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公开(公告)号：US11453771B2
公开(公告)日：2022-09-27
申请号：US17203318
申请日：2021-03-16
发明人： Chen-Yu Hsieh
IPC分类号： C08L27/18
摘要： A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.
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公开(公告)号：US08808862B2
公开(公告)日：2014-08-19
申请号：US13730012
申请日：2012-12-28
发明人： Chen-Yu Hsieh , Yi-Fei Yu
IPC分类号： B32B27/38 , C09D163/00 , C09D151/00 , C08L63/00 , C08L51/00 , C08K5/08 , C08K5/315 , B32B15/092
CPC分类号： C09D163/00 , C08L63/00 , Y10S428/901 , Y10T428/31511 , C08L25/10 , C08L79/04
摘要： A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.
摘要翻译： 树脂组合物包含（A）100重量份的环氧树脂; （B）20〜100重量份聚丁二烯苯乙烯二乙烯基苯接枝三元共聚树脂; （C）2〜20重量份二叔丁基氢醌（DTBHQ）; （D）5〜50重量份聚苯醚改性氰酸酯树脂; 和（E）无机填料，（F）链延伸密封剂和（G）催化剂中的至少一种。 该树脂组合物的特征在于具有高耐热性，低介电常数Dk和低介电损耗因数Df的特殊成分和比例，并且是无卤素的，因此可应用于印刷电路板的保护膜，绝缘保护膜 的电子部件和引线框的树脂绝缘膜。
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3.发明授权公开(公告)号：US09926435B2
公开(公告)日：2018-03-27
申请号：US15067144
申请日：2016-03-10
发明人： Chen-Yu Hsieh
CPC分类号： C08K5/53 , C08J5/18 , C08J5/24 , C08J2371/00 , C08J2371/12 , H05K1/0326 , H05K1/0353 , H05K1/0373 , H05K1/09 , H05K2201/012 , H05K2203/122 , C08L71/02
摘要： A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.
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4.发明申请公开(公告)号：US20170260364A1
公开(公告)日：2017-09-14
申请号：US15067144
申请日：2016-03-10
发明人： Chen-Yu Hsieh
CPC分类号： C08K5/53 , C08J5/18 , C08J5/24 , C08J2371/00 , C08J2371/12 , H05K1/0326 , H05K1/0353 , H05K1/0373 , H05K1/09 , H05K2201/012 , H05K2203/122 , C08L71/02
摘要： A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.
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5.发明授权Low dielectric halogen-free resin composition and circuit board using the same 有权低介电无卤树脂组合物和使用其的电路板公开(公告)号：US09428646B2
公开(公告)日：2016-08-30
申请号：US13948399
申请日：2013-07-23
发明人： Chen-Yu Hsieh
CPC分类号： C08L71/02 , C08K5/5399 , C08L21/00 , C08L71/12 , C08L79/08 , H05K1/0353 , H05K2201/012 , H05K2201/0209 , Y10T428/24917 , Y10T428/31681
摘要： A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.
摘要翻译： 无卤素树脂组合物包含（A）100重量份聚苯醚树脂; （B）10〜50重量份马来酰亚胺树脂; （C）5〜100重量份的聚丁二烯共聚物; （D）5〜30重量份的氰酸酯树脂; 和（E）15〜150重量份的磷腈。 无卤素树脂组合物的特征在于其特定成分和比例，以实现电路板层压性能，例如高玻璃化转变温度，低热膨胀系数，低介电性能，耐热性，阻燃性和无卤素 ，因此可以应用于预浸料或树脂膜的制造，从而适用于金属层叠体和印刷电路板的制造。
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公开(公告)号：US11618801B2
公开(公告)日：2023-04-04
申请号：US17117490
申请日：2020-12-10
发明人： Chen-Yu Hsieh
摘要： A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.
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公开(公告)号：US11591469B2
公开(公告)日：2023-02-28
申请号：US16923340
申请日：2020-07-08
发明人： Yi-Fei Yu , Chien-Hung Lee , Chen-Yu Hsieh
摘要： A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.
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8.发明授权Phosphazene compound having vinyl group, resin composition containing the same, and circuit board manufactured from the same 有权具有乙烯基的磷腈化合物，含有它们的树脂组合物和由其制成的电路板公开(公告)号：US09000077B2
公开(公告)日：2015-04-07
申请号：US13921447
申请日：2013-06-19
发明人： Chen-Yu Hsieh
CPC分类号： C08L79/00 , B32B5/022 , B32B5/024 , B32B15/14 , B32B15/20 , B32B27/28 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/204 , B32B2307/3065 , B32B2457/08 , C08G79/025 , C08K3/36 , C08L79/04 , C08L79/085 , C08L85/02
摘要： A phosphazene compound having a vinyl group is manufactured by a reaction between a vinyl compound and a phosphazene compound having a hydroxyl group and added to a resin composition for manufacturing a prepreg or a resin film so as to be applicable to copper-clad laminates and printed circuit boards to thereby achieve satisfactory circuit laminate properties, namely low coefficient of thermal expansion, low dielectric properties, heat resistant, fire resistant, and halogen-free.
摘要翻译： 具有乙烯基的磷腈化合物通过乙烯基化合物和具有羟基的磷腈化合物之间的反应制备，并加入到用于制备预浸料或树脂膜的树脂组合物中，以适用于覆铜层压板和印刷 从而实现满意的电路层叠性能，即低热膨胀系数，低介电性能，耐热性，耐火性和无卤素性。
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公开(公告)号：US11118055B2
公开(公告)日：2021-09-14
申请号：US16537116
申请日：2019-08-09
发明人： Chen-Yu Hsieh
摘要： A phosphorus-containing resin composition comprises a first phosphorus-containing compound, a second phosphorus-containing compound and a maleimide resin; wherein the first phosphorus-containing compound comprises a compound of Formula (I), a compound of Formula (II), or a combination thereof, and wherein the second phosphorus-containing compound is different from the first phosphorus-containing compound, and the second phosphorus-containing compound is absent of a group capable of reacting with the maleimide resin.
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公开(公告)号：US10604640B2
公开(公告)日：2020-03-31
申请号：US15803433
申请日：2017-11-03
发明人： Chen-Yu Hsieh
IPC分类号： C08K5/529 , C08L79/08 , C08L75/14 , C08K5/00 , C08K5/5313 , C08K5/3415
摘要： Disclosed is a resin composition which comprises a compound with at least two DOPO groups or a combination thereof as the flame retardant and an aliphatic long-chain maleimide compound. The resin composition is useful for the preparation of various articles, such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, achieving at least one, more or all properties improved of laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, dielectric constant, dissipation factor, interlayer bonding strength, storage modulus and so on.
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