Semiconductor device having interconnection structure
    1.
    发明授权
    Semiconductor device having interconnection structure 失效
    具有互连结构的半导体器件

    公开(公告)号:US06765251B2

    公开(公告)日:2004-07-20

    申请号:US09227935

    申请日:1999-01-11

    IPC分类号: H01L27108

    摘要: In the semiconductor device, in order to meet the demand of reduced diameter of a contact hole along with the miniaturization of the semiconductor device, an anti-HF side wall film which is not etched by a hydrofluoric acid, formed of an isolating film such as nitride film, is provided on the side wall of contact hole. Further, a second impurity region which is connected to one of the pair of n type source/drain regions and a first impurity region reaching a p type isolation region are provided in silicon substrate 1 near the lower end of contact hole. Because of this structure, it becomes possible to prevent expansion of the diameter for forming the interconnection layer, as desired in the miniaturized semiconductor device, and therefore a semiconductor device and manufacturing method thereof which stabilize operation characteristic of the semiconductor device can be provided.

    摘要翻译: 在半导体装置中,为了满足半导体装置的小型化使接触孔的直径减小的要求,没有被氢氟酸腐蚀的抗HF侧壁膜由隔离膜形成,例如 氮化物膜设置在接触孔的侧壁上。 此外,在接触孔下端附近的硅衬底1中设置有连接到一对n型源极/漏极区域中的一个和到达p型隔离区域的第一杂质区域的第二杂质区域。 由于这种结构,可以根据小型半导体器件的需要防止用于形成互连层的直径的膨胀,因此可以提供稳定半导体器件的操作特性的半导体器件及其制造方法。

    Manufacturing method of semiconductor memory device
    3.
    发明授权
    Manufacturing method of semiconductor memory device 有权
    半导体存储器件的制造方法

    公开(公告)号:US08105907B2

    公开(公告)日:2012-01-31

    申请号:US12696695

    申请日:2010-01-29

    IPC分类号: H01L21/336

    摘要: To provide a manufacturing method of a semiconductor memory device, the method including forming contact plugs to be connected to a drain region or a source region of each of transistors, by using a SAC line technique of selectively etching an insulation layer that covers each of the transistors by using a mask having a line-shaped opening provided across the contact plugs. Each of the transistors constituting a sense amplifier that amplifies a potential difference between bit lines is a ring-gate transistor.

    摘要翻译: 为了提供一种半导体存储器件的制造方法,该方法包括通过使用选择性蚀刻绝缘层的SAC线技术来形成要连接到每个晶体管的漏极区域或源极区域的接触插塞, 晶体管通过使用设置在接触插塞两端的具有线状开口的掩模。 构成放大位线之间的电位差的读出放大器的晶体管的每一个都是环形栅极晶体管。

    Method of manufacturing nonvolatile semiconductor device
    4.
    发明授权
    Method of manufacturing nonvolatile semiconductor device 有权
    非易失性半导体器件的制造方法

    公开(公告)号:US08669172B2

    公开(公告)日:2014-03-11

    申请号:US13488015

    申请日:2012-06-04

    IPC分类号: H01L21/3205 H01L21/4763

    摘要: A semiconductor substrate having a main surface, first and second floating gates formed spaced apart from each other on the main surface of the semiconductor substrate, first and second control gates respectively located on the first and second floating gates, a first insulation film formed on the first control gate, a second insulation film formed on the second control gate to contact the first insulation film, and a gap portion formed at least between the first floating gate and the second floating gate by achieving contact between the first insulation film and the second insulation film are included. With this, a function of a nonvolatile semiconductor device can be ensured and a variation in a threshold voltage of a floating gate can be suppressed.

    摘要翻译: 一种具有主表面的半导体衬底,在半导体衬底的主表面上彼此隔开形成的第一和第二浮置栅极,分别位于第一和第二浮置栅极上的第一和第二控制栅极,形成在第一和第二浮置栅极上的第一绝缘膜 第一控制栅极,形成在第二控制栅极上以与第一绝缘膜接触的第二绝缘膜,以及通过实现第一绝缘膜和第二绝缘体之间的接触而形成在至少在第一浮栅和第二浮栅之间的间隙部分 包括电影。 由此,可以确保非易失性半导体器件的功能,并且可以抑制浮动栅极的阈值电压的变化。

    Semiconductor device fuse box with fuses of uniform depth
    5.
    发明授权
    Semiconductor device fuse box with fuses of uniform depth 失效
    具有均匀深度的保险丝的半导体器件保险丝盒

    公开(公告)号:US06531757B2

    公开(公告)日:2003-03-11

    申请号:US09993954

    申请日:2001-11-27

    申请人: Shigeru Shiratake

    发明人: Shigeru Shiratake

    IPC分类号: H01L2900

    摘要: A semiconductor device with a fuse box includes at least two gate electrodes 8, 9 and a fuse member 6. The two gate electrodes 8, 9 are formed on at least one insulating film 13 on a semiconductor substrate 100. The fuse member 6 is formed on the insulating film 13 on the semiconductor substrate 100. The two gate electrodes 8, 9 are electrically connected each other by the fuse member 6. In addition, the insulating film 13 and a field region 2 constituted by a semiconductor region are arranged adjacent to each other in a frame-like guard ring 1. The guard ring 1 is constituted by a semiconductor region formed on the semiconductor substrate 100.

