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公开(公告)号:US08717775B1
公开(公告)日:2014-05-06
申请号:US12848833
申请日:2010-08-02
申请人: David Bolognia , Ted Adlam , Mike Kelly
发明人: David Bolognia , Ted Adlam , Mike Kelly
IPC分类号: H05K1/11
CPC分类号: G06K9/00053 , H01L21/563 , H01L23/13 , H01L23/3121 , H01L23/49816 , H01L23/49827 , H01L24/06 , H01L2224/0401 , H01L2224/16225 , H01L2224/48091 , H01L2224/73204 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A fingerprint sensor package includes a flat surface having a dielectric protective coating protecting a sensing element of a fingerprint sensor and an electrically conductive bezel that discharges electrostatic discharge (ESD). Both the protective coating and the bezel can be colored to have desired colors. Accordingly, the flat surface can be colored as desired enhancing the attractiveness for consumer applications. Further, light emitting diodes are integrated into the fingerprint sensor package providing a visual feedback to the user that the user's fingerprint has been successfully sensed. Further, the fingerprint sensor package is formed using a high volume low cost assembly technique.
摘要翻译: 指纹传感器封装包括具有保护指纹传感器的感测元件的绝缘保护涂层的平坦表面和放电静电放电(ESD)的导电边框。 保护涂层和表圈都可以着色以获得所需的颜色。 因此,平坦表面可以根据需要进行着色,增强了消费者应用的吸引力。 此外,发光二极管被集成到指纹传感器封装中,向用户提供用户的指纹已被成功感测的视觉反馈。 此外,使用高容量的低成本组装技术形成指纹传感器封装。
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公开(公告)号:US08102032B1
公开(公告)日:2012-01-24
申请号:US12330769
申请日:2008-12-09
申请人: David Bolognia , Mike Kelly , Lee Smith
发明人: David Bolognia , Mike Kelly , Lee Smith
IPC分类号: H01L21/56
CPC分类号: H01L23/3128 , H01L23/552 , H01L24/48 , H01L24/73 , H01L25/162 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3025 , H05K1/144 , H05K2201/042 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device has a first substrate having a plurality of metal traces. At least one electronic component is electrically attached to a first surface of the first substrate. A second substrate has a plurality of metal traces and attached to the first substrate. At least one electronic component is electrically attached to a first surface of the second substrate. An RF shield is formed on the first substrate to minimizing Electro-Magnetic Interference (EMI) radiation and Radio Frequency (RF) radiation to the at least one electronic component on the first substrate to form an RF shield. A mold compound is used for encapsulating the semiconductor device.
摘要翻译: 半导体器件具有具有多个金属迹线的第一衬底。 至少一个电子部件电连接至第一基板的第一表面。 第二基板具有多个金属迹线并且附接到第一基板。 至少一个电子部件电连接到第二基板的第一表面。 在第一基板上形成RF屏蔽以最小化到第一基板上的至少一个电子部件的电磁干扰(EMI)辐射和射频(RF)辐射,以形成RF屏蔽。 模具化合物用于封装半导体器件。
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公开(公告)号:US08030722B1
公开(公告)日:2011-10-04
申请号:US12397470
申请日:2009-03-04
申请人: David Bolognia , Bob Shih Wei Kuo , Bud Troche
发明人: David Bolognia , Bob Shih Wei Kuo , Bud Troche
IPC分类号: H01L31/0203
CPC分类号: B81B7/0061 , B81B7/0064 , B81B2201/0257 , B81B2207/012 , B81B2207/092 , B81B2207/095 , B81B2207/096 , H01L2224/48137 , H01L2224/73265 , H01L2924/15151
摘要: A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. A cover substrate having a plurality of metal traces and a plurality of cover vias is provided. A first die is attached to the first surface of the substrate and positioned over the opening. Side members are coupled to ground planes on the base substrate and cover substrate to form an RF shield around the first die. At least one wirebond having a first end attached to the first die and a second end attached to a metal trace of the base substrate is provided. The at least one wirebond forms a loop wherein a top section of the loop contacts a metal trace of the cover substrate.
