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1.发明授权公开(公告)号：US06488570B1
公开(公告)日：2002-12-03
申请号：US09665840
申请日：2000-09-20
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B41/047 , B24D3/28 , B24D3/34 , B24D13/10 , G11B23/0021 , H01L21/30625
摘要： A method of making a polishing pad composition comprising a high modulus phase component and a low modulus phase component, and a method of polishing a semiconductor substrate by creating nanoasperities at a polishing interface between the polishing layer and the wafer during polishing by providing the high modulus phase component at the polishing interface, either as protrusions from the polishing layer, or by being released from the polishing layer into the polishing interface.
摘要翻译： 一种制造包含高模量相成分和低模量相成分的抛光垫组合物的方法，以及通过在抛光过程中在抛光层和晶片之间的抛光界面处产生纳米级的抛光来提供半模量的方法 抛光界面上的相分量，作为来自抛光层的突起，或通过从抛光层释放到抛光界面中。
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2.发明授权Apparatus and methods for chemical-mechanical polishing of semiconductor wafers 有权用于化学机械抛光半导体晶片的装置和方法公开(公告)号：US06210525B1
公开(公告)日：2001-04-03
申请号：US09634788
申请日：2000-08-09
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
IPC分类号： H01L2100
CPC分类号： B24B37/26 , B24B37/04 , B24B41/047 , B24B57/02 , B24D3/28 , B24D3/34 , B24D13/10 , G11B23/0021 , H01L21/02024
摘要： An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.
摘要翻译： 提供了一种用于抛光半导体晶片的表面的设备和方法，其中抛光垫在其表面上具有多个纳米级，其是具有约0.5至约0.1微米的插补半径（曲率）的颗粒，并且具有足够的永久性弹性 变形小于10％，其与晶片表面结合反应性液体溶液接触。
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3.发明授权Polishing system having a multi-phase polishing substrate and methods relating thereto 失效具有多相抛光基板的抛光系统及其相关方法公开(公告)号：US06375559B1
公开(公告)日：2002-04-23
申请号：US09384607
申请日：1999-08-27
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
IPC分类号： B24D1100
CPC分类号： B24B37/26 , B24B41/047 , B24D3/28 , B24D3/34 , B24D13/10 , G11B23/0021 , H01L21/30625
摘要： A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a polishing pad composition comprising a high modulus phase component and a low modulus phase component. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.
摘要翻译： 特别适用于制造半导体器件等的化学机械抛光系统。 本发明涉及一种包括高模量相分量和低模量相分量的抛光垫组合物。 多相抛光垫在提供沿着整个抛光表面界面的高性能抛光方面是非常有效和有效的。
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4.发明授权Polishing system having a multi-phase polishing substrate and methods relating thereto 失效具有多相抛光基板的抛光系统及其相关方法
公开(公告)号：US6099394A
公开(公告)日：2000-08-08
申请号：US49864
申请日：1998-03-27
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
IPC分类号： B24B37/26 , B24B41/047 , B24D3/28 , B24D3/34 , B24D13/10 , B24D13/14 , G11B23/00 , H01L21/306 , B24B7/00
CPC分类号： B24B37/26 , B24B41/047 , B24D13/10 , B24D3/28 , B24D3/34 , H01L21/30625 , G11B23/0021
摘要： A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, polishing pad comprising a high modulus phase and a low modulus phase. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.
摘要翻译： 一种特别适用于制造半导体器件等的化学机械抛光系统。 本发明涉及一种包括高模量相和低模量相的自修整抛光垫。 多相抛光垫在提供沿着整个抛光表面界面的高性能抛光方面是非常有效和有效的。
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公开(公告)号：US6069080A
公开(公告)日：2000-05-30
申请号：US138628
申请日：1998-08-24
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Heinz F. Reinhardt
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Heinz F. Reinhardt
IPC分类号： B24B37/26 , B24B41/047 , B24B53/00 , B24B53/007 , B24B53/017 , B24D3/28 , B24D3/32 , B24D3/34 , B24D13/10 , B24D13/14 , B29C70/58 , B29C70/66 , C08J5/14 , G11B23/00 , H01L21/304 , H01L21/306 , H01L21/3105 , H01L21/302
CPC分类号： H01L21/02024 , B24B37/26 , B24B41/047 , B24B53/00 , B24B53/017 , B24D13/10 , B24D3/28 , B24D3/32 , B24D3/34 , B29C70/58 , B29C70/66 , H01L21/30604 , H01L21/30625 , H01L21/31053 , B29L2031/736 , G11B23/0021
摘要： A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like.
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6.发明授权Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like 有权用于制造半导体器件，存储盘等的固定磨料抛光系统公开(公告)号：US06337281B1
公开(公告)日：2002-01-08
申请号：US09521042
申请日：2000-03-08
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Heinz F. Reinhardt
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Heinz F. Reinhardt
IPC分类号： H01L21461
CPC分类号： H01L21/02024 , B24B37/26 , B24B41/047 , B24B53/00 , B24B53/017 , B24D3/28 , B24D3/32 , B24D3/34 , B24D13/10 , B29C70/58 , B29C70/66 , B29L2031/736 , G11B23/0021 , H01L21/30604 , H01L21/30625 , H01L21/31053
摘要： A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like.
摘要翻译： 一种特别适用于制造半导体器件，存储器盘等的固定的磨料化学机械抛光系统。
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公开(公告)号：US06245679B1
公开(公告)日：2001-06-12
申请号：US09498267
申请日：2000-02-03
申请人： Lee Melbourne Cook , David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
发明人： Lee Melbourne Cook , David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
IPC分类号： H01L2100
CPC分类号： B24B37/26 , B24B37/04 , B24B41/047 , B24B57/02 , B24D3/28 , B24D3/34 , G11B23/0021
摘要： An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.
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8.发明授权Method of fabricating a porous polymeric material by electrophoretic deposition 失效通过电泳沉积制造多孔聚合物材料的方法公开(公告)号：US06284114B1
公开(公告)日：2001-09-04
申请号：US09536189
申请日：2000-03-24
IPC分类号： C23C2800
CPC分类号： B24B37/11 , B24D18/00 , B24D18/0018 , C09D5/44 , H01L21/30625
摘要： A method is provided for the fabrication of a porous polymeric material by electrophoretic deposition. The porous polymeric material is particularly well suited as a polishing surface for the planarization of semiconductor wafers.
摘要翻译： 提供了一种通过电泳沉积制造多孔聚合物材料的方法。 多孔聚合材料特别适合作为用于半导体晶片平坦化的抛光表面。
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