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公开(公告)号：US07959264B2
公开(公告)日：2011-06-14
申请号：US12260326
申请日：2008-10-29
申请人： Dustin W. Blair , Jeff Pollard , Matthew D. Giere , Satya Prakash
发明人： Dustin W. Blair , Jeff Pollard , Matthew D. Giere , Satya Prakash
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/1408 , B41J2/14145 , B41J2/1629 , B41J2/1631 , B41J2/1634
摘要： Embodiments include forming internal or external extended surface elements on a print-head substrate, at least in part, using a light beam.
摘要翻译： 实施例包括至少部分地使用光束在打印头基板上形成内部或外部延伸的表面元件。
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公开(公告)号：US20090051741A1
公开(公告)日：2009-02-26
申请号：US12260326
申请日：2008-10-29
申请人： Dustin W. Blair , Jeff Pollard , Matthew D. Giere , Satya Prakash
发明人： Dustin W. Blair , Jeff Pollard , Matthew D. Giere , Satya Prakash
IPC分类号： B41J2/175
CPC分类号： B41J2/1603 , B41J2/1408 , B41J2/14145 , B41J2/1629 , B41J2/1631 , B41J2/1634
摘要： Embodiments include forming internal or external extended surface elements on a print-head substrate, at least in part, using a light beam.
摘要翻译： 实施例包括至少部分地使用光束在打印头基板上形成内部或外部延伸的表面元件。
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公开(公告)号：US06290331B1
公开(公告)日：2001-09-18
申请号：US09618992
申请日：2000-07-18
申请人： Arun K. Agarwal , Jennifer Korngiebel , Kit Christopher Baughman , Matthew D. Giere , Ronald A. Askeland , Noah C. Lassar , Satya Prakash , Neal W. Meyer , Harold Lee Van Nice , Salim Khasawinah
发明人： Arun K. Agarwal , Jennifer Korngiebel , Kit Christopher Baughman , Matthew D. Giere , Ronald A. Askeland , Noah C. Lassar , Satya Prakash , Neal W. Meyer , Harold Lee Van Nice , Salim Khasawinah
IPC分类号： B41S214
CPC分类号： B41J2/14016 , B41J2/1433 , B41J2002/14475
摘要： A novel polymeric orifice plate for a printhead. The plate includes a recess in the top surface thereof which terminates at a position between the top and bottom plate surfaces. The recess communicates with a bore which passes through the remainder of the plate and terminates at the bottom surface. The recess has an upper end with a first opening therein, a lower end with a second opening therein, a side wall, and a bottom wall at the lower end The first opening is larger than the second opening. Application of physical force to the plate does not disturb the second opening in the recess which is “inset”. The recessed bottom wall (and possibly the top surface) of the plate may include at least one layer of coating material thereon for protective, wettability-control, and other purposes. These designs insure proper ink drop trajectory and high-quality image generation.
摘要翻译： 一种用于打印头的新型聚合物孔板。 该板包括在其顶表面中的凹陷，其终止于顶板和底板表面之间的位置。 凹槽与穿过板的其余部分的孔连通，并终止于底表面。 所述凹部具有其上具有第一开口的上端，其中具有第二开口的下端，侧壁和所述下端处的底壁。所述第一开口大于所述第二开口。 物理力对板的施加不会妨碍“插入”的凹槽中的第二开口。 板的凹入的底壁（以及可能的顶表面）可以包括至少一层涂层材料，用于保护，润湿性控制和其它目的。 这些设计确保了适当的墨滴轨迹和高质量的图像生成。
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公开(公告)号：US20080081203A1
公开(公告)日：2008-04-03
申请号：US11538257
申请日：2006-10-03
CPC分类号： B41M5/5218 , B41M5/506 , B41M5/508 , B41M5/52 , B41M5/5272 , B41M5/5281 , B41M2205/38 , Y10T428/23 , Y10T428/24802 , Y10T428/2481 , Y10T428/28 , Y10T428/31786 , Y10T428/31935 , Y10T442/20
摘要： The present invention is directed to a medium (“substrate”) usable with inkjet printing apparatus (either or both piezoelectric and thermal inkjet, or other forms of inkjet printing), and methods for forming and using the same. In one embodiment, the substrate comprises a base material component and an image enhancing layer including a metallic salt disposed either or both on at least one side of the base medium and mixed within the base medium thereon. The present invention is further directed to printable articles including the same.