摘要翻译: 半导体器件具有具有多个金属迹线和多个基极通孔的基底基板。 通过基底基板形成开口。 提供具有多个金属迹线和多个覆盖通孔的覆盖基板。 第一模具附接到基板的第一表面并且定位在开口上方。 侧构件耦合到基底基板和覆盖基板上的接地平面,以在第一裸片周围形成RF屏蔽。 提供了至少一个引线键,其具有附接到第一管芯的第一端和附接到基底衬底的金属迹线的第二端。 所述至少一个引线键形成环,其中所述环的顶部部分接触所述覆盖基板的金属迹线。
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公开(公告)号:US20050150792A1
公开(公告)日:2005-07-14
申请号:US11075166
申请日:2005-03-08
申请人: David Bolognia , Larry Durham , Ken Freitag , George Rufo
发明人: David Bolognia , Larry Durham , Ken Freitag , George Rufo
CPC分类号: G11B33/045
摘要: A storage package for a recording medium configured to resemble a book includes a paper board panel releasably attached to first and second plastic, recording medium-holding components, each including a planar surface having means on one face for holding a recording. Upstanding wall portions on one of the components nest within the corresponding wall portions of the other component when the components are assembled together.
摘要翻译: 用于与书相似的记录介质的存储包装包括一个可释放地附着到第一和第二塑料的记录介质保持部件的纸板面板,每个记录介质保持部件包括一个平面,该平面具有在一个面上用于保持记录的装置。 当组件组装在一起时,其中一个部件上的直立壁部分嵌套在另一部件的相应壁部内。
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公开(公告)号:US5709300A
公开(公告)日:1998-01-20
申请号:US788555
申请日:1997-01-24
CPC分类号: G11B33/0427
摘要: A slide tray package has, in combination, a slide tray for holding a recording medium (such as a compact disc or audio cassette) and a housing therefor. In the slide tray a receiving area is disposed between the ends and sides thereof for receiving the recording medium for horizontal movement therewith. The slide tray leading end is adapted for automated loading of the slide tray into the housing by being both horizontally tapered and vertically beveled to facilitate telescopic insertion of the slide tray leading end through a leading end of the housing and into a trailing end of the housing. The slide tray trailing end defines a vertically protruding lip configured and dimensioned as a stop for engaging a leading end of the housing to limit the telescopic insertion of the slide tray into the housing. In the housing, the leading end of each of the top and bottom housing faces is configured and dimensioned to enable direct grasping of the slide tray by the user, and the leading end of each of the housing sides is configured and dimensioned to frictionally engage the slide tray, thereby to inhibit accidental telescopic slippage of the slide tray out of the housing.
摘要翻译: 滑动盘包装组合有用于保持记录介质(例如光盘或音频盒式磁带)的滑动托架及其壳体。 在滑动托架中,接收区域设置在其端部和侧面之间,用于接收用于水平运动的记录介质。 滑动托盘前端适于通过水平锥形和垂直倾斜自动加载滑动托盘进入壳体,以便滑动托盘前端伸出插入壳体的前端并进入壳体的后端 。 滑动托架尾端限定了一个垂直突出的唇缘,其被构造成尺寸为止挡件,用于接合壳体的前端以限制滑动托盘伸入壳体中。 在壳体中,顶部和底部壳体表面的每个的前端被构造和尺寸设计成能够由使用者直接抓住滑动托盘,并且每个壳体侧面的前端被构造和尺寸设计成摩擦地接合 滑动托盘,从而防止滑动托盘意外伸缩滑出壳体。
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公开(公告)号:US5785172A
公开(公告)日:1998-07-28
申请号:US580326
申请日:1995-12-28
申请人: David Bolognia , George Rufo, Jr. , Alvin Thomas
发明人: David Bolognia , George Rufo, Jr. , Alvin Thomas
CPC分类号: G11B33/045 , G11B33/0405
摘要: A storage tray for holding and receiving at least two compact discs wherein the storage tray has a double rosette consisting of an upper and lower rosette the extremities of the cantilever members (fingers) of which form a circular opening having a common center. The double rosette is on at least the same side of the storage tray. Also a storage container or jewel box consisting of a cover and a base pivotally attached at the same end thereof and containing the storage tray with the double rosette.
