公开(公告)号：US09394438B2

公开(公告)日：2016-07-19

申请号：US13759800

申请日：2013-02-05

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Li-Chih Yu ,  Tse-An Lee

IPC: B32B27/38 ,  C08L63/00

CPC classification number: C08L63/00 ,  Y10T428/31529 ,  C08L25/18 ,  C08L67/00 ,  C08L79/02 ,  C08L79/04

Abstract: A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.

Abstract translation: 树脂组合物包含（A）环氧树脂; （B）苯并恶嗪（BZ）树脂; （C）苯乙烯马来酸酐（SMA）共聚物; 和（D）聚酯。 树脂组合物包括聚酯的特定成分，其特征在于其特定比例，以便实现根据树脂组合物制造的覆铜层压板的低ΔTg值，并获得低介电常数，低介电损耗因子，高 根据树脂组合物制造的覆铜层压板和印刷电路板的耐热性，高阻燃性。

公开(公告)号：US09279051B2

公开(公告)日：2016-03-08

申请号：US13680568

申请日：2012-11-19

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Li-Chih Yu ,  Tse-An Lee

IPC: C08G73/06 ,  C08K3/00 ,  C08K3/26 ,  C08K3/36 ,  C08K5/09 ,  C08K5/5399 ,  H05K1/03 ,  H05K3/22 ,  B32B15/08 ,  C08L65/00 ,  C08L79/04 ,  C08L35/06 ,  H05K3/02

CPC classification number: C08L65/00 ,  B32B15/08 ,  C08G73/0655 ,  C08K3/013 ,  C08K3/26 ,  C08K3/36 ,  C08K5/09 ,  C08K5/5399 ,  C08L35/06 ,  C08L71/12 ,  C08L79/04 ,  H05K1/0353 ,  H05K3/022 ,  H05K2201/012 ,  Y10T428/31699 ,  C08K3/0033

Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract translation: 无卤树脂组合物包含（A）100重量份氰酸酯树脂; （B）5〜50重量份苯乙烯 - 马来酸酐; （C）5〜100重量份聚苯醚树脂; （D）10〜150重量份的磷腈; 和（E）10〜1000重量份的无机填料。 通过使用特定比例的特定成分，无卤树脂组合物具有低介电常数，低耗散因数，高耐热性和高阻燃性的特点，可制成预浸料或树脂膜，从而用于铜包覆 层压板或印刷电路板。

公开(公告)号：US10280260B2

公开(公告)日：2019-05-07

申请号：US15224773

申请日：2016-08-01

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu Hsieh ,  Tse-An Lee ,  Hui-Ting Shih

IPC: C08J5/24 ,  C08K3/36 ,  C08K5/14 ,  C08L73/00 ,  C09D179/00 ,  C08G65/48 ,  C08K5/3415 ,  C08K5/5399 ,  H05K1/03

Abstract: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R′ is R″ is R′″ is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.