公开(公告)号：US08634500B2

公开(公告)日：2014-01-21

申请号：US13431009

申请日：2012-03-27

申请人： Zuxu Qin ,  Rajesh Kumar ,  Dawei Huang ,  Jing Shi ,  Deqiang Song

发明人： Zuxu Qin ,  Rajesh Kumar ,  Dawei Huang ,  Jing Shi ,  Deqiang Song

IPC分类号： H03K9/00

CPC分类号： H04L25/062 ,  H04L2025/0349

摘要： A receiver circuit includes a first slicer coupled to receive data signals from a signal path and a reference voltage from a reference voltage path that is separate from the signal path. The first slicer is configured output a logic value based on a comparison between a voltage of the data signal and the reference voltage. The receiver circuit further includes a reference voltage generator configured to generate the reference voltage. The reference voltage generator is configured to dynamically generate the reference voltage based on logic values of previously received signals during operation in a first mode. During operation in a second mode, the reference voltage generator is configured to generate and provide the reference voltage as a static voltage.

摘要翻译： 接收器电路包括耦合以从信号路径接收数据信号的第一限幅器和与信号路径分离的参考电压路径的参考电压。 第一限幅器被配置为基于数据信号的电压与参考电压之间的比较来输出逻辑值。 接收器电路还包括被配置为产生参考电压的参考电压发生器。 参考电压发生器被配置为基于在第一模式中的操作期间先前接收到的信号的逻辑值来动态地产生参考电压。 在第二模式的操作期间，参考电压发生器被配置为产生并提供参考电压作为静态电压。

公开(公告)号：US20130259162A1

公开(公告)日：2013-10-03

申请号：US13431009

申请日：2012-03-27

申请人： Zuxu Qin ,  Rajesh Kumar ,  Dawei Huang ,  Jing Shi ,  Deqiang Song

发明人： Zuxu Qin ,  Rajesh Kumar ,  Dawei Huang ,  Jing Shi ,  Deqiang Song

IPC分类号： H04L25/10 ,  H04B1/16

CPC分类号： H04L25/062 ,  H04L2025/0349

摘要： A receiver circuit includes a first slicer coupled to receive data signals from a signal path and a reference voltage from a reference voltage path that is separate from the signal path. The first slicer is configured output a logic value based on a comparison between a voltage of the data signal and the reference voltage. The receiver circuit further includes a reference voltage generator configured to generate the reference voltage. The reference voltage generator is configured to dynamically generate the reference voltage based on logic values of previously received signals during operation in a first mode. During operation in a second mode, the reference voltage generator is configured to generate and provide the reference voltage as a static voltage.

摘要翻译： 接收器电路包括耦合以从信号路径接收数据信号的第一限幅器和与信号路径分离的参考电压路径的参考电压。 第一限幅器被配置为基于数据信号的电压与参考电压之间的比较来输出逻辑值。 接收器电路还包括被配置为产生参考电压的参考电压发生器。 参考电压发生器被配置为基于在第一模式中的操作期间先前接收到的信号的逻辑值来动态地产生参考电压。 在第二模式的操作期间，参考电压发生器被配置为产生并提供参考电压作为静态电压。

公开(公告)号：US20130114459A1

公开(公告)日：2013-05-09

申请号：US13810487

申请日：2011-07-15

申请人： Qinglin Luo ,  Jing Shi ,  Yan Zhao

发明人： Qinglin Luo ,  Jing Shi ,  Yan Zhao

IPC分类号： H04W24/00

CPC分类号： H04W24/00 ,  H04B7/024 ,  H04B17/12 ,  H04W24/08

摘要： The present invention provides a method and device for calibrating antenna reciprocity via OTA in a base station of wireless network, and the method comprises: determining, based on a predefined rule, a plurality of calibrating UEs out of a plurality of UEs, and antennas, to be calibrated by the plurality of calibrating UEs, of the plurality of base stations, wherein the plurality of calibrating UEs are configured to calibrate antennas of the plurality of base stations; and calibrating, according to the determined calibration relationship, the antennas reciprocity of the plurality of base stations based on the plurality of calibrating UEs. With the method of present invention, communication channel model can be calibrated effectively so as to enhance antenna reciprocity in CoMP scenario.

