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    Optical module
    2.
    发明授权
    Optical module 有权
    光模块

    公开(公告)号：US09411097B2

    公开(公告)日：2016-08-09

    申请号：US14727751

    申请日：2015-06-01

    申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

    发明人： Young Tak Han ,  Sang Ho Park ,  Yong Soon Baek ,  Jang Uk Shin

    IPC分类号： G02B6/12 ,  G02B6/36

    CPC分类号： G02B6/12019 ,  G02B6/4251 ,  G02B6/4279

    摘要： Provided herein is an optical module including an optical bench having a first step with a first depth and a second step with a second depth that is smaller than the first depth; a silicon carrier disposed above the first step, and where at least one semiconductor chip is installed; an AWG chip (Arrayed Waveguide Grating chip) secured to the second step, extends up to the first step, and is chip-to-chip bonded with the silicon carrier above the first step; a lens disposed on an upper surface of the optical bench where the first step and the second step are not formed; and a metal package surrounding the optical bench, silicon carrier, AWG chip and lens, wherein at one side of the metal package, a double slit that includes an upper slit and a lower slit are formed, a DC FPCB (Direct Current FPCB) extends from outside towards inside the metal package through the upper slit and is secured to a support formed on an inner surface of the upper slit, and an RF FPCB (Radio Frequency FPCB) extends from outside towards inside the metal package through the lower slit and is secured to an upper portion of the silicon carrier, and the upper slit and the lower slit of the double slit being sealed by an elastic epoxy.

    摘要翻译： 本文提供了一种光学模块，其包括具有第一深度的第一步骤和具有小于第一深度的第二深度的第二步骤的光学台架; 设置在所述第一台阶上方的硅载体，并且其中安装有至少一个半导体芯片; 固定到第二步的AWG芯片（阵列波导光栅芯片）延伸到第一步，并且在第一步骤之上与硅载体进行芯片到芯片的接合; 透镜，设置在光学台的上表面，其中没有形成第一步骤和第二步骤; 以及围绕光学台，硅载体，AWG芯片和透镜的金属封装，其中在金属封装的一侧形成包括上缝和下缝的双缝，DC FPCB（直流FPCB）延伸 从金属包装的外部通过上部狭缝固定到形成在上部狭缝的内表面上的支撑件上，并且RF FPCB（射频FPCB）通过下部狭缝从外部向金属包装内部延伸，并且是 固定到硅载体的上部，双缝的上缝和下狭缝由弹性环氧树脂密封。