    摘要翻译: 具有保险丝盒的半导体器件包括至少两个栅极电极8,9和熔丝部件6.两个栅极电极8,9形成在半导体衬底100上的至少一个绝缘膜13上。熔丝部件6形成 在半导体衬底100上的绝缘膜13上。两个栅极电极8,9通过熔丝部件6彼此电连接。此外,绝缘膜13和由半导体区域构成的场区域2被布置成邻近 保护环1由形成在半导体基板100上的半导体区域构成。

    Semiconductor device having triple diffusion
    6.
    发明授权
    Semiconductor device having triple diffusion 失效
    具有三重扩散的半导体器件

    公开(公告)号:US5623154A

    公开(公告)日:1997-04-22

    申请号:US477697

    申请日:1995-06-07

    CPC分类号: H01L29/0638 H01L29/7833

    摘要: An isolating/insulating film is formed on the surface of a p.sup.- silicon substrate in an element isolating region. An nMOS transistor having a pair of n-type source/drain regions is formed within an element forming region isolated by the isolating oxide film. A p.sup.+ impurity diffusion region is formed on the p.sup.- silicon substrate in such a manner as to be contacted with the lower surface of the isolating oxide film in the element isolating region and to extend at a specified depth from the surface of the p.sup.- silicon substrate in the element forming region. A p-type impurity diffusion region having a p-type impurity concentration higher than that of the p.sup.- silicon substrate is formed at the side end portion of the isolating oxide film in such a manner as to be contacted with the n-type source/drain region. With this arrangement, it is possible to reduce leakage current caused by the distribution of crystal defects in a depletion layer.

    摘要翻译: 在元件隔离区域中的p-硅衬底的表面上形成隔离/绝缘膜。 在由隔离氧化膜隔离的元件形成区域内形成具有一对n型源极/漏极区域的nMOS晶体管。 在p-硅衬底上形成p +杂质扩散区,以便与元件隔离区中的隔离氧化膜的下表面接触,并在p硅表面的特定深度延伸 基板在元件形成区域中。 在隔离氧化膜的侧端部形成p型杂质浓度高于p硅衬底的p型杂质浓度区域,以与n型源极/ 漏区。 通过这种布置,可以减少由耗尽层中的晶体缺陷的分布引起的漏电流。

    Method for manufacturing semiconductor device
    7.
    发明申请
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US20070096204A1

    公开(公告)日:2007-05-03

    申请号:US11581346

    申请日:2006-10-17

    申请人: Shigeru Shiratake

    发明人: Shigeru Shiratake

    IPC分类号: H01L21/336 H01L29/94

    摘要: A method for manufacturing a semiconductor device whereby the process is simplified and high performance can be obtained in both a trench-gate transistor and a planar transistor that has a thin gate insulating film when the two transistors are formed on the same semiconductor substrate. In a state in which the gate insulating film (11s) in a peripheral circuit region PE is covered by a protective film (12), a gate trench (18) is formed in a memory cell region M, after which a gate insulating film (19) that is thicker than the gate insulating film (11s) is formed on an inner wall of the gate trench (18) in a state in which the gate insulating film (11s) of the peripheral circuit region PE is still covered by the protective film (12).

    摘要翻译: 一种制造半导体器件的方法,其中当两个晶体管形成在同一半导体衬底上时,在沟槽栅极晶体管和具有薄栅绝缘膜的平面晶体管中,简化了工艺并获得了高性能。 在外围电路区域PE中的栅极绝缘膜(11s)被保护膜(12)覆盖的状态下,在存储单元区域M中形成栅极沟槽(18),然后形成栅极绝缘膜 在外围电路区域PE的栅极绝缘膜(11s)仍然被覆盖的状态下,在栅极沟槽(18)的内壁上形成比栅极绝缘膜(11s)厚的栅极(19) 通过保护膜(12)。

    Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device
    8.
    发明申请
    Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device 有权
    非易失性半导体器件及制造非易失性半导体器件的方法

    公开(公告)号:US20060231884A1

    公开(公告)日:2006-10-19

    申请号:US11402972

    申请日:2006-04-13

    IPC分类号: H01L29/76 H01L21/336

    摘要: A semiconductor substrate having a main surface, first and second floating gates formed spaced apart from each other on the main surface of the semiconductor substrate, first and second control gates respectively located on the first and second floating gates, a first insulation film formed on the first control gate, a second insulation film formed on the second control gate to contact the first insulation film, and a gap portion formed at least between the first floating gate and the second floating gate by achieving contact between the first insulation film and the second insulation film are included. With this, a function of a nonvolatile semiconductor device can be ensured and a variation in a threshold voltage of a floating gate can be suppressed.

