公开(公告)号：US20170316962A1

公开(公告)日：2017-11-02

申请号：US15526363

申请日：2015-08-19

申请人： EV GROUP E. THALLNER GMBH

发明人： Andreas FEHKUHRER

IPC分类号： H01L21/67 ,  H01L21/687 ,  H01L21/683 ,  H01L21/762

CPC分类号： H01L21/67092 ,  H01L21/67109 ,  H01L21/67309 ,  H01L21/6838 ,  H01L21/68735 ,  H01L21/68771 ,  H01L21/76254

摘要： A substrate stack holder and a container comprising a multiplicity of such substrate stack holders as well as a method for parting a substrate stack.

公开(公告)号：US20160365241A1

公开(公告)日：2016-12-15

申请号：US15118914

申请日：2015-01-09

申请人： EV GROUP E. THALLNER GMBH

发明人： Andreas FEHKUHRER

IPC分类号： H01L21/02 ,  B08B5/00 ,  B08B3/08 ,  B08B3/12 ,  H01L21/768 ,  B08B7/00

CPC分类号： H01L21/02057 ,  B08B3/08 ,  B08B3/12 ,  B08B5/00 ,  B08B7/0014 ,  B08B7/0035 ,  H01L21/76898

摘要： A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.

摘要翻译： 一种用于在处理用于处理半导体衬底的至少一个表面的步骤的处理步骤之前，至少部分地穿过半导体衬底并提供用于永久涂覆和/或装备临时涂覆的涂层材料的空腔的方法。 此外，一种用于去除半导体衬底的空腔的临时涂层的方法，由此根据前述方法施加涂层，并且由此特别是紧接着之后进行空腔的永久性涂布和/或装备 。

公开(公告)号：US20160358881A1

公开(公告)日：2016-12-08

申请号：US14917318

申请日：2014-12-18

申请人： EV GROUP E. THALLNER GMBH

发明人： Andreas FEHKUHRER

IPC分类号： H01L23/00 ,  B32B37/00 ,  H01L21/683 ,  B32B38/18 ,  H01L23/544 ,  H01L25/00

CPC分类号： H01L24/80 ,  B32B37/0046 ,  B32B38/1841 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/187 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6831 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L24/08 ,  H01L24/74 ,  H01L24/75 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/0224 ,  H01L2224/0381 ,  H01L2224/0382 ,  H01L2224/03831 ,  H01L2224/0384 ,  H01L2224/08121 ,  H01L2224/08145 ,  H01L2224/74 ,  H01L2224/75251 ,  H01L2224/75272 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/80 ,  H01L2224/80003 ,  H01L2224/80006 ,  H01L2224/8001 ,  H01L2224/80011 ,  H01L2224/8002 ,  H01L2224/80047 ,  H01L2224/80051 ,  H01L2224/80093 ,  H01L2224/80099 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80203 ,  H01L2224/80209 ,  H01L2224/80213 ,  H01L2224/80801 ,  H01L2224/80894 ,  H01L2224/80907 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2221/68304

摘要： A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.

摘要翻译： 一种用于将第一衬底与第二衬底结合的方法，其特征在于，在所述接合之前所述第一衬底和/或所述第二衬底被薄化。