摘要翻译： 本发明提供了一种用于在无线网络的基站中经由OTA来校准天线互易性的方法和装置，并且所述方法包括：基于预定规则，确定多个UE中的多个校准UE以及天线， 由所述多个基站中的多个校准UE校准，其中所述多个校准UE被配置为校准所述多个基站中的天线; 以及根据所确定的校准关系，基于所述多个校准UE来校准所述多个基站的天线互易性。 利用本发明的方法，可以有效地校准通信信道模型，以便增强CoMP场景中的天线互易性。

公开(公告)号：US20130113020A1

公开(公告)日：2013-05-09

申请号：US13613236

申请日：2012-09-13

申请人： Donghua Liu ,  Wenting Duan ,  Wensheng Qian ,  Jun Hu ,  Jing Shi

发明人： Donghua Liu ,  Wenting Duan ,  Wensheng Qian ,  Jun Hu ,  Jing Shi

IPC分类号： H01L29/737 ,  H01L21/331

CPC分类号： H01L29/66242 ,  H01L29/0821 ,  H01L29/7371

摘要： A SiGe HBT is disclosed, which includes: a silicon substrate; shallow trench field oxides formed in the silicon substrate; a pseudo buried layer formed at bottom of each shallow trench field oxide; a collector region formed beneath the surface of the silicon substrate, the collector region being sandwiched between the shallow trench field oxides and between the pseudo buried layers; a polysilicon gate formed above each shallow trench field oxide having a thickness of greater than 150 nm; a base region on the polysilicon gates and the collector region; emitter region isolation oxides on the base region; and an emitter region on the emitter region isolation oxides and a part of the base region. The polysilicon gate is formed by gate polysilicon process of a MOSFET in a CMOS process. A method of manufacturing the SiGe HBT is also disclosed.

摘要翻译： 公开了一种SiGe HBT，其包括：硅衬底; 形成在硅衬底中的浅沟槽场氧化物; 形成在每个浅沟槽场氧化物的底部的伪掩埋层; 形成在所述硅衬底的表面下方的集电极区域，所述集电极区域夹在所述浅沟槽场氧化物之间和所述伪埋层之间; 形成在每个浅沟槽场氧化物上方的多晶硅栅极，其厚度大于150nm; 多晶硅栅极和集电极区域上的基极区域; 发射极区隔离氧化物; 并且发射极区域上的发射极区域隔离氧化物和基极区域的一部分。 多晶硅栅极通过CMOS工艺中的MOSFET的栅极多晶硅工艺形成。 还公开了制造SiGe HBT的方法。

公开(公告)号：US20130054140A1

公开(公告)日：2013-02-28

申请号：US13243028

申请日：2011-09-23

申请人： Jing-Shi Meng

发明人： Jing-Shi Meng

IPC分类号： G01C21/26

CPC分类号： G01C21/3673 ,  G01C21/26 ,  G01C21/32 ,  G09B29/106

摘要： A navigation apparatus for dynamically displaying multiple frames of house number and its method. The navigation apparatus comprises a road information temporary storage module, a frame information temporary storage module, a processing module and a display unit. The real-time road information is temporarily stored at the road information temporary storage module; a house number information, a point of interesting or user customized information is temporarily stored at the frame information temporary storage module. Furthermore, the processing module updates the real-time road information and the house number information, the point of interesting or the user customized information corresponding to real-time road information according to a global positioning system signal. The display unit displays real-time road information and plays house number information, the point of interesting or user customized information by turns.