摘要翻译： 本发明涉及可用于喷墨打印设备（压电和热喷墨或其他形式的喷墨打印中的任一种或两种）的介质（“基板”），以及用于形成和使用它的方法。 在一个实施方案中，所述基材包括基材组分和图像增强层，所述图像增强层包含在所述基础介质的至少一侧上任一或两者设置的金属盐，并在其中的基础介质中混合。 本发明进一步涉及包括其的可印刷制品。
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公开(公告)号：US06543879B1
公开(公告)日：2003-04-08
申请号：US09999354
申请日：2001-10-31
申请人： James A. Feinn , Winthrop D. Childers , Clayton L. Holstun , Lawrence H. White , Matthew D. Giere , Colin C. Davis
发明人： James A. Feinn , Winthrop D. Childers , Clayton L. Holstun , Lawrence H. White , Matthew D. Giere , Colin C. Davis
IPC分类号： B41J215
CPC分类号： B41J2/1628 , B41J2/04543 , B41J2/0458 , B41J2/1404 , B41J2/145 , B41J2/1601 , B41J2/1629 , B41J2002/14387
摘要： An inkjet printhead assembly includes a substrate having an ink feed slot formed therein including a first side and second side along a vertical length of the ink feed slot. A first column of drop generators is formed along the first side of the ink feed slot. A second column of drop generators is formed along the second side of the ink feed slot. Each drop generator includes a nozzle. A nozzle packing density for nozzles in the first and second columns of drop generators including the area of the ink feed slot is at least approximately 100 nozzles per square millimeter (mm2).
摘要翻译： 喷墨打印头组件包括具有形成在其中的供墨槽的基板，其包括沿着供墨槽的垂直长度的第一侧和第二侧。 沿着供墨槽的第一侧形成第一列液滴发生器。 沿着供墨槽的第二侧形成第二列液滴发生器。 每个液滴发生器包括喷嘴。 包括供墨槽区域的第一和第二列液滴发生器中的喷嘴的喷嘴密封密度至少约为每平方毫米100个喷嘴（mm2）。
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公开(公告)号：US08425993B2
公开(公告)日：2013-04-23
申请号：US11538257
申请日：2006-10-03
CPC分类号： B41M5/5218 , B41M5/506 , B41M5/508 , B41M5/52 , B41M5/5272 , B41M5/5281 , B41M2205/38 , Y10T428/23 , Y10T428/24802 , Y10T428/2481 , Y10T428/28 , Y10T428/31786 , Y10T428/31935 , Y10T442/20
摘要： The present invention is directed to a medium (“substrate”) usable with inkjet printing apparatus (either or both piezoelectric and thermal inkjet, or other forms of inkjet printing), and methods for forming and using the same. In one embodiment, the substrate comprises a base material component and an image enhancing layer including a metallic salt disposed either or both on at least one side of the base medium and mixed within the base medium thereon. The present invention is further directed to printable articles including the same.
摘要翻译： 本发明涉及可用于喷墨打印设备（压电和热喷墨或其他形式的喷墨打印中的任一种或两种）的介质（“基板”），以及用于形成和使用它的方法。 在一个实施方案中，所述基材包括基材组分和图像增强层，所述图像增强层包含在所述基础介质的至少一侧上任一或两者设置的金属盐，并在其中的基础介质中混合。 本发明进一步涉及包括其的可印刷制品。
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公开(公告)号：US20120211878A1
公开(公告)日：2012-08-23
申请号：US13029825
申请日：2011-02-17
申请人： Darko R. Popovic , Matthew D. Giere , Bruce M. Guenin , Theresa Y. Sze , Ivan Shubin , John A. Harada , David C. Douglas , Jing Shi
发明人： Darko R. Popovic , Matthew D. Giere , Bruce M. Guenin , Theresa Y. Sze , Ivan Shubin , John A. Harada , David C. Douglas , Jing Shi
CPC分类号： H01L24/05 , H01L23/5385 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/0554 , H01L2224/05554 , H01L2224/1134 , H01L2224/13005 , H01L2224/13011 , H01L2224/1302 , H01L2224/13027 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/1329 , H01L2224/13311 , H01L2224/13339 , H01L2224/13347 , H01L2224/1403 , H01L2224/14051 , H01L2224/14151 , H01L2224/14155 , H01L2224/14515 , H01L2224/16105 , H01L2224/16157 , H01L2224/17181 , H01L2224/20 , H01L2224/2919 , H01L2224/32145 , H01L2224/33181 , H01L2224/4813 , H01L2224/48159 , H01L2224/484 , H01L2224/4846 , H01L2224/48463 , H01L2224/48477 , H01L2224/50 , H01L2224/73103 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/75704 , H01L2224/81139 , H01L2224/81947 , H01L2225/06589 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/00012
摘要： In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.