    摘要翻译: 一种具有主表面的半导体衬底,在半导体衬底的主表面上彼此隔开形成的第一和第二浮置栅极,分别位于第一和第二浮置栅极上的第一和第二控制栅极,形成在第一和第二浮置栅极上的第一绝缘膜 第一控制栅极,形成在第二控制栅极上以与第一绝缘膜接触的第二绝缘膜,以及通过实现第一绝缘膜和第二绝缘体之间的接触而形成在第一浮动栅极和第二浮动栅极之间的间隙部分 包括电影。 由此,可以确保非易失性半导体器件的功能,并且可以抑制浮动栅极的阈值电压的变化。

    Semiconductor device having memory cell portion and manufacturing method thereof
    9.
    发明授权
    Semiconductor device having memory cell portion and manufacturing method thereof 失效
    具有存储单元部分的半导体器件及其制造方法

    公开(公告)号:US06864546B2

    公开(公告)日:2005-03-08

    申请号:US10699890

    申请日:2003-11-04

    摘要: A semiconductor device having a memory cell portion and a peripheral circuit portion is provided which achieves suppression of reduction of punch-through margin of transistors in the peripheral circuit portion and offers ensured short margin and enhanced current driving capability. After a high-temperature (800° C. to 1000° C.) thermal treatment that is performed to improve burying characteristics after formation of an interlayer insulating film, and also after a high-temperature (800° C. to 1000° C.) thermal treatment that is performed to enhance refresh characteristics after formation of contact plugs in the memory cell portion, a silicon oxide film and insulating film formed on a semiconductor substrate in the peripheral circuit portion are removed by anisotropic dry-etching, leaving the insulating film as sidewall insulating films on sides of sidewall nitride films. Then an impurity ion implantation process is performed using gate interconnections as implant masks to form source/drain regions in the peripheral circuit portion.

    摘要翻译: 提供了具有存储单元部分和外围电路部分的半导体器件,其实现了抑制外围电路部分中的晶体管的穿通余量的减小,并提供了确保的短边和增强的电流驱动能力。 在高温(800℃〜1000℃)的热处理之后,为了提高层间绝缘膜形成后的埋藏特性,以及高温(800℃〜1000℃) )通过各向异性干蚀刻除去在存储单元部分中形成接触插塞之后形成接触插塞,形成在外围电路部分中的半导体衬底上的氧化硅膜和绝缘膜上的刷新特性的热处理,留下绝缘膜 作为侧壁氮化物膜侧壁上的侧壁绝缘膜。 然后使用栅极互连作为注入掩模来执行杂质离子注入工艺,以在外围电路部分中形成源/漏区。

    Ion implanter and controlling method therefor
    10.
    发明授权
    Ion implanter and controlling method therefor 失效
    离子注入机及其控制方法

    公开(公告)号:US5293508A

    公开(公告)日:1994-03-08

    申请号:US865275

    申请日:1992-04-08

    摘要: An ion implanter encloses a semiconductor substrate adjacent to a fixing member which retains a semiconductor substrate on a supporting bed. The ion implanter includes a ring electrode for generating secondary electrons in response to incident ions and a cup-like electrode for directing the secondary ions to the semiconductor substrate. The ring electrode is negatively biased with respect to the supporting bed and the cup-like electrode surrounds the outer edge of the semiconductor substrate. The ion implanter increases the quantity of the secondary electrons produced and efficiently directs them to the semiconductor substrate. The semiconductor substrate which is electrically charged by implanting ions is neutralized, preventing dielectric breakdown from occurring in an insulating film.

    摘要翻译: 离子注入机包围与固定部件相邻的半导体衬底,该固定部件将半导体衬底保持在支撑床上。 离子注入机包括用于响应于入射离子产生二次电子的环形电极和用于将二次离子引导到半导体衬底的杯形电极。 环状电极相对于支撑床呈负偏置,杯形​​电极围绕半导体衬底的外边缘。 离子注入机增加产生的二次电子的量并有效地将它们引导到半导体衬底。 通过注入离子而带电的半导体衬底被中和,防止在绝缘膜中发生电介质击穿。