摘要翻译： 一种用于动态显示房屋号码多帧的导航装置及其方法。 导航装置包括道路信息临时存储模块，帧信息临时存储模块，处理模块和显示单元。 实时道路信息被临时存储在道路信息临时存储模块中; 一个房屋号码信息，一个有趣的或用户定制的信息点临时存储在帧信息临时存储模块。 此外，处理模块根据全球定位系统信号更新实时道路信息和房屋号码信息，与实时道路信息对应的有趣点或用户定制信息。 显示单元轮流显示实时道路信息并播放房屋号码信息，有趣的或用户定制的信息点。

公开(公告)号：US20130034862A1

公开(公告)日：2013-02-07

申请号：US13596579

申请日：2012-08-28

申请人： Wendy J. Fantl ,  David B. Rosen ,  Alessandra Cesano ,  Santosh K. Putta ,  James R. Hackett ,  Michael Walker ,  Jing Shi

发明人： Wendy J. Fantl ,  David B. Rosen ,  Alessandra Cesano ,  Santosh K. Putta ,  James R. Hackett ,  Michael Walker ,  Jing Shi

IPC分类号： G01N21/64 ,  G01N21/76

CPC分类号： G01N33/57426 ,  A61K31/4709 ,  A61K31/513 ,  A61K31/704 ,  A61K31/7068 ,  A61K31/7076 ,  G01N33/50 ,  G01N33/5041 ,  G01N33/5044 ,  G01N33/5047 ,  G01N33/5055 ,  G01N33/5073 ,  G01N33/5094 ,  G01N33/53 ,  G01N33/574 ,  G01N33/57407 ,  G01N33/6893 ,  G01N2333/705 ,  G01N2800/22 ,  G01N2800/52

摘要： The present invention provides an approach for the determination of the activation states of a plurality of proteins in single cells. This approach permits the rapid detection of heterogeneity in a complex cell population based on activation states, expression markers and other criteria, and the identification of cellular subsets that exhibit correlated changes in activation within the cell population. Moreover, this approach allows the correlation of cellular activities or properties. In addition, the use of modulators of cellular activation allows for characterization of pathways and cell populations. Several exemplary diseases that can be analyzed using the invention include AML, MDS, and MPN.

摘要翻译： 本发明提供了用于确定单细胞中多种蛋白质的活化状态的方法。 这种方法允许基于活化状态，表达标志物和其他标准快速检测复杂细胞群体中的异质性，以及在细胞群体内表现出相关的激活变化的细胞亚群的鉴定。 此外，这种方法允许细胞活动或性质的相关性。 此外，使用细胞激活的调节剂允许表征途径和细胞群体。 可以使用本发明分析的几种示例性疾病包括AML，MDS和MPN。

公开(公告)号：US20120211878A1

公开(公告)日：2012-08-23

申请号：US13029825

申请日：2011-02-17

申请人： Darko R. Popovic ,  Matthew D. Giere ,  Bruce M. Guenin ,  Theresa Y. Sze ,  Ivan Shubin ,  John A. Harada ,  David C. Douglas ,  Jing Shi

发明人： Darko R. Popovic ,  Matthew D. Giere ,  Bruce M. Guenin ,  Theresa Y. Sze ,  Ivan Shubin ,  John A. Harada ,  David C. Douglas ,  Jing Shi

IPC分类号： H01L25/07 ,  H01L21/60

CPC分类号： H01L24/05 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13011 ,  H01L2224/1302 ,  H01L2224/13027 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/13311 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14151 ,  H01L2224/14155 ,  H01L2224/14515 ,  H01L2224/16105 ,  H01L2224/16157 ,  H01L2224/17181 ,  H01L2224/20 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/33181 ,  H01L2224/4813 ,  H01L2224/48159 ,  H01L2224/484 ,  H01L2224/4846 ,  H01L2224/48463 ,  H01L2224/48477 ,  H01L2224/50 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75704 ,  H01L2224/81139 ,  H01L2224/81947 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/00012

摘要： In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a ‘plank stack’) are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.

摘要翻译： 在芯片封装中，半导体管芯或芯片（被称为“板堆叠”）的垂直堆叠中的半导体管芯由机械间隔件（例如填充材料或粘合剂）分开。 此外，芯片封装包括与板堆叠成直角的衬底，其与板堆叠的边缘电耦合到半导体管芯。 特别地，靠近基板表面（沿着板堆叠的堆叠方向）的电焊盘通过中间导电材料电耦合到靠近半导体管芯边缘的焊盘，例如：焊料，螺柱 凸块，电镀痕迹，线接合，弹簧连接器，导电粘合剂和/或各向异性导电膜。 注意，芯片封装可以促进半导体管芯和衬底之间的信号的高带宽通信。

公开(公告)号：US08188581B2

公开(公告)日：2012-05-29

申请号：US12568024

申请日：2009-09-28

申请人： Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

发明人： Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  John E. Cunningham

IPC分类号： H01L23/495

CPC分类号： H01L23/13 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.