摘要翻译: 一种用于保持和接收至少两个光盘的存储托盘,其中所述存储托盘具有由上和下玫瑰构成的双玫瑰花瓣,所述悬臂构件的四肢形成具有公共中心的圆形开口。 双莲座至少位于存储托盘的同一侧。 还有一个存储容器或宝石盒,由一个盖子和一个基座组成,底座可枢转地安装在同一端,并且容纳具有双玫瑰花的储存托盘。
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公开(公告)号:US20170346661A1
公开(公告)日:2017-11-30
申请号:US15164267
申请日:2016-05-25
申请人: Michael McCarthy , David Bolognia , Oisin Aodh O. Cuanachain , Check F. Lee , Miguel Angel Fernandez Robayna
发明人: Michael McCarthy , David Bolognia , Oisin Aodh O. Cuanachain , Check F. Lee , Miguel Angel Fernandez Robayna
CPC分类号: H04L25/0278 , H04L25/0266 , H04L25/03019 , H04L25/085
摘要: An integrated circuit is disclosed and includes an Ethernet physical layer (PHY) with a plurality of communication channels. The communication channels coupled to a corresponding plurality of terminals. The integrated circuit further includes a plurality of electrical isolation circuits and a compensation circuit. At least one of the plurality of electrical isolation circuits is coupled to a corresponding one of the plurality of communication channels and electrically isolates the PHY from a corresponding one of the plurality of terminals. The compensation circuit is configured to compensate for at least one of baseline wander and parameter drift associated with at least one of the plurality of isolation circuits. The PHY and the plurality of isolation circuits are integrated on a single substrate.
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公开(公告)号:US08981537B2
公开(公告)日:2015-03-17
申请号:US13348304
申请日:2012-01-11
申请人: David Bolognia , Bob Shih-Wei Kuo , Bud Troche
发明人: David Bolognia , Bob Shih-Wei Kuo , Bud Troche
IPC分类号: H01L31/0203 , H01L23/552 , B81B7/00 , H01L23/00 , H01L25/16
CPC分类号: B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/012 , B81B2207/095 , H01L23/552 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/165 , H01L2224/32225 , H01L2224/48095 , H01L2224/48137 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/1461 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/85399 , H01L2224/05599
摘要: A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.
摘要翻译: 半导体器件具有具有多个金属迹线和多个基极通孔的基底基板。 通过基底基板形成开口。 至少一个模具附接到基板的第一表面并且定位在开口上方。 盖基板具有多个金属迹线。 盖衬底中的空腔形成围绕腔的侧壁部分。 覆盖基板被附接到基底基底,使得至少一个管芯位于空腔的内部。 基底衬底中的接地平面耦合到覆盖衬底中的接地平面,以在至少一个管芯周围形成RF屏蔽。
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公开(公告)号:US08115283B1
公开(公告)日:2012-02-14
申请号:US12502627
申请日:2009-07-14
申请人: David Bolognia , Bob Shih-Wei Kuo , Bud Troche
发明人: David Bolognia , Bob Shih-Wei Kuo , Bud Troche
IPC分类号: H01L23/552 , H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号: B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/012 , B81B2207/095 , H01L23/552 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/165 , H01L2224/32225 , H01L2224/48095 , H01L2224/48137 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/12041 , H01L2924/1461 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/85399 , H01L2224/05599
摘要: A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.
摘要翻译: 半导体器件具有具有多个金属迹线和多个基极通孔的基底基板。 通过基底基板形成开口。 至少一个模具附接到基板的第一表面并且定位在开口上方。 盖基板具有多个金属迹线。 盖衬底中的空腔形成围绕腔的侧壁部分。 覆盖基板被附接到基底基底,使得至少一个管芯位于空腔的内部。 基底衬底中的接地平面耦合到覆盖衬底中的接地平面,以在至少一个管芯周围形成RF屏蔽。
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10.
公开(公告)号:US08008753B1
公开(公告)日:2011-08-30
申请号:US12107478
申请日:2008-04-22
申请人: David Bolognia
发明人: David Bolognia
IPC分类号: H01L21/4763 , H01L23/552
CPC分类号: H01L23/552 , H01L24/16 , H01L24/48 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48 , H01L2224/73204 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要: An integrated circuit module has a substrate having a plurality of metal traces. At least one semiconductor package is electrically coupled to at least one metal trace on a first surface of the substrate. At least one electronic component is electrically coupled to at least one metal trace on the first surface of the substrate. A non-conductive coating covers exposed active surfaces on the first surface of the substrate. A conductive coating is applied to the non-conductive coating, and electrically contacting ground pads exposed on the substrate.
摘要翻译: 集成电路模块具有具有多个金属迹线的基板。 至少一个半导体封装电耦合到衬底的第一表面上的至少一个金属迹线。 至少一个电子部件电耦合到衬底的第一表面上的至少一个金属迹线。 非导电涂层覆盖在基底的第一表面上的暴露的活性表面。 将导电涂层施加到非导电涂层,并且电接触暴露在基底上的接地焊盘。
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