公开(公告)号：US20060046485A1

公开(公告)日：2006-03-02

申请号：US11011401

申请日：2004-12-13

申请人： Duck Maeng ,  Byung Sun ,  Tae Kim ,  Jee Mok ,  Jong Bae ,  Yoong Oh ,  Chang-Kyu Song ,  Suk-Hyeon Cho

发明人： Duck Maeng ,  Byung Sun ,  Tae Kim ,  Jee Mok ,  Jong Bae ,  Yoong Oh ,  Chang-Kyu Song ,  Suk-Hyeon Cho

IPC分类号： H01L21/302

CPC分类号： H01L21/486 ,  H01L23/142 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/207 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4647 ,  H05K2203/0152 ,  H05K2203/0315 ,  H01L2924/00

摘要： Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.

摘要翻译： 本文公开了使用阳极氧化制造具有精细电路图案的封装衬底的方法。 通过对通过掩模工艺开放的金属芯进行阳极氧化，在金属芯的开放区域中形成氧化层，以使电路图案的部分彼此绝缘。 此外，通过使用屏幕将设置在氧化层之间的电镀部分用铜或在氧化层之间填充导电浆料，实现了具有精细电路图案的封装衬底。

公开(公告)号：US07169707B2

公开(公告)日：2007-01-30

申请号：US11011401

申请日：2004-12-13

申请人： Duck Young Maeng ,  Byung Kook Sun ,  Tae Hoon Kim ,  Jee Soo Mok ,  Jong Suk Bae ,  Yoong Oh ,  Chang-Kyu Song ,  Suk-Hyeon Cho

发明人： Duck Young Maeng ,  Byung Kook Sun ,  Tae Hoon Kim ,  Jee Soo Mok ,  Jong Suk Bae ,  Yoong Oh ,  Chang-Kyu Song ,  Suk-Hyeon Cho

IPC分类号： H01L21/302

CPC分类号： H01L21/486 ,  H01L23/142 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/207 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4647 ,  H05K2203/0152 ,  H05K2203/0315 ,  H01L2924/00

摘要： Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.

摘要翻译： 本文公开了使用阳极氧化制造具有精细电路图案的封装衬底的方法。 通过对通过掩模工艺开放的金属芯进行阳极氧化，在金属芯的开放区域中形成氧化层，以使电路图案的部分彼此绝缘。 此外，通过使用屏幕将设置在氧化层之间的电镀部分用铜或在氧化层之间填充导电浆料，实现了具有精细电路图案的封装衬底。

公开(公告)号：US07279412B2

公开(公告)日：2007-10-09

申请号：US10717977

申请日：2003-11-20

申请人： Jee-Soo Mok ,  Byung-Kook Sun ,  Chang-Kyu Song ,  Geum-Hee Yun ,  Tae-Hoon Kim

发明人： Jee-Soo Mok ,  Byung-Kook Sun ,  Chang-Kyu Song ,  Geum-Hee Yun ,  Tae-Hoon Kim

IPC分类号： H01L21/4763 ,  H05K3/00

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K3/4638 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2203/0191 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.

摘要翻译： 公开了一种多层印刷电路板和制造多层印刷电路板的方法。 交替堆叠电路层和绝缘层，使得没有施加附加电镀和导电糊料填充步骤的设置有镀覆内壁的电路层的通孔连接到填充有导电浆料的绝缘层的通孔。

公开(公告)号：US20060029726A1

公开(公告)日：2006-02-09

申请号：US10948875

申请日：2004-09-24

申请人： Jee-Soo Mok ,  Byung-Kook Sun ,  Chang-Kyu Song ,  Jun-Heyoung Park ,  Duck-Young Maeng ,  Tae-Hoon Kim

发明人： Jee-Soo Mok ,  Byung-Kook Sun ,  Chang-Kyu Song ,  Jun-Heyoung Park ,  Duck-Young Maeng ,  Tae-Hoon Kim

IPC分类号： H01K3/10

CPC分类号： H05K3/462 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0191 ,  Y10T29/49165

摘要： Disclosed is a method of fabricating a multilayer PCB (MLB). More particularly, the present invention relates to a method of fabricating a multilayer PCB, in which plural circuit layers having insulating layers attached thereto and another circuit layer having no insulating layer are formed in a parallel manner according to separate processes, and laminated at one time, unlike fabrication of the multilayer PCB adopting a conventional build-up manner.

摘要翻译： 公开了一种制造多层PCB（MLB）的方法。 更具体地，本发明涉及一种制造多层PCB的方法，其中根据单独的工艺以平行方式形成具有附着绝缘层的多个电路层和不具有绝缘层的另一个电路层，并且一次叠层 不同于采用常规积聚方式的多层PCB的制造。

公开(公告)号：US20050085065A1

公开(公告)日：2005-04-21

申请号：US10717977

申请日：2003-11-20

申请人： Jee-Soo Mok ,  Byung-Kook Sun ,  Chang-Kyu Song ,  Geum-Hee Yun ,  Tae-Hoon Kim

发明人： Jee-Soo Mok ,  Byung-Kook Sun ,  Chang-Kyu Song ,  Geum-Hee Yun ,  Tae-Hoon Kim

IPC分类号： H05K3/40 ,  H05K3/46 ,  H01L21/4763 ,  H01K3/10 ,  H05K3/02 ,  H05K3/20

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K3/4638 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2203/0191 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.

摘要翻译： 公开了一种多层印刷电路板和制造多层印刷电路板的方法。 交替堆叠电路层和绝缘层，使得没有施加附加电镀和导电糊料填充步骤的设置有镀覆内壁的电路层的通孔连接到填充有导电浆料的绝缘层的通孔。