , H05K3/3442 , H05K2201/09381 , H05K2201/0939 , H05K2201/0989 , H05K2201/10636 , H05K2203/048 , Y02P70/611 , Y02P70/613
摘要： A pad arrangement (100) for aligning and attaching a surface mount component (402) with other circuitry includes a substrate (102) upon which opposing pads (108) are attached. Each of the pads occupies a substantially rectangular area (110) having four sides. In order to facilitate alignment of the surface mount component the substantially rectangular area has two opposing flat sides an outwardly extending arcuate area (112) along at least one of the other two sides.
摘要翻译： 用于将表面安装部件（402）与其它电路对准和附接的焊盘装置（100）包括衬底（102），相对的焊盘（108）附接在衬底上。 每个垫片占据具有四个侧面的大致矩形区域（110）。 为了便于表面安装部件的对准，基本上矩形区域具有两个相对的平坦侧面，沿着另外两个侧面中的至少一个的向外延伸的弧形区域（112）。
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公开(公告)号：US5244395A
公开(公告)日：1993-09-14
申请号：US921161
申请日：1992-07-29
CPC分类号： H01R12/52 , H01R12/82 , H05K3/366 , H01R13/2414 , H05K2201/0314 , H05K2201/048 , H05K2201/09645 , H05K2201/10265 , H05K3/325
摘要： A circuit interconnect system comprises a circuit pattern (22) on a rigid insulating sheet (17), forming a first circuit carrying substrate (12). A portion of the circuit pattern wraps around an edge of the insulating sheet and continues onto a vertical wall (20) of the sheet to provide a contact surface (24). An electrically conductive portion (16) of a second member (14) is mated to the first circuit carrying substrate by aligning the contact surface to the electrically conductive portion. An electrically conductive resilient material such as a conductive elastomer (35) or metal spring (35) provides electrical interconnection between the circuit pattern and the electrically conductive portion.
摘要翻译： 电路互连系统包括刚性绝缘片（17）上的电路图案（22），形成第一电路承载衬底（12）。 电路图案的一部分围绕绝缘片的边缘缠绕并且继续到片材的垂直壁（20）以提供接触表面（24）。 第二构件（14）的导电部分（16）通过将接触表面对准导电部分而与第一电路承载衬底配合。 诸如导电弹性体（35）或金属弹簧（35）的导电弹性材料提供电路图案和导电部分之间的电互连。
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