摘要翻译： 在芯片封装中，半导体管芯或芯片（被称为“板堆叠”）的垂直堆叠中的半导体管芯由机械间隔件（例如填充材料或粘合剂）分开。 此外，芯片封装包括与板堆叠成直角的衬底，其与板堆叠的边缘电耦合到半导体管芯。 特别地，靠近基板表面（沿着板堆叠的堆叠方向）的电焊盘通过中间导电材料电耦合到靠近半导体管芯边缘的焊盘，例如：焊料，螺柱 凸块，电镀痕迹，线接合，弹簧连接器，导电粘合剂和/或各向异性导电膜。 注意，芯片封装可以促进半导体管芯和衬底之间的信号的高带宽通信。
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公开(公告)号：US07524035B2
公开(公告)日：2009-04-28
申请号：US10977065
申请日：2004-10-29
申请人： Paul J. Bruinsma , Matthew D. Giere
发明人： Paul J. Bruinsma , Matthew D. Giere
IPC分类号： B41J2/15
CPC分类号： B41J2/1433 , B41J2/1606 , B41J2002/14475
摘要： A fluid ejection device includes an orifice structure with an orifice. A fluid reservoir is on the exterior surface of the orifice structure. A barrier portion is between the fluid reservoir and the orifice.
摘要翻译： 流体喷射装置包括具有孔口的孔结构。 流体储存器位于孔结构的外表面上。 阻挡部分在流体储存器和孔口之间。
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公开(公告)号：US06629751B2
公开(公告)日：2003-10-07
申请号：US09894584
申请日：2001-06-28
IPC分类号： B41J2145
CPC分类号： B41J2/04505 , B41J2/04528 , B41J2/0458 , B41J19/202 , G06K15/102 , G06K2215/0085
摘要： An image reproduction system with requisite technology to reduce or eliminate altogether banding effects is provided. The system includes an input tray for storing print media, an output area for holding printed media and an inkjet pen or printhead for printing information on the print media. In a preferred embodiment, the reproduction system is inkjet printer whose pen scans and ejects ink on the print media with a non-uniform dot pitch. This non-uniformity is achieved by adding visual noise in a known and predictable fashion to the uniform dot pitch.
摘要翻译： 提供了一种具有必要技术以减少或消除总体条带效应的图像再现系统。 该系统包括用于存储打印介质的输入托盘，用于保持打印介质的输出区域和用于在打印介质上打印信息的喷墨笔或打印头。 在优选实施例中，再现系统是喷墨打印机，其笔以非均匀点间距扫描并喷射在打印介质上的墨。 这种不均匀性是通过以已知和可预测的方式将视觉噪声添加到均匀点间距来实现的。
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公开(公告)号：US08390109B2
公开(公告)日：2013-03-05
申请号：US13029825
申请日：2011-02-17
申请人： Darko R. Popovic , Matthew D. Giere , Bruce M. Guenin , Theresa Y. Sze , Ivan Shubin , John A. Harada , David C. Douglas , Jing Shi
发明人： Darko R. Popovic , Matthew D. Giere , Bruce M. Guenin , Theresa Y. Sze , Ivan Shubin , John A. Harada , David C. Douglas , Jing Shi
CPC分类号： H01L24/05 , H01L23/5385 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/0554 , H01L2224/05554 , H01L2224/1134 , H01L2224/13005 , H01L2224/13011 , H01L2224/1302 , H01L2224/13027 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/1329 , H01L2224/13311 , H01L2224/13339 , H01L2224/13347 , H01L2224/1403 , H01L2224/14051 , H01L2224/14151 , H01L2224/14155 , H01L2224/14515 , H01L2224/16105 , H01L2224/16157 , H01L2224/17181 , H01L2224/20 , H01L2224/2919 , H01L2224/32145 , H01L2224/33181 , H01L2224/4813 , H01L2224/48159 , H01L2224/484 , H01L2224/4846 , H01L2224/48463 , H01L2224/48477 , H01L2224/50 , H01L2224/73103 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/75704 , H01L2224/81139 , H01L2224/81947 , H01L2225/06589 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/00012
摘要： In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.
摘要翻译： 在芯片封装中，半导体管芯或芯片（被称为板堆叠）的垂直堆叠中的半导体管芯由机械间隔件（例如填充材料或粘合剂）分开。 此外，芯片封装包括与板堆叠成直角的衬底，其与板堆叠的边缘电耦合到半导体管芯。 特别地，靠近基板表面（沿着板堆叠的堆叠方向）的电焊盘通过中间导电材料电耦合到靠近半导体管芯边缘的焊盘，例如：焊料，螺柱 凸块，电镀痕迹，线接合，弹簧连接器，导电粘合剂和/或各向异性导电膜。 注意，芯片封装可以促进半导体管芯和衬底之间的信号的高带宽通信。
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