公开(公告)号：US20120099469A1

公开(公告)日：2012-04-26

申请号：US13380265

申请日：2009-06-23

申请人： Qinglin Luo ,  Jing Shi

发明人： Qinglin Luo ,  Jing Shi

IPC分类号： H04J3/00 ,  H04W24/00

CPC分类号： H04B7/0434 ,  H04L25/0242 ,  H04W24/00

摘要： The present invention relates to methods of transmitting a signal in a time division duplexing MIMO system and associated apparatuses. According to a first aspect of the present invention, there is provided a method of transmitting a signal in an eNodeB of a time division duplexing multiple input multiple output system. The method includes: A. receiving a signal from a user equipment in a space division multiplexing group and estimating uplink channel characteristics according to the received signal; B. determining reciprocity calibration information between the uplink channel characteristics and downlink channel characteristics; C. determining a downlink precoding matrix using zero forcing according to the uplink channel characteristics and the calibration information and transmitting a downlink signal to the user equipment in the space division multiplexing group according to the determined downlink precoding matrix. And the step B further comprises receiving information associated with a downlink vector channel matrix fed back from the user equipment in the space division multiplexing group and selectively updating the calibration information according to the information associated with the downlink vector channel matrix.

摘要翻译： 本发明涉及在时分双工MIMO系统和相关设备中发送信号的方法。 根据本发明的第一方面，提供了一种在时分双工多输入多输出系统的eNodeB中发送信号的方法。 该方法包括：A.接收来自空分复用组中的用户设备的信号，并根据接收到的信号估计上行链路信道特性; B.确定上行链路信道特性与下行链路信道特性之间的互易校准信息; C.根据上行链路信道特性和校准信息，使用零强制来确定下行链路预编码矩阵，并根据确定的下行链路预编码矩阵向空间复用组中的用户设备发送下行链路信号。 并且步骤B还包括接收与在空分多路复用组中从用户设备反馈的下行链路向量信道矩阵相关联的信息，并且根据与下行链路向量信道矩阵相关联的信息选择性地更新校准信息。

公开(公告)号：US20110278718A1

公开(公告)日：2011-11-17

申请号：US12781732

申请日：2010-05-17

申请人： Hiren D. Thacker ,  Jing Shi ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

发明人： Hiren D. Thacker ,  Jing Shi ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/13 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05571 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1319 ,  H01L2224/13541 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13578 ,  H01L2224/13611 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17517 ,  H01L2224/81141 ,  H01L2224/81211 ,  H01L2224/81815 ,  H01L2225/06531 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/206 ,  H01L2924/01028 ,  H01L2224/05552 ,  H01L2924/00

摘要： A multi-chip module (MCM) that includes at least two substrates, having facing surfaces, which are mechanically coupled by a set of coupling elements having a reflow characteristic, is described. One of the two substrates includes another set of coupling elements having another reflow characteristic, which is different than the reflow characteristic. These different reflow characteristics of the sets of coupling elements allow different temperature profiles to be used when bonding the two substrates to each other than when bonding the one of the two substrates to a carrier. For example, the temperature profiles may have different peak temperatures and/or different durations from one another. These reflow characteristics may facilitate low-cost, high-yield assembly and alignment of the substrates in the MCM, and may allow temperature-sensitive components to be included in the MCM.

摘要翻译： 描述了包括具有面对表面的至少两个基板的多芯片模块（MCM），其通过一组具有回流特性的耦合元件机械耦合。 两个基板中的一个包括另一组具有不同于回流特性的另外的回流特性的耦合元件。 耦合元件组的这些不同的回流特性允许在将两个基板彼此接合时使用不同的温度曲线，而不是将两个基板中的一个接合到载体上。 例如，温度分布可以具有不同的峰值温度和/或彼此不同的持续时间。 这些回流特性可以促进MCM中的基板的低成本，高产量组装和对准，并且可以允许将温度敏感组件包括在MCM中。